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Digital Design and Signoff

Cadence® digital design and signoff solutions provide a fast path to design closure and better predictability, helping you meet your power, performance, and area (PPA) targets.

PRODUCT CATEGORIES

  • Logic Equivalence Checking
  • SoC Implementation and Floorplanning
  • Functional ECO
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  • Synthesis
  • Power Analysis
  • Constraints and CDC Signoff
  • Silicon Signoff and Verification
  • Library Characterization
  • Test

FEATURED PRODUCTS

  • Integrity 3D-IC Platform
  • Cadence Cerebrus Intelligent Chip Explorer
  • Genus Synthesis Solution
  • Innovus Implementation System
  • Tempus Timing Signoff Solution
  • Voltus IC Power Integrity Solution
  • Pegasus Verification System
  • RESOURCES
  • Flows

Custom IC / Analog / RF Design

Cadence® custom, analog, and RF design solutions can help you save time by automating many routine tasks, from block-level and mixed-signal simulation to routing and library characterization.

PRODUCT CATEGORIES

  • Circuit Design
  • Circuit Simulation
  • Layout Design
  • Layout Verification
  • Library Characterization
  • RF / Microwave Solutions

FEATURED PRODUCTS

  • Spectre X Simulator
  • Spectre FX Simulator
  • Virtuoso Layout Suite
  • Virtuoso ADE Product Suite
  • Virtuoso Advanced Node
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  • RESOURCES
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Verification

Offering a full verification flow to our customers and partners that delivers the highest verification throughput in the industry

PRODUCT CATEGORIES

  • Debug Analysis
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  • Planning and Management
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  • System-Level Verification IP

FEATURED PRODUCTS

  • vManager Verification Management
  • Jasper C Apps
  • Helium Virtual and Hybrid Studio
  • Xcelium Logic Simulation
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IP

An open IP platform for you to customize your app-driven SoC design.

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  • 112G/56G SerDes
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  • Denali Memory Interface and Storage IP
  • Interface IP
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RESOURCES

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IC Package Design and Analysis

Driving efficiency and accuracy in advanced packaging, system planning, and multi-fabric interoperability, Cadence® package implementation products deliver the automation and accuracy.

PRODUCT CATEGORIES

  • Cross-Platform Co-Design and Analysis
  • IC Package Design
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Multiphysics System Analysis

Cadence® system analysis solutions provide highly accurate electromagnetic extraction and simulation analysis to ensure your system works under wide-ranging operating conditions.

PRODUCT CATEGORIES

  • Computational Fluid Dynamics
  • Electromagnetic Solutions
  • RF / Microwave Design
  • Signal and Power Integrity
  • Thermal Solutions

FEATURED PRODUCTS

  • Clarity 3D Solver
  • Clarity 3D Solver Cloud
  • Clarity 3D Transient Solver
  • Celsius Thermal Solver
  • Fidelity CFD
  • Sigrity Advanced SI
  • Celsius Advanced PTI
  • RESOURCES
  • System Analysis Center
  • System Analysis Resources Hub
  • AWR Free Trial

Embedded Software

PCB Design and Analysis

Cadence® PCB design solutions enable shorter, more predictable design cycles with greater integration of component design and system-level simulation for a constraint-driven flow.

PRODUCT CATEGORIES

  • Design Authoring
  • PCB Layout
  • Library and Design Data Management
  • Analog/Mixed-Signal Simulation
  • SI/PI Analysis
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  • RF / Microwave Design
  • Augmented Reality Lab Tools

FEATURED PRODUCTS

  • Allegro Package Designer Plus
  • Allegro PCB Designer
  • Allegro X Design Platform
  • RESOURCES
  • What's New in Allegro
  • Advanced PCB Design & Analysis Resources Hub
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Computational Fluid Dynamics

