Home
  • Products
  • Solutions
  • Support
  • Company
  • EN US
    • SELECT YOUR COUNTRY OR REGION

    • China - 简体中文
    • Japan - 日本語
    • Korea - 한국어
    • Taiwan - 繁體中文

DESIGN EXCELLENCE

  • Digital Design and Signoff
  • Custom IC
  • Verification
  • IP
  • IC Package

SYSTEM INNOVATION

  • Multiphysics System Analysis
  • Embedded Software
  • PCB Design
  • Computational Fluid Dynamics

PERVASIVE INTELLIGENCE

  • AI / Machine Learning
  • AI IP Portfolio

CADENCE CLOUD

VIEW ALL PRODUCTS

Digital Design and Signoff

Cadence® digital design and signoff solutions provide a fast path to design closure and better predictability, helping you meet your power, performance, and area (PPA) targets.

PRODUCT CATEGORIES

  • Logic Equivalence Checking
  • SoC Implementation and Floorplanning
  • Functional ECO
  • Low-Power Validation
  • Synthesis
  • Power Analysis
  • Constraints and CDC Signoff
  • Silicon Signoff and Verification
  • Library Characterization
  • Test

FEATURED PRODUCTS

  • Integrity 3D-IC Platform
  • Cadence Cerebrus Intelligent Chip Explorer
  • Genus Synthesis Solution
  • Innovus Implementation System
  • Tempus Timing Signoff Solution
  • Voltus IC Power Integrity Solution
  • Pegasus Verification System
  • RESOURCES
  • Flows

Custom IC / Analog / RF Design

Cadence® custom, analog, and RF design solutions can help you save time by automating many routine tasks, from block-level and mixed-signal simulation to routing and library characterization.

PRODUCT CATEGORIES

  • Circuit Design
  • Circuit Simulation
  • Layout Design
  • Layout Verification
  • Library Characterization
  • RF / Microwave Solutions

FEATURED PRODUCTS

  • Spectre X Simulator
  • Spectre FX Simulator
  • Virtuoso Layout Suite
  • Virtuoso ADE Product Suite
  • Virtuoso Advanced Node
  • Voltus-Fi Custom Power Integrity Solution
  • RESOURCES
  • Flows

Verification

Offering a full verification flow to our customers and partners that delivers the highest verification throughput in the industry

PRODUCT CATEGORIES

  • Debug Analysis
  • Virtual Prototyping
  • Emulation and Prototyping
  • Static and Formal Verification
  • Planning and Management
  • Simulation
  • Software-Driven Verification
  • Verification IP
  • System-Level Verification IP

FEATURED PRODUCTS

  • vManager Verification Management
  • Jasper C Apps
  • Helium Virtual and Hybrid Studio
  • Xcelium Logic Simulation
  • Palladium Enterprise Emulation
  • Protium Enterprise Prototyping
  • System VIP
  • RESOURCES
  • Flows

IP

An open IP platform for you to customize your app-driven SoC design.

PRODUCT CATEGORIES

  • 112G/56G SerDes
  • Chiplet and D2D
  • Denali Memory Interface and Storage IP
  • Interface IP
  • PCIe and CXL
  • Tensilica Processor IP

RESOURCES

  • Discover PCIe

IC Package Design and Analysis

Driving efficiency and accuracy in advanced packaging, system planning, and multi-fabric interoperability, Cadence® package implementation products deliver the automation and accuracy.

PRODUCT CATEGORIES

  • Cross-Platform Co-Design and Analysis
  • IC Package Design
  • SI/PI Analysis
  • SI/PI Analysis Point Tools
  • Flows

Multiphysics System Analysis

Cadence® system analysis solutions provide highly accurate electromagnetic extraction and simulation analysis to ensure your system works under wide-ranging operating conditions.

PRODUCT CATEGORIES

  • Computational Fluid Dynamics
  • Electromagnetic Solutions
  • RF / Microwave Design
  • Signal and Power Integrity
  • Thermal Solutions

FEATURED PRODUCTS

  • Clarity 3D Solver
  • Clarity 3D Solver Cloud
  • Clarity 3D Transient Solver
  • Celsius Thermal Solver
  • Fidelity CFD
  • Sigrity Advanced SI
  • Celsius Advanced PTI
  • RESOURCES
  • System Analysis Center
  • System Analysis Resources Hub
  • AWR Free Trial

Embedded Software

PCB Design and Analysis

Cadence® PCB design solutions enable shorter, more predictable design cycles with greater integration of component design and system-level simulation for a constraint-driven flow.

