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Digital Design and Signoff

Cadence® digital design and signoff solutions provide a fast path to design closure and better predictability, helping you meet your power, performance, and area (PPA) targets.

PRODUCT CATEGORIES

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FEATURED PRODUCTS

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Custom IC / Analog / RF Design

Cadence® custom, analog, and RF design solutions can help you save time by automating many routine tasks, from block-level and mixed-signal simulation to routing and library characterization.

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System Design and Verification

Cadence® system design and verification solutions, integrated under our Verification Suite, provide the simulation, acceleration, emulation, and management capabilities.

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FEATURED PRODUCTS

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IP

An open IP platform for you to customize your app-driven SoC design.

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IC Package Design and Analysis

Driving efficiency and accuracy in advanced packaging, system planning, and multi-fabric interoperability, Cadence® package implementation products deliver the automation and accuracy.

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System Analysis

Cadence® system analysis solutions provide highly accurate electromagnetic extraction and simulation analysis to ensure your system works under wide-ranging operating conditions.

PRODUCT CATEGORIES

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FEATURED PRODUCTS

  • Clarity 3D Solver
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Embedded Software

PCB Design and Analysis

Cadence® PCB design solutions enable shorter, more predictable design cycles with greater integration of component design and system-level simulation for a constraint-driven flow.

PRODUCT CATEGORIES

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  • Products
    • DESIGN EXCELLENCE
      • Digital Design and Signoff
        • PRODUCT CATEGORIES
          • Logic Equivalence Checking
          • SoC Implementation and Floorplanning
          • Functional ECO
          • Low-Power Validation
          • Synthesis
          • Power Analysis
          • Constraints and CDC Signoff
          • Silicon Signoff and Verification
          • Library Characterization
          • Test
        • FEATURED PRODUCTS
          • Genus Synthesis Solution
          • Conformal Smart LEC
          • Innovus Implementation System
          • Tempus Timing Signoff Solution
          • Pegasus Verification System
          • RESOURCES
          • Flows
      • Custom IC / Analog / RF Design
        • PRODUCT CATEGORIES
          • Circuit Design
          • Circuit Simulation
          • Layout Design
          • Layout Verification
          • Library Characterization
          • RF / Microwave Solutions
        • FEATURED PRODUCTS
          • Spectre X Simulator
          • Virtuoso RF Solution
          • Virtuoso Layout Suite
          • Virtuoso ADE Product Suite
          • Virtuoso Advanced Node
          • Voltus IC Power Integrity Solution
          • RESOURCES
          • Flows
      • System Design and Verification
        • PRODUCT CATEGORIES
          • Debug Analysis
          • Emulation
          • Formal and Static Verification
          • FPGA-Based Prototyping
          • Planning and Management
          • Simulation
          • Software-Driven Verification
          • Verification IP
          • System-Level Verification IP
        • FEATURED PRODUCTS
          • vManager Verification Management
          • JasperGold Formal Verification Platform
          • Xcelium Logic Simulation
          • Palladium Z1 Enterprise Emulation Platform
          • Protium X1 Enterprise Prototyping Platform
          • System VIP
          • RESOURCES
          • Flows
      • IP
        • PRODUCT CATEGORIES
          • Interface IP
          • Denali Memory IP
          • Tensilica Processor IP
          • Analog IP
          • System / Peripherals IP
          • Verification IP
      • IC Package Design and Analysis
        • PRODUCT CATEGORIES
          • Cross-Platform Co-Design and Analysis
          • IC Package Design
          • SI/PI Analysis
          • SI/PI Analysis Point Tools
          • Flows
    • SYSTEM INNOVATION
      • System Analysis
        • PRODUCT CATEGORIES
          • Electromagnetic Solutions
          • RF / Microwave Design
          • Thermal Solutions
        • FEATURED PRODUCTS
          • Clarity 3D Solver
          • Clarity 3D Transient Solver
          • Celsius Thermal Solver
          • Sigrity Advanced SI
          • Sigrity Advanced PI
          • RESOURCES
          • System Analysis Resources Hub
      • Embedded Software
      • PCB Design and Analysis
        • PRODUCT CATEGORIES
          • Design Authoring
          • PCB Layout
          • Library and Design Data Management
          • Analog/Mixed-Signal Simulation
          • SI/PI Analysis
          • SI/PI Analysis Point Tools
          • RF / Microwave Design
          • Augmented Reality Lab Tools
        • FEATURED PRODUCTS
          • Allegro Package Designer Plus
          • Allegro PCB Designer
          • RESOURCES
          • What's New in Allegro
          • What's New in Sigrity
          • Advanced PCB Design & Analysis Resources Hub
          • Flows
    • PERVASIVE INTELLIGENCE
      • AI / Machine Learning
      • AI IP Portfolio
    • CADENCE CLOUD
    • VIEW ALL PRODUCTS
  • Solutions
      • Industries
        • 5G Systems and Subsystems
        • Aerospace and Defense
        • Automotive
        • AI / Machine Learning
      • Technologies
        • 3D-IC Design
        • Advanced Node
        • Arm-Based Solutions
        • Cloud Solutions
        • Low Power
        • Mixed Signal
        • Photonics
        • RF / Microwave
      • Industries
        • 5G Systems and Subsystems
        • Aerospace and Defense
        • Automotive
        • AI / Machine Learning
      • Technologies
        • 3D-IC Design
        • Advanced Node
        • Arm-Based Solutions
        • Cloud Solutions
        • Low Power
        • Mixed Signal
        • Photonics
        • RF / Microwave
      • Industries
        • 5G Systems and Subsystems
        • Aerospace and Defense
        • Automotive
        • AI / Machine Learning
      • Technologies
        • 3D-IC Design
        • Advanced Node
        • Arm-Based Solutions
        • Cloud Solutions
        • Low Power
        • Mixed Signal
        • Photonics
        • RF / Microwave
  • Support
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        • Custom IC / Analog / RF Design
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        • Digital Design and Signoff
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        • System Design and Verification
        • Tensilica Processor IP
      • Support
        • Support Process
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        • Software Downloads
        • Computing Platform Support
        • Customer Support Contacts
        • Technical Forums
      • Training
        • Custom IC / Analog / RF Design
        • Languages and Methodologies
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        • IC Package
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        • Tensilica Processor IP
      • Support
        • Support Process
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CloudBurst Platform

