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Digital Design and Signoff

Cadence® digital design and signoff solutions provide a fast path to design closure and better predictability, helping you meet your power, performance, and area (PPA) targets.

PRODUCT CATEGORIES

  • Logic Equivalence Checking
  • SoC Implementation and Floorplanning
  • Functional ECO
  • Low-Power Validation
  • Synthesis
  • Power Analysis
  • Constraints and CDC Signoff
  • Silicon Signoff and Verification
  • Library Characterization
  • Test

FEATURED PRODUCTS

  • Integrity 3D-IC Platform
  • Cadence Cerebrus Intelligent Chip Explorer
  • Genus Synthesis Solution
  • Innovus Implementation System
  • Tempus Timing Signoff Solution
  • Voltus IC Power Integrity Solution
  • Pegasus Verification System
  • RESOURCES
  • Flows

Custom IC / Analog / RF Design

Cadence® custom, analog, and RF design solutions can help you save time by automating many routine tasks, from block-level and mixed-signal simulation to routing and library characterization.

PRODUCT CATEGORIES

  • Circuit Design
  • Circuit Simulation
  • Layout Design
  • Layout Verification
  • Library Characterization
  • RF / Microwave Solutions

FEATURED PRODUCTS

  • Spectre X Simulator
  • Spectre FX Simulator
  • Virtuoso Layout Suite
  • Virtuoso ADE Product Suite
  • Virtuoso Advanced Node
  • Voltus-Fi Custom Power Integrity Solution
  • RESOURCES
  • Flows

Verification

Offering a full verification flow to our customers and partners that delivers the highest verification throughput in the industry

PRODUCT CATEGORIES

  • Debug Analysis
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  • Planning and Management
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  • Verification IP
  • System-Level Verification IP

FEATURED PRODUCTS

  • vManager Verification Management
  • Jasper C Apps
  • Helium Virtual and Hybrid Studio
  • Xcelium Logic Simulation
  • Palladium Enterprise Emulation
  • Protium Enterprise Prototyping
  • System VIP
  • RESOURCES
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IP

An open IP platform for you to customize your app-driven SoC design.

PRODUCT CATEGORIES

  • 112G/56G SerDes
  • Chiplet and D2D
  • Denali Memory Interface and Storage IP
  • Interface IP
  • PCIe and CXL
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RESOURCES

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IC Package Design and Analysis

Driving efficiency and accuracy in advanced packaging, system planning, and multi-fabric interoperability, Cadence® package implementation products deliver the automation and accuracy.

PRODUCT CATEGORIES

  • Cross-Platform Co-Design and Analysis
  • IC Package Design
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Multiphysics System Analysis

Cadence® system analysis solutions provide highly accurate electromagnetic extraction and simulation analysis to ensure your system works under wide-ranging operating conditions.

PRODUCT CATEGORIES

  • Computational Fluid Dynamics
  • Electromagnetic Solutions
  • RF / Microwave Design
  • Signal and Power Integrity
  • Thermal Solutions

FEATURED PRODUCTS

  • Clarity 3D Solver
  • Clarity 3D Solver Cloud
  • Clarity 3D Transient Solver
  • Celsius Thermal Solver
  • Fidelity CFD
  • Sigrity Advanced SI
  • Celsius Advanced PTI
  • RESOURCES
  • System Analysis Center
  • System Analysis Resources Hub
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Embedded Software

PCB Design and Analysis

Cadence® PCB design solutions enable shorter, more predictable design cycles with greater integration of component design and system-level simulation for a constraint-driven flow.

PRODUCT CATEGORIES

  • Design Authoring
  • PCB Layout
  • Library and Design Data Management
  • Analog/Mixed-Signal Simulation
  • SI/PI Analysis
  • SI/PI Analysis Point Tools
  • RF / Microwave Design
  • Augmented Reality Lab Tools

FEATURED PRODUCTS

  • Allegro Package Designer Plus
  • Allegro PCB Designer
  • Allegro X Design Platform
  • RESOURCES
  • What's New in Allegro
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Computational Fluid Dynamics