PRODUCT CATEGORIES

  • Design Authoring
  • PCB Layout
  • Library and Design Data Management
  • Analog/Mixed-Signal Simulation
  • SI/PI Analysis
  • SI/PI Analysis Point Tools
  • RF / Microwave Design
  • Augmented Reality Lab Tools

FEATURED PRODUCTS

  • Allegro Package Designer Plus
  • Allegro PCB Designer
  • Allegro X Design Platform
  • RESOURCES
  • What's New in Allegro
  • Advanced PCB Design & Analysis Resources Hub
  • Flows

Computational Fluid Dynamics

AI / Machine Learning

AI IP Portfolio

Industries

  • 5G Systems and Subsystems
  • Aerospace and Defense
  • Automotive
  • Hyperscale Computing

Technologies

  • 3D-IC Design
  • Advanced Node
  • AI / Machine Learning
  • Arm-Based Solutions
  • Cloud Solutions
  • Computational Fluid Dynamics
  • Functional Safety
  • Low Power
  • Mixed Signal
  • Photonics
  • RF / Microwave
Designed with Cadence See how our customers create innovative products with Cadence

Support

  • Support Process
  • Online Support
  • Software Downloads
  • Computing Platform Support
  • Customer Support Contacts
  • Technical Forums

Training

  • Custom IC / Analog / RF Design
  • Languages and Methodologies
  • Digital Design and Signoff
  • IC Package
  • PCB Design
  • System Design and Verification
  • Tensilica Processor IP
Link for support software downloads Stay up to date with the latest software 24/7 - Cadence Online Support Visit Now

Corporate

  • About Us
  • Designed with Cadence
  • Investor Relations
  • Leadership Team
  • Computational Software
  • Alliances
  • Corporate Social Responsibility
  • Cadence Academic Network