AI / Machine Learning

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  • China - 简体中文
  • Japan - 日本語
  • Korea - 한국어
  • Taiwan - 繁體中文
  • Products
    • DESIGN EXCELLENCE
      • Digital Design and Signoff
        • PRODUCT CATEGORIES
          • Logic Equivalence Checking
          • SoC Implementation and Floorplanning
          • Functional ECO
          • Low-Power Validation
          • Synthesis
          • Power Analysis
          • Constraints and CDC Signoff
          • Silicon Signoff and Verification
          • Library Characterization
          • Test
        • FEATURED PRODUCTS
          • Integrity 3D-IC Platform
          • Cadence Cerebrus Intelligent Chip Explorer
          • Genus Synthesis Solution
          • Innovus Implementation System
          • Tempus Timing Signoff Solution
          • Voltus IC Power Integrity Solution
          • Pegasus Verification System
          • RESOURCES
          • Flows
      • Custom IC / Analog / RF Design
        • PRODUCT CATEGORIES
          • Circuit Design
          • Circuit Simulation
          • Layout Design
          • Layout Verification
          • Library Characterization
          • RF / Microwave Solutions
        • FEATURED PRODUCTS
          • Spectre X Simulator
          • Spectre FX Simulator
          • Virtuoso Layout Suite
          • Virtuoso ADE Product Suite
          • Virtuoso Advanced Node
          • Voltus-Fi Custom Power Integrity Solution
          • RESOURCES
          • Flows
      • Verification
        • PRODUCT CATEGORIES
          • Debug Analysis
          • Virtual Prototyping
          • Emulation and Prototyping
          • Static and Formal Verification
          • Planning and Management
          • Simulation
          • Software-Driven Verification
          • Verification IP
          • System-Level Verification IP
        • FEATURED PRODUCTS
          • vManager Verification Management
          • Jasper C Apps
          • Helium Virtual and Hybrid Studio
          • Xcelium Logic Simulation
          • Palladium Enterprise Emulation
          • Protium Enterprise Prototyping
          • System VIP
          • RESOURCES
          • Flows
      • IP
        • PRODUCT CATEGORIES
          • 112G/56G SerDes
          • Chiplet and D2D
          • Denali Memory Interface and Storage IP
          • Interface IP
          • PCIe and CXL
          • Tensilica Processor IP
        • RESOURCES
          • Discover PCIe
      • IC Package Design and Analysis
        • PRODUCT CATEGORIES
          • Cross-Platform Co-Design and Analysis
          • IC Package Design
          • SI/PI Analysis
          • SI/PI Analysis Point Tools
          • Flows
    • SYSTEM INNOVATION
      • Multiphysics System Analysis
        • PRODUCT CATEGORIES
          • Computational Fluid Dynamics
          • Electromagnetic Solutions
          • RF / Microwave Design
          • Signal and Power Integrity
          • Thermal Solutions
        • FEATURED PRODUCTS
          • Clarity 3D Solver
          • Clarity 3D Solver Cloud
          • Clarity 3D Transient Solver
          • Celsius Thermal Solver
          • Fidelity CFD
          • Sigrity Advanced SI
          • Celsius Advanced PTI
          • RESOURCES
          • System Analysis Center
          • System Analysis Resources Hub
          • AWR Free Trial
      • Embedded Software
      • PCB Design and Analysis
        • PRODUCT CATEGORIES
          • Design Authoring
          • PCB Layout
          • Library and Design Data Management
          • Analog/Mixed-Signal Simulation
          • SI/PI Analysis
          • SI/PI Analysis Point Tools
          • RF / Microwave Design
          • Augmented Reality Lab Tools
        • FEATURED PRODUCTS
          • Allegro Package Designer Plus
          • Allegro PCB Designer
          • Allegro X Design Platform
          • RESOURCES
          • What's New in Allegro
          • Advanced PCB Design & Analysis Resources Hub
          • Flows
      • Computational Fluid Dynamics
    • PERVASIVE INTELLIGENCE
      • AI / Machine Learning
      • AI IP Portfolio
    • CADENCE CLOUD
    • VIEW ALL PRODUCTS
  • Solutions
      • Industries
        • 5G Systems and Subsystems
        • Aerospace and Defense
        • Automotive
        • Hyperscale Computing
      • Technologies
        • 3D-IC Design
        • Advanced Node
        • AI / Machine Learning
        • Arm-Based Solutions
        • Cloud Solutions
        • Computational Fluid Dynamics
        • Functional Safety
        • Low Power
        • Mixed Signal
        • Photonics
        • RF / Microwave
      • Industries
        • 5G Systems and Subsystems
        • Aerospace and Defense
        • Automotive
        • Hyperscale Computing
      • Technologies
        • 3D-IC Design
        • Advanced Node
        • AI / Machine Learning
        • Arm-Based Solutions
        • Cloud Solutions
        • Computational Fluid Dynamics
        • Functional Safety
        • Low Power
        • Mixed Signal
        • Photonics
        • RF / Microwave
      • Industries
        • 5G Systems and Subsystems
        • Aerospace and Defense
        • Automotive
        • Hyperscale Computing
      • Technologies
        • 3D-IC Design
        • Advanced Node
        • AI / Machine Learning
        • Arm-Based Solutions
        • Cloud Solutions
        • Computational Fluid Dynamics
        • Functional Safety
        • Low Power
        • Mixed Signal
        • Photonics
        • RF / Microwave
  • Support
      • Support
        • Support Process
        • Online Support
        • Software Downloads
        • Computing Platform Support
        • Customer Support Contacts
        • Technical Forums
      • Training
        • Custom IC / Analog / RF Design
        • Languages and Methodologies
        • Digital Design and Signoff
        • IC Package
        • PCB Design
        • System Design and Verification
        • Tensilica Processor IP
      • Support
        • Support Process
        • Online Support
        • Software Downloads
        • Computing Platform Support
        • Customer Support Contacts
        • Technical Forums
      • Training
        • Custom IC / Analog / RF Design
        • Languages and Methodologies
        • Digital Design and Signoff
        • IC Package
        • PCB Design
        • System Design and Verification
        • Tensilica Processor IP
      • Support
        • Support Process
        • Online Support
        • Software Downloads
        • Computing Platform Support
        • Customer Support Contacts
        • Technical Forums
      • Training
        • Custom IC / Analog / RF Design
        • Languages and Methodologies
        • Digital Design and Signoff
        • IC Package
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        • System Design and Verification
        • Tensilica Processor IP
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Cloud-Hosted Design Solution

