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Digital Design and Signoff

Cadence® digital design and signoff solutions provide a fast path to design closure and better predictability, helping you meet your power, performance, and area (PPA) targets.

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Custom IC / Analog / RF Design

Cadence® custom, analog, and RF design solutions can help you save time by automating many routine tasks, from block-level and mixed-signal simulation to routing and library characterization.

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Verification

Offering a full verification flow to our customers and partners that delivers the highest verification throughput in the industry

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IP

An open IP platform for you to customize your app-driven SoC design.

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IC Package Design and Analysis

Driving efficiency and accuracy in advanced packaging, system planning, and multi-fabric interoperability, Cadence® package implementation products deliver the automation and accuracy.

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Multiphysics System Analysis

Cadence® system analysis solutions provide highly accurate electromagnetic extraction and simulation analysis to ensure your system works under wide-ranging operating conditions.

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Embedded Software

PCB Design and Analysis

Cadence® PCB design solutions enable shorter, more predictable design cycles with greater integration of component design and system-level simulation for a constraint-driven flow.

PRODUCT CATEGORIES

  • Design Authoring
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  • Products
    • DESIGN EXCELLENCE
      • Digital Design and Signoff
        • PRODUCT CATEGORIES
          • Logic Equivalence Checking
          • SoC Implementation and Floorplanning
          • Functional ECO
          • Low-Power Validation
          • Synthesis
          • Power Analysis
          • Constraints and CDC Signoff
          • Silicon Signoff and Verification
          • Library Characterization
          • Test
        • FEATURED PRODUCTS
          • Integrity 3D-IC Platform
          • Cadence Cerebrus Intelligent Chip Explorer
          • Genus Synthesis Solution
          • Innovus Implementation System
          • Tempus Timing Signoff Solution
          • Voltus IC Power Integrity Solution
          • Pegasus Verification System
          • RESOURCES
          • Flows
      • Custom IC / Analog / RF Design
        • PRODUCT CATEGORIES
          • Circuit Design
          • Circuit Simulation
          • Layout Design
          • Layout Verification
          • Library Characterization
          • RF / Microwave Solutions
        • FEATURED PRODUCTS
          • Spectre X Simulator
          • Spectre FX Simulator
          • Virtuoso Layout Suite
          • Virtuoso ADE Product Suite
          • Virtuoso Advanced Node
          • Voltus-XFi Custom Power Integrity Solution
          • RESOURCES
          • Flows
      • Verification
        • PRODUCT CATEGORIES
          • Debug Analysis
          • Virtual Prototyping
          • Emulation and Prototyping
          • Static and Formal Verification
          • Planning and Management
          • Simulation
          • Software-Driven Verification
          • Verification IP
          • System-Level Verification IP
        • FEATURED PRODUCTS
          • vManager Verification Management
          • Jasper C Apps
          • Helium Virtual and Hybrid Studio
          • Xcelium Logic Simulation
          • Palladium Enterprise Emulation
          • Protium Enterprise Prototyping
          • System VIP
          • RESOURCES
          • Flows
      • IP
        • PRODUCT CATEGORIES
          • 112G/56G SerDes
          • Chiplet and D2D
          • Denali Memory Interface and Storage IP
          • Interface IP
          • PCIe and CXL
          • Tensilica Processor IP
        • RESOURCES
          • Discover PCIe
      • IC Package Design and Analysis
        • PRODUCT CATEGORIES
          • Cross-Platform Co-Design and Analysis
          • IC Package Design
          • SI/PI Analysis
          • SI/PI Analysis Point Tools
          • Flows
    • SYSTEM INNOVATION
      • Multiphysics System Analysis
        • PRODUCT CATEGORIES
          • Computational Fluid Dynamics
          • Electromagnetic Solutions
          • RF / Microwave Design
          • Signal and Power Integrity
          • Thermal Solutions
        • FEATURED PRODUCTS
          • Clarity 3D Solver
          • Clarity 3D Solver Cloud
          • Clarity 3D Transient Solver
          • Celsius Thermal Solver
          • Fidelity CFD
          • Sigrity Advanced SI
          • Celsius Advanced PTI
          • RESOURCES
          • System Analysis Center
          • System Analysis Resources Hub
          • AWR Free Trial
      • Embedded Software
      • PCB Design and Analysis
        • PRODUCT CATEGORIES
          • Design Authoring
          • PCB Layout
          • Library and Design Data Management
          • Analog/Mixed-Signal Simulation
          • SI/PI Analysis
          • SI/PI Analysis Point Tools
          • RF / Microwave Design
          • Augmented Reality Lab Tools
        • FEATURED PRODUCTS
          • Allegro Package Designer Plus
          • Allegro PCB Designer
          • Allegro X Design Platform
          • RESOURCES
          • What's New in Allegro
          • Advanced PCB Design & Analysis Resources Hub
          • Flows
      • Computational Fluid Dynamics
    • PERVASIVE INTELLIGENCE
      • AI / Machine Learning
      • AI IP Portfolio
    • CADENCE CLOUD
    • VIEW ALL PRODUCTS
  • Solutions
      • Industries
        • 5G Systems and Subsystems
        • Aerospace and Defense
        • Automotive
        • Hyperscale Computing
      • Technologies
        • 3D-IC Design
        • Advanced Node
        • AI / Machine Learning
        • Arm-Based Solutions
        • Cloud Solutions
        • Computational Fluid Dynamics
        • Functional Safety
        • Low Power
        • Mixed Signal
        • Photonics
        • RF / Microwave
      • Industries
        • 5G Systems and Subsystems
        • Aerospace and Defense
        • Automotive
        • Hyperscale Computing
      • Technologies
        • 3D-IC Design
        • Advanced Node
        • AI / Machine Learning
        • Arm-Based Solutions
        • Cloud Solutions
        • Computational Fluid Dynamics
        • Functional Safety
        • Low Power
        • Mixed Signal
        • Photonics
        • RF / Microwave
      • Industries
        • 5G Systems and Subsystems
        • Aerospace and Defense
        • Automotive
        • Hyperscale Computing
      • Technologies
        • 3D-IC Design
        • Advanced Node
        • AI / Machine Learning
        • Arm-Based Solutions
        • Cloud Solutions
        • Computational Fluid Dynamics
        • Functional Safety
        • Low Power
        • Mixed Signal
        • Photonics
        • RF / Microwave
  • Support
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        • Support Process
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CloudBurst Platform