Media Center

  • Events
  • Newsroom
  • Blogs

Culture and Careers

  • Culture and Diversity
  • Careers
Intelligent System Design Learn how Intelligent System Design™ powers future technologies Browse Cadence’s latest on-demand sessions and upcoming events. Explore More
US - English
  • China - 简体中文
  • Japan - 日本語
  • Korea - 한국어
  • Taiwan - 繁體中文
  • Products
    • DESIGN EXCELLENCE
      • Digital Design and Signoff
        • PRODUCT CATEGORIES
          • Logic Equivalence Checking
          • SoC Implementation and Floorplanning
          • Functional ECO
          • Low-Power Validation
          • Synthesis
          • Power Analysis
          • Constraints and CDC Signoff
          • Silicon Signoff and Verification
          • Library Characterization
          • Test
        • FEATURED PRODUCTS
          • Integrity 3D-IC Platform
          • Cadence Cerebrus Intelligent Chip Explorer
          • Genus Synthesis Solution
          • Innovus Implementation System
          • Tempus Timing Signoff Solution
          • Voltus IC Power Integrity Solution
          • Pegasus Verification System
          • RESOURCES
          • Flows
      • Custom IC / Analog / RF Design
        • PRODUCT CATEGORIES
          • Circuit Design
          • Circuit Simulation
          • Layout Design
          • Layout Verification
          • Library Characterization
          • RF / Microwave Solutions
        • FEATURED PRODUCTS
          • Spectre X Simulator
          • Spectre FX Simulator
          • Virtuoso Layout Suite
          • Virtuoso ADE Product Suite
          • Virtuoso Advanced Node
          • Voltus-Fi Custom Power Integrity Solution
          • RESOURCES
          • Flows
      • Verification
        • PRODUCT CATEGORIES
          • Debug Analysis
          • Virtual Prototyping
          • Emulation and Prototyping
          • Static and Formal Verification
          • Planning and Management
          • Simulation
          • Software-Driven Verification
          • Verification IP
          • System-Level Verification IP
        • FEATURED PRODUCTS
          • vManager Verification Management
          • Jasper C Apps
          • Helium Virtual and Hybrid Studio
          • Xcelium Logic Simulation
          • Palladium Enterprise Emulation
          • Protium Enterprise Prototyping
          • System VIP
          • RESOURCES
          • Flows
      • IP
        • PRODUCT CATEGORIES
          • 112G/56G SerDes
          • Chiplet and D2D
          • Denali Memory Interface and Storage IP
          • Interface IP
          • PCIe and CXL
          • Tensilica Processor IP
        • RESOURCES
          • Discover PCIe
      • IC Package Design and Analysis
        • PRODUCT CATEGORIES
          • Cross-Platform Co-Design and Analysis
          • IC Package Design
          • SI/PI Analysis
          • SI/PI Analysis Point Tools
          • Flows
    • SYSTEM INNOVATION
      • Multiphysics System Analysis
        • PRODUCT CATEGORIES
          • Computational Fluid Dynamics
          • Electromagnetic Solutions
          • RF / Microwave Design
          • Signal and Power Integrity
          • Thermal Solutions
        • FEATURED PRODUCTS
          • Clarity 3D Solver
          • Clarity 3D Solver Cloud
          • Clarity 3D Transient Solver
          • Celsius Thermal Solver
          • Fidelity CFD
          • Sigrity Advanced SI
          • Celsius Advanced PTI
          • RESOURCES
          • System Analysis Center
          • System Analysis Resources Hub
          • AWR Free Trial
      • Embedded Software
      • PCB Design and Analysis
        • PRODUCT CATEGORIES
          • Design Authoring
          • PCB Layout
          • Library and Design Data Management
          • Analog/Mixed-Signal Simulation
          • SI/PI Analysis
          • SI/PI Analysis Point Tools
          • RF / Microwave Design
          • Augmented Reality Lab Tools
        • FEATURED PRODUCTS
          • Allegro Package Designer Plus
          • Allegro PCB Designer
          • Allegro X Design Platform
          • RESOURCES
          • What's New in Allegro
          • Advanced PCB Design & Analysis Resources Hub
          • Flows
      • Computational Fluid Dynamics
    • PERVASIVE INTELLIGENCE
      • AI / Machine Learning
      • AI IP Portfolio
    • CADENCE CLOUD
    • VIEW ALL PRODUCTS
  • Solutions
      • Industries
        • 5G Systems and Subsystems
        • Aerospace and Defense
        • Automotive
        • Hyperscale Computing
      • Technologies
        • 3D-IC Design
        • Advanced Node
        • AI / Machine Learning
        • Arm-Based Solutions
        • Cloud Solutions
        • Computational Fluid Dynamics
        • Functional Safety
        • Low Power
        • Mixed Signal
        • Photonics
        • RF / Microwave
      • Industries
        • 5G Systems and Subsystems
        • Aerospace and Defense
        • Automotive
        • Hyperscale Computing
      • Technologies
        • 3D-IC Design
        • Advanced Node
        • AI / Machine Learning
        • Arm-Based Solutions
        • Cloud Solutions
        • Computational Fluid Dynamics
        • Functional Safety
        • Low Power
        • Mixed Signal
        • Photonics
        • RF / Microwave
      • Industries
        • 5G Systems and Subsystems
        • Aerospace and Defense
        • Automotive
        • Hyperscale Computing
      • Technologies
        • 3D-IC Design
        • Advanced Node
        • AI / Machine Learning
        • Arm-Based Solutions
        • Cloud Solutions
        • Computational Fluid Dynamics
        • Functional Safety
        • Low Power
        • Mixed Signal
        • Photonics
        • RF / Microwave
  • Support
      • Support
        • Support Process
        • Online Support
        • Software Downloads
        • Computing Platform Support
        • Customer Support Contacts
        • Technical Forums
      • Training
        • Custom IC / Analog / RF Design
        • Languages and Methodologies
        • Digital Design and Signoff
        • IC Package
        • PCB Design
        • System Design and Verification
        • Tensilica Processor IP
      • Support
        • Support Process
        • Online Support
        • Software Downloads
        • Computing Platform Support
        • Customer Support Contacts
        • Technical Forums
      • Training
        • Custom IC / Analog / RF Design
        • Languages and Methodologies
        • Digital Design and Signoff
        • IC Package
        • PCB Design
        • System Design and Verification
        • Tensilica Processor IP
      • Support
        • Support Process
        • Online Support
        • Software Downloads
        • Computing Platform Support
        • Customer Support Contacts
        • Technical Forums
      • Training
        • Custom IC / Analog / RF Design
        • Languages and Methodologies
        • Digital Design and Signoff
        • IC Package
        • PCB Design
        • System Design and Verification
        • Tensilica Processor IP
  • Company
      • Corporate
        • About Us
        • Designed with Cadence
        • Investor Relations
        • Leadership Team
        • Computational Software
        • Alliances
        • Corporate Social Responsibility
        • Cadence Academic Network
      • Media Center
        • Events
        • Newsroom
        • Blogs
      • Culture and Careers
        • Culture and Diversity
        • Careers
      • Corporate
        • About Us
        • Designed with Cadence
        • Investor Relations
        • Leadership Team
        • Computational Software
        • Alliances
        • Corporate Social Responsibility
        • Cadence Academic Network
      • Media Center
        • Events
        • Newsroom
        • Blogs
      • Culture and Careers
        • Culture and Diversity
        • Careers
      • Corporate
        • About Us
        • Designed with Cadence
        • Investor Relations
        • Leadership Team
        • Computational Software
        • Alliances
        • Corporate Social Responsibility
        • Cadence Academic Network
      • Media Center
        • Events
        • Newsroom
        • Blogs
      • Culture and Careers
        • Culture and Diversity
        • Careers

