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Embedded Software

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Cadence® PCB design solutions enable shorter, more predictable design cycles with greater integration of component design and system-level simulation for a constraint-driven flow.

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  • Products
    • DESIGN EXCELLENCE
      • Digital Design and Signoff
        • PRODUCT CATEGORIES
          • Logic Equivalence Checking
          • SoC Implementation and Floorplanning
          • Functional ECO
          • Low-Power Validation
          • Synthesis
          • Power Analysis
          • Constraints and CDC Signoff
          • Silicon Signoff and Verification
          • Library Characterization
          • Test
        • FEATURED PRODUCTS
          • Integrity 3D-IC Platform
          • Cadence Cerebrus Intelligent Chip Explorer
          • Genus Synthesis Solution
          • Innovus Implementation System
          • Tempus Timing Signoff Solution
          • Voltus IC Power Integrity Solution
          • Pegasus Verification System
          • RESOURCES
          • Flows
      • Custom IC / Analog / RF Design
        • PRODUCT CATEGORIES
          • Circuit Design
          • Circuit Simulation
          • Layout Design
          • Layout Verification
          • Library Characterization
          • RF / Microwave Solutions
        • FEATURED PRODUCTS
          • Spectre X Simulator
          • Spectre FX Simulator
          • Virtuoso Layout Suite
          • Virtuoso ADE Product Suite
          • Virtuoso Advanced Node
          • Voltus-Fi Custom Power Integrity Solution
          • RESOURCES
          • Flows
      • Verification
        • PRODUCT CATEGORIES
          • Debug Analysis
          • Virtual Prototyping
          • Emulation and Prototyping
          • Static and Formal Verification
          • Planning and Management
          • Simulation
          • Software-Driven Verification
          • Verification IP
          • System-Level Verification IP
        • FEATURED PRODUCTS
          • vManager Verification Management
          • Jasper C Apps
          • Helium Virtual and Hybrid Studio
          • Xcelium Logic Simulation
          • Palladium Enterprise Emulation
          • Protium Enterprise Prototyping
          • System VIP
          • RESOURCES
          • Flows
      • IP
        • PRODUCT CATEGORIES
          • 112G/56G SerDes
          • Chiplet and D2D
          • Denali Memory Interface and Storage IP
          • Interface IP
          • PCIe and CXL
          • Tensilica Processor IP
        • RESOURCES
          • Discover PCIe
      • IC Package Design and Analysis
        • PRODUCT CATEGORIES
          • Cross-Platform Co-Design and Analysis
          • IC Package Design
          • SI/PI Analysis
          • SI/PI Analysis Point Tools
          • Flows
    • SYSTEM INNOVATION
      • Multiphysics System Analysis
        • PRODUCT CATEGORIES
          • Computational Fluid Dynamics
          • Electromagnetic Solutions
          • RF / Microwave Design
          • Signal and Power Integrity
          • Thermal Solutions
        • FEATURED PRODUCTS
          • Clarity 3D Solver
          • Clarity 3D Solver Cloud
          • Clarity 3D Transient Solver
          • Celsius Thermal Solver
          • Fidelity CFD
          • Sigrity Advanced SI
          • Celsius Advanced PTI
          • RESOURCES
          • System Analysis Center
          • System Analysis Resources Hub
          • AWR Free Trial
      • Embedded Software
      • PCB Design and Analysis
        • PRODUCT CATEGORIES
          • Design Authoring
          • PCB Layout
          • Library and Design Data Management
          • Analog/Mixed-Signal Simulation
          • SI/PI Analysis
          • SI/PI Analysis Point Tools
          • RF / Microwave Design
          • Augmented Reality Lab Tools
        • FEATURED PRODUCTS
          • Allegro Package Designer Plus
          • Allegro PCB Designer
          • Allegro X Design Platform
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Electronic Control Unit

Enabling coherent and integrated ECU design and analysis

Read Whitepaper
  • Automotive Solution
  • Advanced Driver Assistance System
  • Automotive Ethernet
  • Infotainment
  • Electronic Control Unit
  • Functional Safety
  • Automotive SoC Design

Cadence provides PCB and package design and analysis solutions to simplify complex designs from concept to manufacturing.

