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DESIGN EXCELLENCE

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CADENCE CLOUD

Digital Design and Signoff

Cadence® digital design and signoff solutions provide a fast path to design closure and better predictability, helping you meet your power, performance, and area (PPA) targets.

  • Logic Equivalence Checking
  • Innovus Implementation and Floorplanning
  • Functional ECO
  • Low-Power Validation
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  • Achieve best PPA with the next-generation Digital Full Flow solution Learn More
  • Address digital implementation challenges with machine learning Watch Now

Custom IC / Analog / RF Design

Cadence® custom, analog, and RF design solutions can help you save time by automating many routine tasks, from block-level and mixed-signal simulation to routing and library characterization.

  • Circuit Design
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  • Solve analog simulation challenges in complex designs Watch Now
  • See how the Virtuoso Design Platform addresses advanced custom IC and system design challenges Watch Now

System Design and Verification

Cadence® system design and verification solutions, integrated under our Verification Suite, provide the simulation, acceleration, emulation, and management capabilities.

  • Debug Analysis
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  • Planning and Management
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  • Verification IP
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  • Prototype your embedded software development Watch Now
  • Learn how early firmware development enabled first silicon success at Toshiba Memory Watch Now

IP

An open IP platform for you to customize your app-driven SoC design.

  • Interface IP
  • Denali Memory IP
  • Tensilica Processor IP
  • Analog IP
  • System / Peripherals IP
  • Verification IP
  • Solve the challenges of long-reach signaling with Cadence 112G SerDes IP Watch Now
  • Meeting the needs of 5G communication with Tensilica® ConnX B20 DSP IP Download Now

IC Package Design and Analysis

Driving efficiency and accuracy in advanced packaging, system planning, and multi-fabric interoperability, Cadence® package implementation products deliver the automation and accuracy.

  • Cross-Platform Co-Design and Analysis
  • IC Package Design
  • SI/PI Analysis
  • SI/PI Analysis Point Tools
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  • Cadence Design Solutions certified for TSMC SoIC advanced 3D chip stacking technology Learn More
  • Four reasons to avoid multi-layer flip-chip pin padstacks Learn More

System Analysis

Cadence® system analysis solutions provide highly accurate electromagnetic extraction and simulation analysis to ensure your system works under wide-ranging operating conditions.

  • See how to improve electrical-thermal co-simulation with the Celsius™ Thermal Solver Watch Now
  • Get true 3D system analysis with faster speeds, more capacity, and integration Watch Now
  • Electromagnetic Solutions
  • RF / Microwave Design
  • Thermal Solutions
  • System Analysis Resources Hub

Embedded Software

PCB Design and Analysis

Cadence® PCB design solutions enable shorter, more predictable design cycles with greater integration of component design and system-level simulation for a constraint-driven flow.

  • Design Authoring
  • PCB Layout
  • Library and Design Data Management
  • Analog/Mixed-Signal Simulation
  • SI/PI Analysis
  • SI/PI Analysis Point Tools
  • What's New in Allegro
  • What's New in Sigrity
  • RF / Microwave Design
  • Flows
  • Advanced PCB Design & Analysis Blog
  • Watch how to easily tackle complex and cutting edge designs. Learn More
  • Learn why signal integrity analysis needs to be power-aware Watch Now
  • Augmented Reality Lab Tools

AI / Machine Learning

AI IP Portfolio

INDUSTRIES

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TECHNOLOGIES

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See how our customers create innovative products with Cadence Explore Now

