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Digital Design and Signoff

Cadence® digital design and signoff solutions provide a fast path to design closure and better predictability, helping you meet your power, performance, and area (PPA) targets.

PRODUCT CATEGORIES

  • Logic Equivalence Checking
  • SoC Implementation and Floorplanning
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  • Library Characterization
  • Test

FEATURED PRODUCTS

  • Integrity 3D-IC Platform
  • Cadence Cerebrus Intelligent Chip Explorer
  • Genus Synthesis Solution
  • Innovus Implementation System
  • Tempus Timing Signoff Solution
  • Voltus IC Power Integrity Solution
  • Pegasus Verification System
  • RESOURCES
  • Flows

Custom IC / Analog / RF Design

Cadence® custom, analog, and RF design solutions can help you save time by automating many routine tasks, from block-level and mixed-signal simulation to routing and library characterization.

PRODUCT CATEGORIES

  • Circuit Design
  • Circuit Simulation
  • Layout Design
  • Layout Verification
  • Library Characterization
  • RF / Microwave Solutions

FEATURED PRODUCTS

  • Spectre X Simulator
  • Spectre FX Simulator
  • Virtuoso Layout Suite
  • Virtuoso ADE Product Suite
  • Virtuoso Advanced Node
  • Voltus-Fi Custom Power Integrity Solution
  • RESOURCES
  • Flows

Verification

Offering a full verification flow to our customers and partners that delivers the highest verification throughput in the industry

PRODUCT CATEGORIES

  • Debug Analysis
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  • Planning and Management
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  • System-Level Verification IP

FEATURED PRODUCTS

  • vManager Verification Management
  • Jasper C Apps
  • Helium Virtual and Hybrid Studio
  • Xcelium Logic Simulation
  • Palladium Enterprise Emulation
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  • System VIP
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IP

An open IP platform for you to customize your app-driven SoC design.

PRODUCT CATEGORIES

  • 112G/56G SerDes
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  • Denali Memory Interface and Storage IP
  • Interface IP
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RESOURCES

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IC Package Design and Analysis

Driving efficiency and accuracy in advanced packaging, system planning, and multi-fabric interoperability, Cadence® package implementation products deliver the automation and accuracy.

PRODUCT CATEGORIES

  • Cross-Platform Co-Design and Analysis
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Multiphysics System Analysis

Cadence® system analysis solutions provide highly accurate electromagnetic extraction and simulation analysis to ensure your system works under wide-ranging operating conditions.

PRODUCT CATEGORIES

  • Computational Fluid Dynamics
  • Electromagnetic Solutions
  • RF / Microwave Design
  • Signal and Power Integrity
  • Thermal Solutions

FEATURED PRODUCTS

  • Clarity 3D Solver
  • Clarity 3D Solver Cloud
  • Clarity 3D Transient Solver
  • Celsius Thermal Solver
  • Fidelity CFD
  • Sigrity Advanced SI
  • Celsius Advanced PTI
  • RESOURCES
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Embedded Software

PCB Design and Analysis

Cadence® PCB design solutions enable shorter, more predictable design cycles with greater integration of component design and system-level simulation for a constraint-driven flow.

PRODUCT CATEGORIES

  • Design Authoring
  • PCB Layout
  • Library and Design Data Management
  • Analog/Mixed-Signal Simulation
  • SI/PI Analysis
  • SI/PI Analysis Point Tools
  • RF / Microwave Design
  • Augmented Reality Lab Tools

FEATURED PRODUCTS

  • Allegro Package Designer Plus
  • Allegro PCB Designer
  • Allegro X Design Platform
  • RESOURCES
  • What's New in Allegro
  • Advanced PCB Design & Analysis Resources Hub
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Computational Fluid Dynamics

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See how our customers create innovative products with Cadence