Automotive SoC Design

Read Whitepaper
  • Automotive Solution
  • Advanced Driver Assistance System
  • Automotive Ethernet
  • Infotainment
  • Electronic Control Unit
  • Functional Safety
  • Automotive SoC Design

Recent chip developments driven by OEMs have demonstrated what impressive performance can be achieved with a highly automated driving platform. Instead of using existing chips on the market, a purpose-built system-on-chip (SoC) tailored to the system requirements can make a huge difference.

Meanwhile, the automotive industry has realized that for highly automated driving, OEMs and tier 1 supplier need to play a more active role in the definition of the SoC architecture. 

A high-performance purpose-built SoC or system-in-package (SiP) is needed in order to meet demanding requirements like feature set, performance per Watt, safety and security—all integrated on a single chip instead on a PCB. 

All these new technologies will dramatically increase the complexity of the chip, which may be required to take advantage of the latest process nodes. While high-end automotive SoCs have been been designed in 7nm, some companies are already preparing their next-generation advanced-node designs in 5nm. Foundries claim that 5nm provides about 20% faster speed or about 40% power reduction and is perfectly suited for the next generation of automotive processors. 

SoC Automotive Diagram


Cadence"s Automotive solutions—including tools, IP and services—can help you to enable these highly integrated systems that can make cars safer and more reliable.

Mixed Signal

Cadence has worked closely with all the leading automotive semiconductor suppliers for over a decade, and today, the collaboration continues to refine and improve our industry-leading mixed-signal solutions for automotive SoC design. Benefiting from the on-going evolution of the underlying Cadence® Virtuoso®, Innovus™, Spectre®, and Xcelium® platforms, the Cadence mixed-signal solution provides unique and powerful integration of analog and digital platforms for advanced-node mixed-signal SoC design. Learn more

Reliability

An automotive SoC must be reliable across its useful lifetime regardless of the operating conditions or environment. This requirement creates several design challenges. The first challenge is to ensure that testing results in only good parts making it into automobiles. Another challenge is to ensure that even devices operating at high power in extreme environments, such as the engine compartment, never exceed the safe operating region. The final challenge is to reduce the effect of device aging and to extend the lifetime of circuits for vehicles with a typical 15-year lifetime.

Responding to these challenges, the Cadence Legato™ Reliability Solution is the first to help analog designers design for automotive reliability requirements. It provides the tools to manage design reliability throughout the product lifecycle and includes new technology for:

  • Analog Defect Analysis: Analyze the manufacturing test’s ability to identify and eliminate test escapes through analog defect simulation
  • Electro-Thermal Analysis: Simulates the effect of temperature on circuit electrical performance using dynamic electro-thermal simulation to prevent thermal overstress and prevent premature failures
  • Advanced Aging Analysis: Simulate changes in devices over time, including the effects of temperature and process variation on device aging, to better predict product wear-out

LEARN MORE

Advanced Node

Advanced-node processes challenge automotive designers with the complex interdependency of manufacturing and variability, on top of increasing power and performance specifications.

Leverage complete, consistent, and converging flows across Innovus™ digital and Virtuoso® custom implementation technologies to address design-for-manufacturing (DFM) and variability effects earlier.

Cadence advanced-node platforms enable automotive designers to account for issues such as layout-dependent effects, FinFETs, local interconnect, multi-patterning lithography, and increased device variation and mismatch.