SUPPORT

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TRAINING

  • Custom IC / Analog / RF Design
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View all Products
  • PRODUCTS
    • DESIGN EXCELLENCE
      • Digital Design and Signoff
        • Logic Equivalence Checking
        • Innovus Implementation and Floorplanning
        • Functional ECO
        • Low-Power Validation
        • Synthesis
        • Power Analysis
        • Constraints and CDC Signoff
        • Silicon Signoff and Verification
        • Library Characterization
        • Test
        • Flows
      • Custom IC / Analog / RF Design
        • Circuit Design
        • Circuit Simulation
        • Layout Design
        • Layout Verification
        • Library Characterization
        • RF / Microwave Solutions
        • Flows
      • System Design and Verification
        • Debug Analysis
        • Emulation
        • Formal and Static Verification
        • FPGA-Based Prototyping
        • Planning and Management
        • Simulation
        • Software-Driven Verification
        • Verification IP
        • System-Level Verification IP
        • Flows
      • IP
        • Interface IP
        • Denali Memory IP
        • Tensilica Processor IP
        • Analog IP
        • System / Peripherals IP
        • Verification IP
      • IC Package Design and Analysis
        • Cross-Platform Co-Design and Analysis
        • IC Package Design
        • SI/PI Analysis
        • SI/PI Analysis Point Tools
        • Flows
    • SYSTEM INNOVATION
      • System Analysis
        • Electromagnetic Solutions
        • RF / Microwave Design
        • Thermal Solutions
        • System Analysis Resources Hub
      • Embedded Software
      • PCB Design and Analysis
        • Design Authoring
        • PCB Layout
        • Library and Design Data Management
        • Analog/Mixed-Signal Simulation
        • SI/PI Analysis
        • SI/PI Analysis Point Tools
        • What's New in Allegro
        • What's New in Sigrity
        • RF / Microwave Design
        • Flows
        • Advanced PCB Design & Analysis Blog
        • Augmented Reality Lab Tools
    • PERVASIVE INTELLIGENCE
      • AI / Machine Learning
      • AI IP Portfolio
    • CADENCE CLOUD
  • SOLUTIONS
      • INDUSTRIES
        • 5G Systems and Subsystems
        • Aerospace and Defense
        • Automotive
        • AI / Machine Learning
      • TECHNOLOGIES
        • 3D-IC Design
        • Advanced Node
        • Arm-Based Solutions
        • Cloud Solutions
        • Low Power
        • Mixed Signal
        • Photonics
        • RF / Microwave
      • INDUSTRIES
        • 5G Systems and Subsystems
        • Aerospace and Defense
        • Automotive
        • AI / Machine Learning
      • TECHNOLOGIES
        • 3D-IC Design
        • Advanced Node
        • Arm-Based Solutions
        • Cloud Solutions
        • Low Power
        • Mixed Signal
        • Photonics
        • RF / Microwave
      • INDUSTRIES
        • 5G Systems and Subsystems
        • Aerospace and Defense
        • Automotive
        • AI / Machine Learning
      • TECHNOLOGIES
        • 3D-IC Design
        • Advanced Node
        • Arm-Based Solutions
        • Cloud Solutions
        • Low Power
        • Mixed Signal
        • Photonics
        • RF / Microwave
      • INDUSTRIES
        • 5G Systems and Subsystems
        • Aerospace and Defense
        • Automotive
        • AI / Machine Learning
      • TECHNOLOGIES
        • 3D-IC Design
        • Advanced Node
        • Arm-Based Solutions
        • Cloud Solutions
        • Low Power
        • Mixed Signal
        • Photonics
        • RF / Microwave
  • SUPPORT
      • SUPPORT
        • Support Process
        • Online Support
        • Software Downloads
        • Computing Platform Support
        • Customer Support Contacts
        • Technical Forums
      • TRAINING
        • Custom IC / Analog / RF Design
        • Languages and Methodologies
        • Digital Design and Signoff
        • IC Package
        • PCB Design
        • System Design and Verification
        • Tensilica Processor IP
      • SUPPORT
        • Support Process
        • Online Support
        • Software Downloads
        • Computing Platform Support
        • Customer Support Contacts
        • Technical Forums
      • TRAINING
        • Custom IC / Analog / RF Design
        • Languages and Methodologies
        • Digital Design and Signoff
        • IC Package
        • PCB Design
        • System Design and Verification
        • Tensilica Processor IP
      • SUPPORT
        • Support Process
        • Online Support
        • Software Downloads
        • Computing Platform Support
        • Customer Support Contacts
        • Technical Forums
      • TRAINING
        • Custom IC / Analog / RF Design
        • Languages and Methodologies
        • Digital Design and Signoff
        • IC Package
        • PCB Design
        • System Design and Verification
        • Tensilica Processor IP
      • SUPPORT
        • Support Process
        • Online Support
        • Software Downloads
        • Computing Platform Support
        • Customer Support Contacts
        • Technical Forums
      • TRAINING
        • Custom IC / Analog / RF Design
        • Languages and Methodologies
        • Digital Design and Signoff
        • IC Package
        • PCB Design
        • System Design and Verification
        • Tensilica Processor IP
  • COMPANY
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      • CULTURE AND CAREERS
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      • CORPORATE
        • About Us
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        • Investor Relations
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      • MEDIA CENTER
        • Events
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      • CULTURE AND CAREERS
        • Culture and Diversity
        • Careers
      • CORPORATE
        • About Us
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        • Investor Relations
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Legato Reliability Solution