The hybrid cloud solution, right at your fingertips

Read White Paper
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Key Benefits

  • Fast access to a ready-to-use cloud environment with pre-installed tools and job scheduler
  • Makes hybrid-cloud easy by giving users the ability to selectively burst to meet peak demand without impacting existing flows and methodologies
  • Optimized for EDA workloads with high-performance data upload/download technology

Built for Hybrid Environments

The majority of companies developing ICs have significant investments in computing capacity in the form of on-premises datacenters. For efficiency reasons, companies try to maximize the utilization rates of their compute servers, which typically means substantial wait times for many jobs. These companies would prefer to use the cloud in a hybrid fashion to augment their existing on-premises infrastructure, not replace it. They need a solution that complements their existing flows and methodologies, not one that requires them to create new ones. They need a solution that scales to almost any number of CPUs on-demand and goes idle when not in use.

ASK US A QUESTION

 

It is to address hybrid-cloud environments that the Cadence® CloudBurst™ Platform has been developed. With the CloudBurst platform, servicing peak demand in the cloud is fast and easy. Using nothing more than a standard web browser, customers can connect to their own private and secure cloud environment, quickly upload design files, use the pre-installed design tools, launch and monitor jobs, analyze results, and download output. All of the necessary software that transfers data, provides security, and invokes the design tools is accessed through the CloudBurst platform with nothing installed on the customer’s side. Initial provisioning is typically complete a few days after receipt of order, and after that, customers can scale up and scale down their design workloads with immediate effect—no delays, no obstacles.

Streamlined, easy-to-use CloudBurst web interface

 

Production Proven

Not only is the CloudBurst platform fast and easy, it’s production proven as well. For example, the CloudBurst platform was used with Tempus™ Timing Signoff Solution’s distributed static timing analysis (DSTA) capability to sign off a massive, 7nm networking chip. The design database of this chip was hundreds of gigabytes, which without the CloudBurst platform’s express transfer technology would have made a hybrid cloud model impractical. Files were uploaded to the cloud environment in just a few hours. Then, by leveraging the massive compute scale of the cloud, thousands of virtual CPUs were brought to bear to process multiple timing analysis runs in parallel—delivering 10X the productivity versus performing STA on premises.

Built on top of Amazon Web Services (AWS) and Microsoft Azure, and available with a wide range of Cadence tools, the CloudBurst platform helps customers tackle their biggest design, verification, implementation, and signoff challenges!

Contact Us

CloudBurst – the Fast, Painless, Proven Solution for Hybrid Cloud Environments

Barefoot Networks Accelerates Timing Closure with the CloudBurst Platform and Tempus Timing Signoff

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Videos

The Cadence Cloud Portfolio

Cloud Computing for Electronic Design (Are We There Yet?)

