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  • China - 简体中文
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  • Korea - 한국어
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  • Products
    • DESIGN EXCELLENCE
      • Digital Design and Signoff
        • PRODUCT CATEGORIES
          • Logic Equivalence Checking
          • SoC Implementation and Floorplanning
          • Functional ECO
          • Low-Power Validation
          • Synthesis
          • Power Analysis
          • Constraints and CDC Signoff
          • Silicon Signoff and Verification
          • Library Characterization
          • Test
        • FEATURED PRODUCTS
          • Integrity 3D-IC Platform
          • Cadence Cerebrus Intelligent Chip Explorer
          • Genus Synthesis Solution
          • Innovus Implementation System
          • Tempus Timing Signoff Solution
          • Voltus IC Power Integrity Solution
          • Pegasus Verification System
          • RESOURCES
          • Flows
      • Custom IC / Analog / RF Design
        • PRODUCT CATEGORIES
          • Circuit Design
          • Circuit Simulation
          • Layout Design
          • Layout Verification
          • Library Characterization
          • RF / Microwave Solutions
        • FEATURED PRODUCTS
          • Spectre X Simulator
          • Spectre FX Simulator
          • Virtuoso Layout Suite
          • Virtuoso ADE Product Suite
          • Virtuoso Advanced Node
          • Voltus-Fi Custom Power Integrity Solution
          • RESOURCES
          • Flows
      • Verification
        • PRODUCT CATEGORIES
          • Debug Analysis
          • Virtual Prototyping
          • Emulation and Prototyping
          • Static and Formal Verification
          • Planning and Management
          • Simulation
          • Software-Driven Verification
          • Verification IP
          • System-Level Verification IP
        • FEATURED PRODUCTS
          • vManager Verification Management
          • Jasper C Apps
          • Helium Virtual and Hybrid Studio
          • Xcelium Logic Simulation
          • Palladium Enterprise Emulation
          • Protium Enterprise Prototyping
          • System VIP
          • RESOURCES
          • Flows
      • IP
        • PRODUCT CATEGORIES
          • 112G/56G SerDes
          • Chiplet and D2D
          • Denali Memory Interface and Storage IP
          • Interface IP
          • PCIe and CXL
          • Tensilica Processor IP
        • RESOURCES
          • Discover PCIe
      • IC Package Design and Analysis
        • PRODUCT CATEGORIES
          • Cross-Platform Co-Design and Analysis
          • IC Package Design
          • SI/PI Analysis
          • SI/PI Analysis Point Tools
          • Flows
    • SYSTEM INNOVATION
      • Multiphysics System Analysis
        • PRODUCT CATEGORIES
          • Computational Fluid Dynamics
          • Electromagnetic Solutions
          • RF / Microwave Design
          • Signal and Power Integrity
          • Thermal Solutions
        • FEATURED PRODUCTS
          • Clarity 3D Solver
          • Clarity 3D Solver Cloud
          • Clarity 3D Transient Solver
          • Celsius Thermal Solver
          • Fidelity CFD
          • Sigrity Advanced SI
          • Celsius Advanced PTI
          • RESOURCES
          • System Analysis Center
          • System Analysis Resources Hub
          • AWR Free Trial
      • Embedded Software
      • PCB Design and Analysis
        • PRODUCT CATEGORIES
          • Design Authoring
          • PCB Layout
          • Library and Design Data Management
          • Analog/Mixed-Signal Simulation
          • SI/PI Analysis
          • SI/PI Analysis Point Tools
          • RF / Microwave Design
          • Augmented Reality Lab Tools
        • FEATURED PRODUCTS
          • Allegro Package Designer Plus
          • Allegro PCB Designer
          • Allegro X Design Platform
          • RESOURCES
          • What's New in Allegro
          • Advanced PCB Design & Analysis Resources Hub
          • Flows
      • Computational Fluid Dynamics
    • PERVASIVE INTELLIGENCE
      • AI / Machine Learning
      • AI IP Portfolio
    • CADENCE CLOUD
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        • Arm-Based Solutions
        • Cloud Solutions
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        • Low Power
        • Mixed Signal
        • Photonics
        • RF / Microwave
      • Industries
        • 5G Systems and Subsystems
        • Aerospace and Defense
        • Automotive
        • Hyperscale Computing
      • Technologies
        • 3D-IC Design
        • Advanced Node
        • AI / Machine Learning
        • Arm-Based Solutions
        • Cloud Solutions
        • Computational Fluid Dynamics
        • Functional Safety
        • Low Power
        • Mixed Signal
        • Photonics
        • RF / Microwave
      • Industries
        • 5G Systems and Subsystems
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        • Automotive
        • Hyperscale Computing
      • Technologies
        • 3D-IC Design
        • Advanced Node
        • AI / Machine Learning
        • Arm-Based Solutions
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        • Computational Fluid Dynamics
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        • Low Power
        • Mixed Signal
        • Photonics
        • RF / Microwave
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Process Variation Modeling