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US - English
  • China - 简体中文
  • Japan - 日本語
  • Korea - 한국어
  • Taiwan - 繁體中文
  • Products
    • DESIGN EXCELLENCE
      • Digital Design and Signoff
        • PRODUCT CATEGORIES
          • Logic Equivalence Checking
          • SoC Implementation and Floorplanning
          • Functional ECO
          • Low-Power Validation
          • Synthesis
          • Power Analysis
          • Constraints and CDC Signoff
          • Silicon Signoff and Verification
          • Library Characterization
          • Test
        • FEATURED PRODUCTS
          • Integrity 3D-IC Platform
          • Cadence Cerebrus Intelligent Chip Explorer
          • Genus Synthesis Solution
          • Innovus Implementation System
          • Tempus Timing Signoff Solution
          • Voltus IC Power Integrity Solution
          • Pegasus Verification System
          • RESOURCES
          • Flows
      • Custom IC / Analog / RF Design
        • PRODUCT CATEGORIES
          • Circuit Design
          • Circuit Simulation
          • Layout Design
          • Layout Verification
          • Library Characterization
          • RF / Microwave Solutions
        • FEATURED PRODUCTS
          • Spectre X Simulator
          • Spectre FX Simulator
          • Virtuoso Layout Suite
          • Virtuoso ADE Product Suite
          • Virtuoso Advanced Node
          • Voltus-Fi Custom Power Integrity Solution
          • RESOURCES
          • Flows
      • Verification
        • PRODUCT CATEGORIES
          • Debug Analysis
          • Virtual Prototyping
          • Emulation and Prototyping
          • Static and Formal Verification
          • Planning and Management
          • Simulation
          • Software-Driven Verification
          • Verification IP
          • System-Level Verification IP
        • FEATURED PRODUCTS
          • vManager Verification Management
          • Jasper C Apps
          • Helium Virtual and Hybrid Studio
          • Xcelium Logic Simulation
          • Palladium Enterprise Emulation
          • Protium Enterprise Prototyping
          • System VIP
          • RESOURCES
          • Flows
      • IP
        • PRODUCT CATEGORIES
          • 112G/56G SerDes
          • Chiplet and D2D
          • Denali Memory Interface and Storage IP
          • Interface IP
          • PCIe and CXL
          • Tensilica Processor IP
        • RESOURCES
          • Discover PCIe
      • IC Package Design and Analysis
        • PRODUCT CATEGORIES
          • Cross-Platform Co-Design and Analysis
          • IC Package Design
          • SI/PI Analysis
          • SI/PI Analysis Point Tools
          • Flows
    • SYSTEM INNOVATION
      • Multiphysics System Analysis
        • PRODUCT CATEGORIES
          • Computational Fluid Dynamics
          • Electromagnetic Solutions
          • RF / Microwave Design
          • Signal and Power Integrity
          • Thermal Solutions
        • FEATURED PRODUCTS
          • Clarity 3D Solver
          • Clarity 3D Solver Cloud
          • Clarity 3D Transient Solver
          • Celsius Thermal Solver
          • Fidelity CFD
          • Sigrity Advanced SI
          • Celsius Advanced PTI
          • RESOURCES
          • System Analysis Center
          • System Analysis Resources Hub
          • AWR Free Trial
      • Embedded Software
      • PCB Design and Analysis
        • PRODUCT CATEGORIES
          • Design Authoring
          • PCB Layout
          • Library and Design Data Management
          • Analog/Mixed-Signal Simulation
          • SI/PI Analysis
          • SI/PI Analysis Point Tools
          • RF / Microwave Design
          • Augmented Reality Lab Tools
        • FEATURED PRODUCTS
          • Allegro Package Designer Plus
          • Allegro PCB Designer
          • Allegro X Design Platform
          • RESOURCES
          • What's New in Allegro
          • Advanced PCB Design & Analysis Resources Hub
          • Flows
      • Computational Fluid Dynamics
    • PERVASIVE INTELLIGENCE
      • AI / Machine Learning
      • AI IP Portfolio
    • CADENCE CLOUD
    • VIEW ALL PRODUCTS
  • Solutions
      • Industries
        • 5G Systems and Subsystems
        • Aerospace and Defense
        • Automotive
        • Hyperscale Computing
      • Technologies
        • 3D-IC Design
        • Advanced Node
        • AI / Machine Learning
        • Arm-Based Solutions
        • Cloud Solutions
        • Computational Fluid Dynamics
        • Functional Safety
        • Low Power
        • Mixed Signal
        • Photonics
        • RF / Microwave
      • Industries
        • 5G Systems and Subsystems
        • Aerospace and Defense
        • Automotive
        • Hyperscale Computing
      • Technologies
        • 3D-IC Design
        • Advanced Node
        • AI / Machine Learning
        • Arm-Based Solutions
        • Cloud Solutions
        • Computational Fluid Dynamics
        • Functional Safety
        • Low Power
        • Mixed Signal
        • Photonics
        • RF / Microwave
      • Industries
        • 5G Systems and Subsystems
        • Aerospace and Defense
        • Automotive
        • Hyperscale Computing
      • Technologies
        • 3D-IC Design
        • Advanced Node
        • AI / Machine Learning
        • Arm-Based Solutions
        • Cloud Solutions
        • Computational Fluid Dynamics
        • Functional Safety
        • Low Power
        • Mixed Signal
        • Photonics
        • RF / Microwave
  • Support
      • Support
        • Support Process
        • Online Support
        • Software Downloads
        • Computing Platform Support
        • Customer Support Contacts
        • Technical Forums
      • Training
        • Custom IC / Analog / RF Design
        • Languages and Methodologies
        • Digital Design and Signoff
        • IC Package
        • PCB Design
        • System Design and Verification
        • Tensilica Processor IP
      • Support
        • Support Process
        • Online Support
        • Software Downloads
        • Computing Platform Support
        • Customer Support Contacts
        • Technical Forums
      • Training
        • Custom IC / Analog / RF Design
        • Languages and Methodologies
        • Digital Design and Signoff
        • IC Package
        • PCB Design
        • System Design and Verification
        • Tensilica Processor IP
      • Support
        • Support Process
        • Online Support
        • Software Downloads
        • Computing Platform Support
        • Customer Support Contacts
        • Technical Forums
      • Training
        • Custom IC / Analog / RF Design
        • Languages and Methodologies
        • Digital Design and Signoff
        • IC Package
        • PCB Design
        • System Design and Verification
        • Tensilica Processor IP
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Cloud Passport Partner Program