Whiteboard Wednesdays - Passport Partners Program Expands Customer Cloud Deployment Options

The 4 Steps Necessary for an Effective Cloud-Based Design Strategy

When it Comes to Cloud-Based Design, One Size Does Not Fit All

The Cadence Cloud Portfolio of Fast, Painless, Proven Solutions for Cloud-Based Design

CloudBurst – the Fast, Painless, Proven Solution for Hybrid Cloud Environments

Cloud-Hosted Design Solution – a Full-Service Cloud Offering

An Introduction to Palladium Cloud

Introducing the Cloud Passport Model

News ReleasesVIEW ALL
  • Cadence Wins Four 2020 TSMC OIP Partner of the Year Awards 11/02/2020

  • Cadence Collaborates with TSMC and Microsoft to Reduce Semiconductor Design Timing Signoff Schedules with the Cloud 06/15/2020

  • Cadence Presented with Four 2019 TSMC Partner of the Year Awards 10/30/2019

  • Cadence Expands Customer-Managed Cloud Options with New Cloud Passport Partner Program 06/03/2019

  • Cadence Extends Cloud Leadership with New CloudBurst Platform for Hybrid Cloud Environments 04/01/2019

Blogs VIEW ALL
Customers

We successfully ran more than 500 million instances flat using the fully distributed Cadence Tempus Timing Signoff Solution on the CloudBurst platform via AWS to complete the tapeout of our latest TSMC 7nm networking chip. This would have been impossible to achieve in the required timeframe if we hadn’t deployed...

Dan Lenoski, chief development officer and co-founder, Barefoot Networks

This new offering [CloudBurst] from Cadence has met TSMC’s goal of the OIP VDE simplifying cloud adoption and demonstrated its ability to provide innovative service to our mutual customers with secure access to a simple-to-create, cloud-based environment that allows cloud bursting for peak needs…

Suk Lee, senior director of Design Infrastructure Management Division, TSMC

By utilizing the Cadence CloudBurst platform, customers can easily leverage the scale of Microsoft Azure in order to meet their peak capacity requirements thereby speeding up the time-to-market for their complex designs.

Rani Borkar, corporate vice president, Microsoft Azure

Arm is seeing strong demand in the industry for cloud services that alleviate peak resource needs. One way Arm is addressing this demand is by working with Cadence to provide our mutual customers with a cloud-based library characterization...

Ron Moore, vice president of business planning, Physical Design Group, Arm

By initially launching the Cadence Cloud portfolio on AWS, Cadence demonstrated early leadership in the industry. We’re excited to continue working with Cadence to help systems and semiconductor companies realize the benefits of the cloud and greatly accelerate their digital transformation.

Terry Wise, global vice president of Channels and Alliances, Amazon Web Services, Inc.

Cadence has passed our rigorous cloud security audits and is authorized to engage with mutual customers on the Cadence Cloud using TSMC process models and rule decks.

Suk Lee, Senior Director Design Infrastructure Marketing Division, TSMC

Our Cadence and AWS deployment is allowing us to deliver our platform-on-chip and subsystems for networking, storage and security applications faster so that we maintain not only our own competitive advantage but also that of AWS.

Nafea Bshara, vice president, distinguished engineer, and co-founder Annapurna Labs

We started using Cadence HDS on-premise with great success a few years ago because we needed full infrastructure and CAD and IT staff support. Now as our company has grown, we have decided to make the move to the Cadence Cloud-Hosted Design Solution deployed on Microsoft Azure in order to improve scalability.

Ronnie Huang, CTO and co-founder, CNEX Labs, Inc

We’ve chosen to collaborate with Cadence because we see a great opportunity in front of us to move systems and semiconductor companies to the cloud via Google Cloud Platform.

Adam Massey, Director, Strategic Technology Partners, Google Cloud

Through use of the Cadence Cloud-Hosted Design Solution deployed on AWS, we have successfully modernized our IT infrastructure for silicon design. The cloud-based approach enhanced collaboration of our world-class team, and Cadence’s support has allowed a seamless move to this new service delivery model.

Simon Morling, vice president product development, DNA Electronics Ltd.

Our mutual customers are benefiting from the flexible Cadence Cloud portfolio of cloud-optimized services and tools coupled with Azure’s focus on silicon design workloads, scalability, and economies of scale to manage exploding demand, reduce costs, and decrease time to market.

Kushagra Vaid, GM and distinguished engineer, Azure Hardware Infrastructure, Microsoft Corp

The Cadence approach to the cloud addresses historical industry issues, opening the door for customers to adopt the cloud and enter the next generation of chip design development.

Richard Wawrzyniak, principal analyst for ASIC & SoC at Semico Research Corp.

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