The hybrid cloud solution, right at your fingertips

Read White Paper
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Key Benefits

  • Quick ramp-up with ready-to-use cloud environment with pre-installed tools and licenses
  • Cost-efficient scaling of compute and infrastructure capacity to match workload changes
  • EDA-optimized environment enables front-to-back design flow and tool-specific peak demands
  • ISO security-certified cloud that meets advanced foundry requirements
  • Dedicated support with cloud, IT, EDA, and foundry expertise to reduce risk

As semiconductor and system design becomes increasingly intricate, the compute needs of design teams grow exponentially. The limitations of traditional datacenters—capacity restrictions, inconsistent turnaround times, and upfront CapEx investment—hinder engineering productivity, project deadlines, cost-efficiency, and ultimately time to market. Cloud removes these limitations but requires unique IT and EDA expertise to manage an efficient public cloud environment.

Delivering Scalability, Collaboration, and Security

The Cadence® CloudBurst Platform, a Cadence-managed cloud offering, is designed to tap into the power of cloud without the burden of IT heavy-lifting. With the CloudBurst platform, servicing steady-state and peak compute demand is fast and easy. Using nothing more than a standard web browser, customers can connect to their own private and secure cloud environment, use the pre-installed design tools, launch and monitor jobs, analyze results, collaborate with global design teams and supply chain partners, and tape out their designs. All the software needed to provide ISO-level security, invoke the design tools, schedule jobs, and transfer data comes built-in—nothing to install on the customer’s side. Customers can scale up and scale down their design workloads instantly—no delays, no obstacles, simply faster time to market!

ASK US A QUESTION

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Streamlined, easy-to-use CloudBurst web interface

 

Production Proven

Not only is the CloudBurst platform fast and easy, it builds on Cadence’s expertise developed over 20 years of hosting and cloud provisioning. The Cadence-managed CloudBurst platform removes the need for capital infrastructure investments and IT expenses, empowering companies to focus entirely on IC and system design innovation.

That’s why more than 100 companies have leveraged the CloudBurst platform and are delivering cutting-edge innovations across the world. For example, the CloudBurst platform has been used by II-VI, BeammWave, and Novelda for complete front-to-back design; by M31 for 5X faster results using 10,000 cores for advanced-node library characterization; and by a networking company to sign off a massive 500M instance chip.

Built on top of Amazon Web Services (AWS) and Microsoft Azure and available with a front-to-back portfolio of Cadence tools, the CloudBurst platform is helping customers tackle their full-flow design as well as their biggest verification, implementation, and signoff challenges!

Contact Us

II-VI with Cadence Cloud Environment on AWS HPC
Learn More
M31: 5X Faster Delivery
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Barefoot Networks Accelerates Timing Closure with the CloudBurst Platform and Tempus Timing Signoff
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Cadence Cloud Brochure
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Enabling Digital Transformation in
Electronic Design with Cadence Cloud
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Videos

The Cadence Cloud Portfolio

Cloud Computing for Electronic Design (Are We There Yet?)