Trusted help for the cloud

  • Cadence Cloud Portfolio
  • CloudBurst Platform
  • Cloud-Hosted Design Solution
  • Palladium Cloud
  • Cloud Passport
  • Cloud Partners

Key Benefits

  • Expands customer‘s implementation choices through authorized cloud-enablement partners                                               
  • Accelerates cloud adoption by engaging proven and knowledgeable providers
  • Opens collaboration opportunities via an expanded cloud ecosystem

Users of the Cadence® Cloud Passport model often have significant investments in on-premises IT and CAD infrastructure and also need to deploy and customize their own cloud-based design environments. Moving to the cloud often requires new knowledge and capabilities that not every company possesses, which leads to delays and unplanned spending. Recognizing this gap, Cadence has created the Cadence Cloud Passport Partner Program, recruiting and certifying cloud-enablement companies with experience and capabilities to make your move to a customized cloud environment much easier. Commercial users benefit from a broad range of solutions and support options, while academic users gain a new method for deploying and maintaining their design environments.

REQUEST INFORMATION

 

The Cadence Cloud Passport Partner Program gives you a proven and easier path to the cloud when your internal IT teams desire assistance. Cadence engages with program partners to ensure they are knowledgeable and proficient at deploying Cadence tools in cloud-based electronic design environments. Users managing their own cloud environments using the Cloud Passport model now have the option to get support from Cadence-authorized cloud enablement providers to accelerate cloud adoption for chip design projects.