AI / Machine Learning

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US - English
  • China - 简体中文
  • Japan - 日本語
  • Korea - 한국어
  • Taiwan - 繁體中文
  • Products
    • DESIGN EXCELLENCE
      • Digital Design and Signoff
        • PRODUCT CATEGORIES
          • Logic Equivalence Checking
          • SoC Implementation and Floorplanning
          • Functional ECO
          • Low-Power Validation
          • Synthesis
          • Power Analysis
          • Constraints and CDC Signoff
          • Silicon Signoff and Verification
          • Library Characterization
          • Test
        • FEATURED PRODUCTS
          • Integrity 3D-IC Platform
          • Cadence Cerebrus Intelligent Chip Explorer
          • Genus Synthesis Solution
          • Innovus Implementation System
          • Tempus Timing Signoff Solution
          • Voltus IC Power Integrity Solution
          • Pegasus Verification System
          • RESOURCES
          • Flows
      • Custom IC / Analog / RF Design
        • PRODUCT CATEGORIES
          • Circuit Design
          • Circuit Simulation
          • Layout Design
          • Layout Verification
          • Library Characterization
          • RF / Microwave Solutions
        • FEATURED PRODUCTS
          • Spectre X Simulator
          • Spectre FX Simulator
          • Virtuoso Layout Suite
          • Virtuoso ADE Product Suite
          • Virtuoso Advanced Node
          • Voltus-Fi Custom Power Integrity Solution
          • RESOURCES
          • Flows
      • Verification
        • PRODUCT CATEGORIES
          • Debug Analysis
          • Virtual Prototyping
          • Emulation and Prototyping
          • Static and Formal Verification
          • Planning and Management
          • Simulation
          • Software-Driven Verification
          • Verification IP
          • System-Level Verification IP
        • FEATURED PRODUCTS
          • vManager Verification Management
          • Jasper C Apps
          • Helium Virtual and Hybrid Studio
          • Xcelium Logic Simulation
          • Palladium Enterprise Emulation
          • Protium Enterprise Prototyping
          • System VIP
          • RESOURCES
          • Flows
      • IP
        • PRODUCT CATEGORIES
          • 112G/56G SerDes
          • Chiplet and D2D
          • Denali Memory Interface and Storage IP
          • Interface IP
          • PCIe and CXL
          • Tensilica Processor IP
        • RESOURCES
          • Discover PCIe
      • IC Package Design and Analysis
        • PRODUCT CATEGORIES
          • Cross-Platform Co-Design and Analysis
          • IC Package Design
          • SI/PI Analysis
          • SI/PI Analysis Point Tools
          • Flows
    • SYSTEM INNOVATION
      • Multiphysics System Analysis
        • PRODUCT CATEGORIES
          • Computational Fluid Dynamics
          • Electromagnetic Solutions
          • RF / Microwave Design
          • Signal and Power Integrity
          • Thermal Solutions
        • FEATURED PRODUCTS
          • Clarity 3D Solver
          • Clarity 3D Solver Cloud
          • Clarity 3D Transient Solver
          • Celsius Thermal Solver
          • Fidelity CFD
          • Sigrity Advanced SI
          • Celsius Advanced PTI
          • RESOURCES
          • System Analysis Center
          • System Analysis Resources Hub
          • AWR Free Trial
      • Embedded Software
      • PCB Design and Analysis
        • PRODUCT CATEGORIES
          • Design Authoring
          • PCB Layout
          • Library and Design Data Management
          • Analog/Mixed-Signal Simulation
          • SI/PI Analysis
          • SI/PI Analysis Point Tools
          • RF / Microwave Design
          • Augmented Reality Lab Tools
        • FEATURED PRODUCTS
          • Allegro Package Designer Plus
          • Allegro PCB Designer
          • Allegro X Design Platform
          • RESOURCES
          • What's New in Allegro
          • Advanced PCB Design & Analysis Resources Hub
          • Flows
      • Computational Fluid Dynamics
    • PERVASIVE INTELLIGENCE
      • AI / Machine Learning
      • AI IP Portfolio
    • CADENCE CLOUD
    • VIEW ALL PRODUCTS
  • Solutions
      • Industries
        • 5G Systems and Subsystems
        • Aerospace and Defense
        • Automotive
        • Hyperscale Computing
      • Technologies
        • 3D-IC Design
        • Advanced Node
        • AI / Machine Learning
        • Arm-Based Solutions
        • Cloud Solutions
        • Computational Fluid Dynamics
        • Functional Safety
        • Low Power
        • Mixed Signal
        • Photonics
        • RF / Microwave
      • Industries
        • 5G Systems and Subsystems
        • Aerospace and Defense
        • Automotive
        • Hyperscale Computing
      • Technologies
        • 3D-IC Design
        • Advanced Node
        • AI / Machine Learning
        • Arm-Based Solutions
        • Cloud Solutions
        • Computational Fluid Dynamics
        • Functional Safety
        • Low Power
        • Mixed Signal
        • Photonics
        • RF / Microwave
      • Industries
        • 5G Systems and Subsystems
        • Aerospace and Defense
        • Automotive
        • Hyperscale Computing
      • Technologies
        • 3D-IC Design
        • Advanced Node
        • AI / Machine Learning
        • Arm-Based Solutions
        • Cloud Solutions
        • Computational Fluid Dynamics
        • Functional Safety
        • Low Power
        • Mixed Signal
        • Photonics
        • RF / Microwave
  • Support
      • Support
        • Support Process
        • Online Support
        • Software Downloads
        • Computing Platform Support
        • Customer Support Contacts
        • Technical Forums
      • Training
        • Custom IC / Analog / RF Design
        • Languages and Methodologies
        • Digital Design and Signoff
        • IC Package
        • PCB Design
        • System Design and Verification
        • Tensilica Processor IP
      • Support
        • Support Process
        • Online Support
        • Software Downloads
        • Computing Platform Support
        • Customer Support Contacts
        • Technical Forums
      • Training
        • Custom IC / Analog / RF Design
        • Languages and Methodologies
        • Digital Design and Signoff
        • IC Package
        • PCB Design
        • System Design and Verification
        • Tensilica Processor IP
      • Support
        • Support Process
        • Online Support
        • Software Downloads
        • Computing Platform Support
        • Customer Support Contacts
        • Technical Forums
      • Training
        • Custom IC / Analog / RF Design
        • Languages and Methodologies
        • Digital Design and Signoff
        • IC Package
        • PCB Design
        • System Design and Verification
        • Tensilica Processor IP
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Cloud Passport