Cadence® system analysis solutions provide highly accurate electromagnetic, thermal, and RF simulation analysis to ensure your system works under wide-ranging operating conditions.

ASK US A QUESTION

ECU PCB Design

Automotive ECUs can benefit from size and weight reduction when PCBs designed with Cadence Allegro® tools are miniaturized with fine line multi-layer substrates, blind and buried vias, microvias, substrate embedded passive and active components, and rigid-flex substrates that can be folded and fitted into automotive housings that target specific voids and spaces within the car. Tight Allegro integration with mechanical CAD (MCAD) tools ensures productive ECU co-design of housings and PCBs.

Cadence PSpice® Advanced Analysis Option prevents board failures by determining which components are over-stressed using Smoke analysis or by observing component yields using Monte Carlo analysis.
LEARN MORE

ECU SiP Design

Electronic control units (ECUs) for advanced driver assistance system (ADAS) applications often need multiple sensors to act as the eyes and ears of the car. The integration of these sensors with local compute for sensor fusion is a similar challenge to the integration of multiple inertial sensor die for the smartphone market. Here, SiPs provide a solution that minimizes space, weight, power, and volume costs. The small form factors and profiles of SiP solutions enable OEMs to more discreetly integrate smart sensors into the exterior surfaces of the car.

These same benefits can be achieved with any automotive ECU. The bill of materials (BoM), size, weight, and power of the ECU can all be reduced by integrating multiple bare dies and passives directly into the SiP.

Cadence SiP Layout XL is the physical design solution for advanced SiP packages, covering side-by-side die, stacked die, and combinations of the two. It supports design across a wide range of single- and multi-die packaging technologies, including laminate build-up substrates, interposers, and wafer-level fan-out packages. Its 3D-aware design and 3D visualization combines with comprehensive DFM/DFA checking to ensure accurate and efficient implementation of ECU modules and other automotive packaging applications. LEARN MORE

Benefits:
  • Comprehensive 3D checking and visualization for error-free, complex, multi-tier wirebond, flipchip, and through-silicon-via configurations
  • Constraint-driven layout with auto-interactive routing technologies for fast, accurate implementation of high-density SIP interconnects
  • Design tool compatibility with OSAT providers for seamless bi-directional exchange of design data

System Analysis

ECU RF Design and Analysis

Integrated RF design for radar sensors, car radio, antenna modules, and V2X ECUs can be achieved in PCB, SiP, and SoC fabrics using RF variants of Cadence design tools, with system verification achieved through Allegro Sigrity™ extraction and with Spectre® RF simulation.

Our RF/microwave design tools such as the Cadence AWR Design Environment®, AWR® Microwave Office®, and AWR Visual System Simulator™ (VSS) software address electrical/physical co-design through RF-aware device models and electromagnetic (EM) analysis along with specialized circuit simulation technology.

Benefits:
  • Allegro tools for PCB antenna design and other RF copper shape editing, placement, and routing, including a library of more than 200 RF symbols
  • Cadence SiP Layout XL for embedding inductors / passives in the SiP substrate
  • Cadence Virtuoso® tools for closely coupled RF circuit design and RF layout for SoCs
  • Spectre RF for RF system simulation, utilizing SoC/SiP inductor and packaging S-parameter models extracted with Allegro Sigrity tools

ECU Signal, Power, and Thermal Integrity Analysis

Automotive ECUs created with PCB, SiP, and SoC fabrics must accommodate harsh thermal and electromagnetic operating conditions within a car. With inter- and intra-ECU data rates also rising dramatically, this demands careful signal, power, and thermal integrity analysis. Gigahertz communications between memory and CPU in SiP and PCB designs within an ECU, or network communication between ECUs, all benefit from signal integrity (SI) analysis with the Allegro Sigrity SI Solution, where signal, power, and ground can be coupled and simulated together.

The full-wave extraction of SiP package, PCB, and connector physical contexts with the Cadence Sigrity PowerSI® 3D EM Extraction Option allows detailed analysis of the losses, reflections, ringing, and crosstalk that can impact eye openings in these high-speed ECU communication pathways.