The cloud is the datacenter

Read White Paper
  • Cadence Cloud Portfolio
  • CloudBurst Platform
  • Cloud-Hosted Design Solution
  • Palladium Cloud
  • Cloud Passport
  • Cloud Partners

Key Benefits

  • Provides managed, rapid access to cloud resources for a project or full design environment
  • Secure and dynamic ability to adjust capacity as needs change
  • Dedicated support team with foundry expertise reduces risk

As semiconductor design becomes increasingly intricate, the compute needs of design teams become harder and harder to manage. The constraints produced by traditional datacenters—resource contention, capacity restrictions, inconsistent turnaround times, and unpredictable performance—can hinder engineering productivity, project deadlines, and ultimately time to market. Cloud computing tackles these constraints but requires additional expertise to manage new public cloud environments. The Cadence® Cloud-Hosted Design Solution, a Cadence-managed offering of the Cadence Cloud, is ideally suited to enable customers to tap into the power of the public cloud without any of the overhead or heavy lifting.

The Cloud-Hosted Design Solution is an EDA-optimized service that provides a fully-integrated and proven cloud environment to jump-start semiconductor design, verification, and implementation on the public cloud. The Cloud-Hosted Design Solution provides all the benefits of cloud, without the burden of creating or maintaining a public cloud environment. These benefits include licensed software and support, EDA-optimized public cloud infrastructure, Cloud-specialized services and support, CAD and IT support, and PDK and foundry expertise.

Could-Hosted Design Solution
History of production-proven managed solutions

Optimized Solutions

The Cloud-Hosted Design Solution utilizes Infrastructure-as-a-Service (IaaS) from Amazon Web Services (AWS) or Microsoft Azure, in addition to third-party security services, to deliver a secure design environment and a high-performance computing cluster optimized for EDA workloads that dynamically scale up and down, depending on the workload. This dynamic cluster scaling significantly improves customer productivity and shortens turnaround times for compute-intensive tasks.

IaaS providers, such as AWS or Microsoft Azure, provide the building blocks of compute power, storage, and networking, which are essential to building a compute environment, but also require substantial knowledge of cloud services to create a secure environment, provision resources, and optimize for EDA workloads. The Cloud-Hosted Design Solution builds on expertise developed over 20 years of hosting and cloud provisioning, enabling customers to take advantage of public clouds to run EDA workloads, allowing them to differentiate their chip or board design.

Could-Hosted Design Solution
Cloud-Hosted Design Solution provides EDA-specific benefits on top of those from the public cloud

Flexible Models

The Cloud-Hosted Design Solution can be leveraged at the project or complete environment level, depending on unique customer needs. Start-ups and small companies can benefit from a managed cloud environment because it reduces the need for capital infrastructure investments and certain computer-aided design (CAD) and IT expenses, empowering these companies to offload their entire design environment and instead focus entirely on IC and system design innovation. Medium to large companies can also benefit from Cadence-managed environments by moving selected projects to the cloud, reducing stress on their own datacenters.

Could-Hosted Design Solution
Cloud-Hosted Design Solution customers span several semiconductor industry verticals

 

Additionally, the Cloud-Hosted Design Solution can be combined with any other Cadence Cloud offering. Customers can choose to use the Cloud-Hosted Design Solution for a specific team, project, or work type, while also simultaneously subscribing to the Cadence Cloud Passport model to run cloud-ready tools in their own public cloud environment for other engineering groups. The Cloud-Hosted Design Solution can also be combined with the Palladium® Cloud to create a fully-managed verification cloud or complete design environment that includes hardware emulation.