  • Liberate Trio Characterization Suite
  • Characterization
  • Process Variation Modeling
  • Library Validation

Key Benefits

  • Creates variation-aware timing models that account for both systemic and random process variations
  • Local and global process variation
  • Generates AOCV/SOCV tables and LVF

The Cadence® Liberate™ Trio Characterization Suite provides an ultra-fast standard-cell characterizer of process variation-aware timing models. It can generate libraries that can be used with multiple SSTAs without requiring re-characterization for each unique format. The Liberate Trio suite can generate advanced on-chip variation (AOCV) tables, statistical on-chip variation (SOCV) tables, and Liberty Variation Format (LVF)

It can also calculate non-linear sensitivity, accounting for systematic and random variation for any set of correlated or uncorrelated process parameters. The resulting libraries can be used to model both local (within-cell and within-die) variations and global die-to-die variations.

This features is also offered as a standalone option.

Liberate Trio Characterization Suite Flow
The Liberate Trio suite flow with multiple clients demonstrating parallel characterization

TRAINING COURSES

Hear how the cloud-optimized Liberate Trio Characterization Suite provides characterization, process variation modeling, and validation for improved throughput and productivity.

  • Related Pages

    • Liberate MX Memory Characterization
    • Liberate AMS Mixed-Signal Characterization
Resource Library

Press Releases (5)

  • Cadence Achieves EDA Certification for TSMC 5nm and 7nm+ FinFET Process Technologies to Facilitate Mobile and HPC Design Creation | Cadence
  • Cadence Collaborates with TSMC to Advance 5nm and 7nm+ Mobile and HPC Design Innovation | Cadence
  • Cadence Achieves TÜV SÜD’s First Comprehensive “Fit for Purpose - TCL1” Certification in Support of Automotive ISO 26262 Standard | Cadence
  • Cadence Tools and Flows Achieve Production-Ready Certification for TSMC’s 12FFC Process | Cadence
  • Cadence Custom/Analog and Full-Flow Digital and Signoff Tools Enabled for GLOBALFOUNDRIES 7LP Process Node | Cadence

Success Story Video (3)

  • Invecas Provides Electromigration-Based Maximum Capacitance Limits for Standard Cell Library Using Cadence Virtuoso Liberate Characterization Solution
  • Characterizing 22FDX Library at GLOBALFOUNDRIES
  • Faster Timing Characterization of Analog Macros

Video (5)

  • Invecas Provides Electromigration-Based Maximum Capacitance Limits for Standard Cell Library Using Cadence Virtuoso Liberate Characterization Solution
  • Characterizing 22FDX Library at GLOBALFOUNDRIES
  • Faster Timing Characterization of Analog Macros
  • Accurate and Faster SoC Signoff with Simulation-Based AMS Characterization
  • Statistical Characterization Approach Using Liberate MX with 40nm Low Voltage SRAM
VIEW ALL
Videos

Getting What You’re Entitled to at 10nm by Reducing Timing Pessimism

Characterizing 22FDX Library at GLOBALFOUNDRIES

Faster Timing Characterization of Analog Macros

Liberate MX Product Demonstration

Accurate and Faster SoC Signoff with Simulation-Based AMS Characterization

Statistical Characterization Approach Using Liberate MX with 40nm Low Voltage SRAM

News ReleasesVIEW ALL
  • M31 Speeds Delivery of Silicon IP by 5X Using the Cadence Library Characterization Solution in the Cloud 03/30/2022

  • Samsung Foundry Adopts Cadence Liberate Trio Characterization Suite for 3nm Production Library 11/16/2021

  • Samsung Foundry Adopts New Tempus SPICE-Accurate Aging Analysis for High-Reliability Applications 11/16/2021

  • Cadence and UMC Collaborate on 22ULP/ULL Reference Flow Certification for Advanced Consumer, 5G and Automotive Designs 07/12/2021

  • Cadence Collaborates with TSMC to Accelerate 5nm FinFET Innovation, Enabling Next-Generation SoC Production Design 04/22/2019

Blogs VIEW ALL
Process Variation Modeling
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