Gateway to the cloud

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  • Cloud Passport
  • Cloud Partners

Key Benefits

  • Easy access to cloud-ready Cadence software for customer-managed cloud environments
  • High-reliability license server maintains uptime
  • Can be combined with other Cadence Cloud offerings

For customers interested in establishing and maintaining their own cloud environment, Cadence offers the Cadence® Cloud Passport model. With the Cloud Passport, customers gain the contractual ability to place Cadence software in their own public cloud environment. Customers maintain ownership of their public cloud relationships and serve as the only point of contact with the public cloud vendor they have chosen to deploy within their company. Using this model, customer CAD and IT teams are solely responsible for the setup, maintenance, and support of their own public cloud environment. Current customers have used this model with several different public cloud vendors, including Amazon Web Services (AWS), Microsoft Azure, and Google Cloud Platform.

Cloud-Ready Tools

Cloud-ready tools include the Cadence software that has been qualified to run as expected on a compute cluster provisioned on the public cloud. The initial qualification process has focused on products that natively benefit from the massive scalability of the cloud. Current Cadence products that are cloud ready include tools for circuit simulation, power and EM analysis, logic simulation, formal verification, physical verification, timing signoff, extraction, power integrity, and library characterization. Additional tools will become available based on customer need.

Flexible Models

The Cloud Passport is suited for companies who have the means and expertise to manage their own cloud infrastructure internally. Additionally, the Cloud Passport can be combined with any other Cadence Cloud offering, so customers can subscribe both to the Cloud Passport model to run cloud-ready tools within their own public cloud environment and leverage the Cadence-managed Cloud-Hosted Design Solution or Palladium® Cloud solutions for specific peak or project needs.

Cloud Passport Partners

Moving to the cloud often requires new knowledge and capabilities that not every company possesses. The Cadence Cloud Passport Partner Program gives customers an easier path to the cloud by connecting them with knowledgeable service providers who are authorized to deploy Cadence tools in cloud environments. 

Want Details? Register for FAQ

Videos

The Cadence Cloud Portfolio

Cloud Computing for Electronic Design (Are We There Yet?)