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Accelerating Soc Time to Market with Cloud-Based Verification
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Videos

The Cadence Cloud Portfolio

Cloud Computing for Electronic Design (Are We There Yet?)

Whiteboard Wednesdays - Passport Partners Program Expands Customer Cloud Deployment Options

An Introduction to Palladium Cloud

News ReleasesVIEW ALL
  • Cadence Collaborates with GlobalFoundries to Deliver Complete Digital Solution on Amazon Web Services 03/23/2022

  • Cadence Expands Collaboration with TSMC and Microsoft to Accelerate Timing Signoff for Giga-Scale Designs on the Cloud 12/01/2021

  • Cadence Wins Four 2021 TSMC OIP Partner of the Year Awards, Featuring Key Advancements in 3DFabric Design and Cloud-Based Solutions 11/12/2021

  • EdgeCortix Collaborates with Cadence to Accelerate AI Chip Design 06/02/2021

  • Cadence Wins Four 2020 TSMC OIP Partner of the Year Awards 11/02/2020

Blogs VIEW ALL
Customers

We successfully ran more than 500 million instances flat using the fully distributed Cadence Tempus Timing Signoff Solution on the CloudBurst platform via AWS to complete the tapeout of our latest TSMC 7nm networking chip. This would have been impossible to achieve in the required timeframe if we hadn’t deployed...

Dan Lenoski, chief development officer and co-founder, Barefoot Networks

This new offering [CloudBurst] from Cadence has met TSMC’s goal of the OIP VDE simplifying cloud adoption and demonstrated its ability to provide innovative service to our mutual customers with secure access to a simple-to-create, cloud-based environment that allows cloud bursting for peak needs…

Suk Lee, senior director of Design Infrastructure Management Division, TSMC

By utilizing the Cadence CloudBurst platform, customers can easily leverage the scale of Microsoft Azure in order to meet their peak capacity requirements thereby speeding up the time-to-market for their complex designs.

Rani Borkar, corporate vice president, Microsoft Azure

Arm is seeing strong demand in the industry for cloud services that alleviate peak resource needs. One way Arm is addressing this demand is by working with Cadence to provide our mutual customers with a cloud-based library characterization...

Ron Moore, vice president of business planning, Physical Design Group, Arm

By initially launching the Cadence Cloud portfolio on AWS, Cadence demonstrated early leadership in the industry. We’re excited to continue working with Cadence to help systems and semiconductor companies realize the benefits of the cloud and greatly accelerate their digital transformation.

Terry Wise, global vice president of Channels and Alliances, Amazon Web Services, Inc.

Cadence has passed our rigorous cloud security audits and is authorized to engage with mutual customers on the Cadence Cloud using TSMC process models and rule decks.

Suk Lee, Senior Director Design Infrastructure Marketing Division, TSMC

Our Cadence and AWS deployment is allowing us to deliver our platform-on-chip and subsystems for networking, storage and security applications faster so that we maintain not only our own competitive advantage but also that of AWS.

Nafea Bshara, vice president, distinguished engineer, and co-founder Annapurna Labs

We started using Cadence HDS on-premise with great success a few years ago because we needed full infrastructure and CAD and IT staff support. Now as our company has grown, we have decided to make the move to the Cadence Cloud-Hosted Design Solution deployed on Microsoft Azure in order to improve scalability.

Ronnie Huang, CTO and co-founder, CNEX Labs, Inc

We’ve chosen to collaborate with Cadence because we see a great opportunity in front of us to move systems and semiconductor companies to the cloud via Google Cloud Platform.

Adam Massey, Director, Strategic Technology Partners, Google Cloud

Through use of the Cadence Cloud-Hosted Design Solution deployed on AWS, we have successfully modernized our IT infrastructure for silicon design. The cloud-based approach enhanced collaboration of our world-class team, and Cadence’s support has allowed a seamless move to this new service delivery model.

Simon Morling, vice president product development, DNA Electronics Ltd.

Our mutual customers are benefiting from the flexible Cadence Cloud portfolio of cloud-optimized services and tools coupled with Azure’s focus on silicon design workloads, scalability, and economies of scale to manage exploding demand, reduce costs, and decrease time to market.

Kushagra Vaid, GM and distinguished engineer, Azure Hardware Infrastructure, Microsoft Corp

The Cadence approach to the cloud addresses historical industry issues, opening the door for customers to adopt the cloud and enter the next generation of chip design development.

Richard Wawrzyniak, principal analyst for ASIC & SoC at Semico Research Corp.

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