Thermal analysis of PCBs and SiPs within the ECU can be achieved with the Cadence Sigrity PowerDC™ tool, which identifies areas of excess current density and thermal hotspots to reduce risk of field failure. Near-field emissions from ECU boards are also available from Sigrity power-aware SI analysis, as part of electro-magnetic compliance (EMC) testing.

Benefits:
  • Sigrity solutions target complete power-delivery system analyses across chips, packages, and boards within an ECU
  • Sigrity solutions target SI analysis for ECUs, including simultaneous switching noise (SSN) analysis of high-speed signal transmissions
  • Constraint-driven design methodology ensures electrical design intent is followed and performance verified with power-aware SI analysis technology

Cadence Clarity™ 3D Solver is a 3D electromagnetic (EM) simulation tool for designing critical interconnects for PCBs, IC packages, and system on IC (SoIC) designs.

The Cadence Celsius™ Thermal Solver is the industry’s first complete electrical-thermal co-simulation solution for the full hierarchy of electronic systems from ICs to physical enclosures.
LEARN MORE

  • Related Products

    • Circuit Design
    • Innovus Implementation System
    • Silicon Signoff and Verification
    • OrbitIO Interconnect Designer
    • Legato Reliability Solution
  • Related Topics

    • IC/Package/PCB Co-Design
    • ECAD MCAD Co-Design
    • Allegro EDM Solution
  • Automotive White Papers

    • Meeting Functional Safety Requirements Efficiently Via Electronic Design Tools and Techniques White Paper
    • Improving Test Coverage and Eliminating Test Ecapes Using Analog Defect Analysis White Paper
    • Improve Reliability and Redundancy of Automotive Ethernet Through Open Standards

Hans Adlkofer, Vice President and Head of Automotive Systems Group at Infineon Technologies AG explains how to shorten the development cycle of complex systems with early software testing.

Bridging Mechanical Components and Electronic Design of PCB and IC Packages with Sigrity Technology

Videos

Designing High-Reliability Analog and Mixed-Signal ICs for Mission-Critical Applications

How to Meet the Quality, High Reliability, and Safety Requirements for Analog and Mixed-Signal ICs in Mission-Critical Applications

Analog Defect Simulation and Analysis for Complex Systems

Improvements in Modeling Device Aging Analysis: Extending Product Lifetime

Easily Adopt Electro-thermal Simulation for Your High-Reliability Analog Designs

Automotive System Trends and the Integration of Analog Electronic Dependability

Cadence virtual hardware in-the-loop environment for ECU design

Embedded World: Enabling Automotive System Design with Allegro Sigrity Tools

News ReleasesVIEW ALL
  • Cadence Introduces Comprehensive Safety Solution for Faster Certification of Automotive and Industrial Designs 10/19/2021

  • Cadence Accelerates Intelligent SoC Development with Comprehensive On-Device Tensilica AI Platform 09/13/2021

  • Cadence Tensilica Xtensa Processors Address Most Stringent Automotive Functional Safety Requirements with Full ISO 26262 Compliance to ASIL-D 07/28/2021

  • Cadence Tensilica Product Development Process and Software Products Certified for ISO 26262 ASIL D Compliance for Automotive Applications 02/28/2019

  • Cadence Automotive Solution for Safety Verification Used by ROHM to Achieve ISO 26262 ASIL D Certification 07/12/2018

Blogs VIEW ALL
Resource Library

Video (8)

  • Designing High-Reliability Analog and Mixed-Signal ICs for Mission-Critical Applications
  • How to Meet the Quality, High Reliability, and Safety Requirements for Analog and Mixed-Signal ICs in Mission-Critical Applications
  • Easily Adopt Electro-thermal Simulation for Your High-Reliability Analog Designs
  • Improvements in Modeling Device Aging Analysis: Extending Product Lifetime
  • Analog Defect Simulation and Analysis for Complex Systems
  • Automotive System Trends and the Integration of Analog Electronic Dependability
  • Cadence virtual hardware in-the-loop environment for ECU design
  • Embedded World: Enabling Automotive System Design with Allegro Sigrity Tools

White Paper (1)

  • Improving Test Coverage and Eliminating Test Ecapes Using Analog Defect Analysis White Paper

Press Releases (1)

  • Cadence Debuts Industry’s First Analog IC Design-for-Reliability Solution
VIEW ALL

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