Whiteboard Wednesdays - Passport Partners Program Expands Customer Cloud Deployment Options

An Introduction to Palladium Cloud

News ReleasesVIEW ALL
  • Cadence and Intel Foundry Services Collaborate to Accelerate Innovation with Scalable and Proven Cadence Cloud Solutions 06/28/2022

  • Cadence Extends Cloud Leadership with Transformational Cadence OnCloud SaaS and e‑Commerce Platform 06/08/2022

  • Cadence Collaborates with GlobalFoundries to Deliver Complete Digital Solution on Amazon Web Services 03/23/2022

  • Cadence Expands Collaboration with TSMC and Microsoft to Accelerate Timing Signoff for Giga-Scale Designs on the Cloud 12/01/2021

  • Cadence Wins Four 2021 TSMC OIP Partner of the Year Awards, Featuring Key Advancements in 3DFabric Design and Cloud-Based Solutions 11/12/2021

Blogs VIEW ALL
Customers

We successfully ran more than 500 million instances flat using the fully distributed Cadence Tempus Timing Signoff Solution on the CloudBurst platform via AWS to complete the tapeout of our latest TSMC 7nm networking chip. This would have been impossible to achieve in the required timeframe if we hadn’t deployed...

Dan Lenoski, chief development officer and co-founder, Barefoot Networks

This new offering [CloudBurst] from Cadence has met TSMC’s goal of the OIP VDE simplifying cloud adoption and demonstrated its ability to provide innovative service to our mutual customers with secure access to a simple-to-create, cloud-based environment that allows cloud bursting for peak needs…

Suk Lee, senior director of Design Infrastructure Management Division, TSMC

By utilizing the Cadence CloudBurst platform, customers can easily leverage the scale of Microsoft Azure in order to meet their peak capacity requirements thereby speeding up the time-to-market for their complex designs.

Rani Borkar, corporate vice president, Microsoft Azure

Arm is seeing strong demand in the industry for cloud services that alleviate peak resource needs. One way Arm is addressing this demand is by working with Cadence to provide our mutual customers with a cloud-based library characterization...

Ron Moore, vice president of business planning, Physical Design Group, Arm

By initially launching the Cadence Cloud portfolio on AWS, Cadence demonstrated early leadership in the industry. We’re excited to continue working with Cadence to help systems and semiconductor companies realize the benefits of the cloud and greatly accelerate their digital transformation.

Terry Wise, global vice president of Channels and Alliances, Amazon Web Services, Inc.

Cadence has passed our rigorous cloud security audits and is authorized to engage with mutual customers on the Cadence Cloud using TSMC process models and rule decks.

Suk Lee, Senior Director Design Infrastructure Marketing Division, TSMC

Our Cadence and AWS deployment is allowing us to deliver our platform-on-chip and subsystems for networking, storage and security applications faster so that we maintain not only our own competitive advantage but also that of AWS.

Nafea Bshara, vice president, distinguished engineer, and co-founder Annapurna Labs

We started using Cadence HDS on-premise with great success a few years ago because we needed full infrastructure and CAD and IT staff support. Now as our company has grown, we have decided to make the move to the Cadence Cloud-Hosted Design Solution deployed on Microsoft Azure in order to improve scalability.

Ronnie Huang, CTO and co-founder, CNEX Labs, Inc

We’ve chosen to collaborate with Cadence because we see a great opportunity in front of us to move systems and semiconductor companies to the cloud via Google Cloud Platform.

Adam Massey, Director, Strategic Technology Partners, Google Cloud

Through use of the Cadence Cloud-Hosted Design Solution deployed on AWS, we have successfully modernized our IT infrastructure for silicon design. The cloud-based approach enhanced collaboration of our world-class team, and Cadence’s support has allowed a seamless move to this new service delivery model.

Simon Morling, vice president product development, DNA Electronics Ltd.

Our mutual customers are benefiting from the flexible Cadence Cloud portfolio of cloud-optimized services and tools coupled with Azure’s focus on silicon design workloads, scalability, and economies of scale to manage exploding demand, reduce costs, and decrease time to market.

Kushagra Vaid, GM and distinguished engineer, Azure Hardware Infrastructure, Microsoft Corp

The Cadence approach to the cloud addresses historical industry issues, opening the door for customers to adopt the cloud and enter the next generation of chip design development.

Richard Wawrzyniak, principal analyst for ASIC & SoC at Semico Research Corp.

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