The Cloud Passport Partner Program offers the following opportunities:

  • Faster cloud deployments: Partners help you accelerate the provisioning of your customized cloud environments from months to weeks depending on scope of the engagement.
  • Support for complex design environments: With the help of a Cadence-approved partner, you can confidently utilize the cloud for design projects no matter the complexity of your flow or environment.
  • Access to specialized solutions for collaboration: Partners provide tailored offerings to address your specialized requirements—such as International Traffic in Arms Regulations (ITAR), multi-cloud access, and academic and research use cases—which improve your collaboration and accelerate design innovation.

In addition to commercial organizations realizing the potential of the cloud in electronics, the Cadence Academic Network, which promotes the use of Cadence technology by universities and research institutions around the globe, is collaborating with program partners to further cloud adoption in academia, effectively expanding tool usage among the next generation of engineers and researchers.

The Cloud Passport Partner Program gives you more options for deploying Cadence tools in the cloud and accelerating project schedules in the process..

CMC
CMC Microsystems helps researchers and industry across Canada’s National Design Network develop innovations in microsystems and nanotechnologies.

EuroPractice
Europractice helps companies improve their competitive position in world markets by adopting ASIC, Multi-Chip Module, or Microsystems solutions in the products they manufacture.

Nimbis
Nimbis Services, Inc., is a trusted name in collaborative high performance computing. Nimbis helps build communities for design, modeling, simulation, and analytics in the cloud.

Nimbix
Nimbix is the leading provider of purpose-built cloud supercomputing for HPC, ML and AI applications. Its JARVICE™ XE multi-cloud HPC platform brings the power of JARVICE™ and the Nimbix Cloud to any on-premises cluster or multi-cloud environment, dramatically simplifying computing for various applications.​

Rescale
Rescale offers industry-leading software platforms and hardware infrastructure for companies to perform scientific and engineering simulations.

Scala
Scala Computing is built on the expertise of computer scientists, mathematicians, and enterprise industry veterans. Scala brings years of experience in high performance computing systems, focused on the design of efficient parallel computing and network topology interconnect.

The Cloud Passport Partners Program expands customer cloud deployment options

Videos

Whiteboard Wednesdays - Passport Partners Program Expands Customer Cloud Deployment Options

An Introduction to Palladium Cloud

News ReleasesVIEW ALL
  • Cadence Collaborates with GlobalFoundries to Deliver Complete Digital Solution on Amazon Web Services 03/23/2022

  • Cadence Expands Collaboration with TSMC and Microsoft to Accelerate Timing Signoff for Giga-Scale Designs on the Cloud 12/01/2021

  • Cadence Wins Four 2021 TSMC OIP Partner of the Year Awards, Featuring Key Advancements in 3DFabric Design and Cloud-Based Solutions 11/12/2021

  • EdgeCortix Collaborates with Cadence to Accelerate AI Chip Design 06/02/2021

  • Cadence Wins Four 2020 TSMC OIP Partner of the Year Awards 11/02/2020

Blogs VIEW ALL
Customers

Through our work with Cadence, we’ve delivered a cloud-based microelectronics ecosystem to facilitate collaboration across groups associated with the U.S. Air Force Research Laboratory. The Cadence Cloud Passport Partner Program makes it much easier for us to extend the benefits of our government-approved deployments.

Robert Graybill, president and CEO, Nimbis Services, Inc.

Rescale is committed to extending the benefits of the cloud to engineering applications... By becoming an inaugural member of the Cadence Cloud Passport Partner Program, Rescale and Cadence will provision and accelerate new cloud environments for the electronics industry.

Joris Poort, founder and CEO, Rescale

Scala Computing’s cloud enablement expertise… has created an innovative collaboration platform available for electronics design manufacturers …. our collaboration with Cadence provides us with a solid foundation to further enable customers to leverage the power of the cloud for efficient electronic design development.

Rob Zecha, COO, Scala Computing Inc.

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