Industry’s first complete analog IC design for reliability solution

Read Datasheet Read White Paper
  • Legato Reliability Solution
  • Analog Defect
  • Electrothermal
  • Advanced Aging

Key Benefits

  • Improves test coverage of manufacturing test using analog defect simulation
  • Advanced aging analysis better predicts device operating lifetime 
  • Performs dynamic electrothermal simulation of design to prevent thermal overstress during operation
  • Analog defect simulation is integrated into the Spectre AMS Designer to enable simulation of mixed-signal design 
  • Based on Virtuoso custom IC design platform and Spectre Accelerated Parallel Simulator (APS) for fast, easy adoption

One of the most difficult challenges in analog IC design is the increased pressure to make sure mission-critical devices in applications like automotive, medical, industrial, and military/aerospace perform longer and more reliably in any condition or environment. Without a solid solution to solve these design challenges, the cost of failure can be very high and even life-threatening.

The Cadence® Legato™ Reliability Solution combines best-in-class Virtuoso® and Spectre® technologies to overcome design roadblocks and avoid failures in the field due to analog faults, device aging, electromigration, process variation, and thermal and packaging effects. The solution provides a confident design pathway to:

  • Safety through simulation tools to detect failure and analysis of failure recovery for safety mechanisms
  • Reliability with advanced degradation models enabling more accurate predictive device aging over time due to internal device and environmental pressures
  • Quality to target 0 DPPM using automated defect identification tests to analyze results through the Spectre® Circuit Simulation Platform

Increased design complexity amplifies challenges. The Legato Reliability solution helps designers avoid these field failures and enables customers to achieve ISO 26262 certification through:

  • Analog Defect Analysis: To reduce test cost and eliminates test escapes
  • Electrothermal Analysis: To prevent thermal overstress and avoid premature failures
  • Advanced Aging Analysis: To accurately predict product wear-out

Contact Us

TRAINING COURSES

Learn how Legato Reliability Solutions technologies for analog defect analysis, advanced aging analysis, and electro-thermal simulation can help you meet the challenges of designing for mission-critical applications.

  • Related Products

    • Circuit Simulation
    • Spectre AMS Designer
    • Automotive Solutions
    • Virtuoso ADE Product Suite
    • Spectre Accelerated Parallel Simulator
Videos

Legato analog fault simulation for safety coverage: a case-study

Mitigating Reliability Failures Over the Product Lifespan

Designing High-Reliability Analog and Mixed-Signal ICs for Mission-Critical Applications

How to Meet the Quality, High Reliability, and Safety Requirements for Analog and Mixed-Signal ICs in Mission-Critical Applications

Analog Defect Simulation and Analysis for Complex Systems

Improvements in Modeling Device Aging Analysis: Extending Product Lifetime

Easily Adopt Electro-thermal Simulation for Your High-Reliability Analog Designs

Automotive System Trends and the Integration of Analog Electronic Dependability

News ReleasesVIEW ALL
  • Cadence to Acquire AWR Corporation from National Instruments to Accelerate System Innovation for 5G RF Communications 12/02/2019

  • Cadence Automotive Reference Flow Certified by Samsung Foundry for Advanced-Node Design Creation 10/17/2019

  • Cadence Introduces the Spectre X Simulator, a Massively Parallel Circuit Simulator Delivering Up to 10X Faster Simulation with the Same Golden Accuracy 06/03/2019

  • Cadence Debuts Industry’s First Analog IC Design-for-Reliability Solution 05/08/2018

  • Cadence Expands Virtuoso Platform with Enhanced System Design, Advanced Node Support down to 5nm, and Simulation-Driven Layout 04/10/2018

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