Whiteboard Wednesdays - Passport Partners Program Expands Customer Cloud Deployment Options

An Introduction to Palladium Cloud

News ReleasesVIEW ALL
  • Cadence and Intel Foundry Services Collaborate to Accelerate Innovation with Scalable and Proven Cadence Cloud Solutions 06/28/2022

  • Cadence Extends Cloud Leadership with Transformational Cadence OnCloud SaaS and e‑Commerce Platform 06/08/2022

  • Cadence Collaborates with GlobalFoundries to Deliver Complete Digital Solution on Amazon Web Services 03/23/2022

  • Cadence Expands Collaboration with TSMC and Microsoft to Accelerate Timing Signoff for Giga-Scale Designs on the Cloud 12/01/2021

  • Cadence Wins Four 2021 TSMC OIP Partner of the Year Awards, Featuring Key Advancements in 3DFabric Design and Cloud-Based Solutions 11/12/2021

Blogs VIEW ALL
Customers

We successfully ran more than 500 million instances flat using the fully distributed Cadence Tempus Timing Signoff Solution on the CloudBurst platform via AWS to complete the tapeout of our latest TSMC 7nm networking chip. This would have been impossible to achieve in the required timeframe if we hadn’t deployed...

Dan Lenoski, chief development officer and co-founder, Barefoot Networks

This new offering [CloudBurst] from Cadence has met TSMC’s goal of the OIP VDE simplifying cloud adoption and demonstrated its ability to provide innovative service to our mutual customers with secure access to a simple-to-create, cloud-based environment that allows cloud bursting for peak needs…

Suk Lee, senior director of Design Infrastructure Management Division, TSMC

By utilizing the Cadence CloudBurst platform, customers can easily leverage the scale of Microsoft Azure in order to meet their peak capacity requirements thereby speeding up the time-to-market for their complex designs.

Rani Borkar, corporate vice president, Microsoft Azure

Arm is seeing strong demand in the industry for cloud services that alleviate peak resource needs. One way Arm is addressing this demand is by working with Cadence to provide our mutual customers with a cloud-based library characterization...

Ron Moore, vice president of business planning, Physical Design Group, Arm

By initially launching the Cadence Cloud portfolio on AWS, Cadence demonstrated early leadership in the industry. We’re excited to continue working with Cadence to help systems and semiconductor companies realize the benefits of the cloud and greatly accelerate their digital transformation.

Terry Wise, global vice president of Channels and Alliances, Amazon Web Services, Inc.

Cadence has passed our rigorous cloud security audits and is authorized to engage with mutual customers on the Cadence Cloud using TSMC process models and rule decks.

Suk Lee, Senior Director Design Infrastructure Marketing Division, TSMC

Our Cadence and AWS deployment is allowing us to deliver our platform-on-chip and subsystems for networking, storage and security applications faster so that we maintain not only our own competitive advantage but also that of AWS.

Nafea Bshara, vice president, distinguished engineer, and co-founder Annapurna Labs

We started using Cadence HDS on-premise with great success a few years ago because we needed full infrastructure and CAD and IT staff support. Now as our company has grown, we have decided to make the move to the Cadence Cloud-Hosted Design Solution deployed on Microsoft Azure in order to improve scalability.

Ronnie Huang, CTO and co-founder, CNEX Labs, Inc

We’ve chosen to collaborate with Cadence because we see a great opportunity in front of us to move systems and semiconductor companies to the cloud via Google Cloud Platform.

Adam Massey, Director, Strategic Technology Partners, Google Cloud

Through use of the Cadence Cloud-Hosted Design Solution deployed on AWS, we have successfully modernized our IT infrastructure for silicon design. The cloud-based approach enhanced collaboration of our world-class team, and Cadence’s support has allowed a seamless move to this new service delivery model.

Simon Morling, vice president product development, DNA Electronics Ltd.

Our mutual customers are benefiting from the flexible Cadence Cloud portfolio of cloud-optimized services and tools coupled with Azure’s focus on silicon design workloads, scalability, and economies of scale to manage exploding demand, reduce costs, and decrease time to market.

Kushagra Vaid, GM and distinguished engineer, Azure Hardware Infrastructure, Microsoft Corp

The Cadence approach to the cloud addresses historical industry issues, opening the door for customers to adopt the cloud and enter the next generation of chip design development.

Richard Wawrzyniak, principal analyst for ASIC & SoC at Semico Research Corp.

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