  • Automotive mixed-signal SoC design can be centered and optimized for reliability, performance, power, area, and thermal profiles
  • Automotive mixed-signal SoC verification can be configured across a range of supported languages, abstractions, methodologies, and Cadence simulation engines, and optimally re-configured as SoC block design progresses to integration
  • Provides metric-driven, coverage-based mixed-signal SoC verification and traceability for the IS0 26262 standard
  • OpenAccess-based analog and digital implementation, exchange, and signoff
  • Digital Design and Verification Tools

    • SimVision Debug
    • vManager Verification Management
    • Jasper RTL Apps
    • Palladium Z1 Enterprise Emulation Platform
    • Protium FPGA-Based Prototyping Platform
    • Conformal Overview
    • Genus Synthesis Solution
  • Analog Design, Verification, and Implementation Tools

    • Quantus Extraction Solution
    • SimVision Debug
    • Spectre Accelerated Parallel Simulator
    • Spectre eXtensive Partitioning Simulator (XPS)
    • Spectre RF Option
    • Virtuoso ADE Product Suite
    • Virtuoso ADE Verifier
    • Virtuoso Schematic Editor
    • Spectre AMS Designer
  • Digital Implementation and Signoff

    • Stratus High-Level Synthesis
    • Genus Synthesis Solution
    • Cadence Modus DFT Software Solution
    • Innovus Implementation System
    • Physical Verification System
    • Conformal Equivalence Checker
    • Joules RTL Power Solution
    • Quantus Extraction Solution
    • Tempus Timing Signoff Solution
    • Voltus IC Power Integrity Solution
    • Voltus-Fi Custom Power Integrity Solution
    • Pegasus Layout Pattern Analyzer
    • Pegasus CMP Predictor
    • Liberate Characterization Solution
  • PCB Design and Verification

    • Allegro Design Entry Capture/Capture CIS
    • Allegro Design Authoring
    • Allegro PCB Designer
    • Allegro PSpice System Designer

Hans Adlkofer, Vice President and Head of Automotive Systems Group, at Infineon Technologies AG explains how Infineon leverages Cadence products for Automotive Chip design to enable smart and safe mixed-signal devices.

Videos

Digital home assistant speech recognition powered by Tensilica HiFi DSP

Cadence Automotive IP solutions for infotainment applications

Kronoton Demo powered by Cadence Tensilica HiFi Audio core

Hardent: Solution for Next-Generation Automotive Video Systems Enabled with Cadence IP

Renesas R-Car Audio Channel Processing using Cadence Tensilica DSP

Renesas: Next-generation Integrated Cockpits Using Cadence Tensilica HiFi DSPs

News ReleasesVIEW ALL
  • Cadence Introduces Comprehensive Safety Solution for Faster Certification of Automotive and Industrial Designs 10/19/2021

  • Cadence Accelerates Intelligent SoC Development with Comprehensive On-Device Tensilica AI Platform 09/13/2021

  • Cadence Tensilica Xtensa Processors Address Most Stringent Automotive Functional Safety Requirements with Full ISO 26262 Compliance to ASIL-D 07/28/2021

  • Cadence Tensilica Product Development Process and Software Products Certified for ISO 26262 ASIL D Compliance for Automotive Applications 02/28/2019

  • Cadence Automotive Solution for Safety Verification Used by ROHM to Achieve ISO 26262 ASIL D Certification 07/12/2018

Blogs VIEW ALL
Fortune 100 Best Companies to Work for 2022

A Great Place to Do Great Work!

Eighth year on the FORTUNE 100 list

Our Culture Join The Team
  • Products
  • Custom IC and RF
  • Digital Design and Signoff
  • IC Package
  • IP
  • PCB Design
  • System Analysis
  • Verification
  • All Products
  • Company
  • About Us
  • Leadership Team
  • Investor Relations
  • Alliances
  • Careers
  • Cadence Academic Network
  • Supplier
  • Media Center
  • Events
  • Newsroom
  • Designed with Cadence
  • Blogs
  • Forums
  • Contact Us
  • Send Us A Message
  • Customer Support
  • Media Relations
  • Global Office Locator

Stay Connected

Please confirm to enroll for subscription!

Stay Connected

Thank you for subscribing. You will get an email to confirm your subscription.

© 2022 Cadence Design Systems, Inc. All Rights Reserved.

  • Terms of Use
  • Privacy
  • US Trademarks
  • Do Not Sell My Personal Information