Home
  • Products
  • Solutions
  • Support
  • Company
  • EN US
    • SELECT YOUR COUNTRY OR REGION

    • China - 简体中文
    • Japan - 日本語
    • Korea - 한국어
    • Taiwan - 繁體中文

DESIGN EXCELLENCE

  • Digital Design and Signoff
  • Custom IC
  • Verification
  • IP
  • IC Package

SYSTEM INNOVATION

  • System Analysis
  • Embedded Software
  • PCB Design

PERVASIVE INTELLIGENCE

  • AI / Machine Learning
  • AI IP Portfolio

CADENCE CLOUD

VIEW ALL PRODUCTS

Digital Design and Signoff

Cadence® digital design and signoff solutions provide a fast path to design closure and better predictability, helping you meet your power, performance, and area (PPA) targets.

PRODUCT CATEGORIES

  • Logic Equivalence Checking
  • SoC Implementation and Floorplanning
  • Functional ECO
  • Low-Power Validation
  • Synthesis
  • Power Analysis
  • Constraints and CDC Signoff
  • Silicon Signoff and Verification
  • Library Characterization
  • Test

FEATURED PRODUCTS

  • Genus Synthesis Solution
  • Conformal Smart LEC
  • Innovus Implementation System
  • Tempus Timing Signoff Solution
  • Pegasus Verification System
  • RESOURCES
  • Flows

Custom IC / Analog / RF Design

Cadence® custom, analog, and RF design solutions can help you save time by automating many routine tasks, from block-level and mixed-signal simulation to routing and library characterization.

PRODUCT CATEGORIES

  • Circuit Design
  • Circuit Simulation
  • Layout Design
  • Layout Verification
  • Library Characterization
  • RF / Microwave Solutions

FEATURED PRODUCTS

  • Spectre X Simulator
  • Virtuoso RF Solution
  • Virtuoso Layout Suite
  • Virtuoso ADE Product Suite
  • Virtuoso Advanced Node
  • Voltus IC Power Integrity Solution
  • RESOURCES
  • Flows

System Design and Verification

Cadence® system design and verification solutions, integrated under our Verification Suite, provide the simulation, acceleration, emulation, and management capabilities.

PRODUCT CATEGORIES

  • Debug Analysis
  • Emulation
  • Formal and Static Verification
  • FPGA-Based Prototyping
  • Planning and Management
  • Simulation
  • Software-Driven Verification
  • Verification IP
  • System-Level Verification IP

FEATURED PRODUCTS

  • vManager Verification Management
  • JasperGold Formal Verification Platform
  • Xcelium Logic Simulation
  • Palladium Z1 Enterprise Emulation Platform
  • Protium X1 Enterprise Prototyping Platform
  • System VIP
  • RESOURCES
  • Flows

IP

An open IP platform for you to customize your app-driven SoC design.

PRODUCT CATEGORIES

  • Interface IP
  • Denali Memory IP
  • Tensilica Processor IP
  • Analog IP
  • System / Peripherals IP
  • Verification IP

IC Package Design and Analysis

Driving efficiency and accuracy in advanced packaging, system planning, and multi-fabric interoperability, Cadence® package implementation products deliver the automation and accuracy.

PRODUCT CATEGORIES

  • Cross-Platform Co-Design and Analysis
  • IC Package Design
  • SI/PI Analysis
  • SI/PI Analysis Point Tools
  • Flows

System Analysis

Cadence® system analysis solutions provide highly accurate electromagnetic extraction and simulation analysis to ensure your system works under wide-ranging operating conditions.

PRODUCT CATEGORIES

  • Electromagnetic Solutions
  • RF / Microwave Design
  • Thermal Solutions

FEATURED PRODUCTS

  • Clarity 3D Solver
  • Clarity 3D Transient Solver
  • Celsius Thermal Solver
  • Sigrity Advanced SI
  • Sigrity Advanced PI
  • RESOURCES
  • System Analysis Resources Hub

Embedded Software

PCB Design and Analysis

Cadence® PCB design solutions enable shorter, more predictable design cycles with greater integration of component design and system-level simulation for a constraint-driven flow.

PRODUCT CATEGORIES

  • Design Authoring
  • PCB Layout
  • Library and Design Data Management
  • Analog/Mixed-Signal Simulation
  • SI/PI Analysis
  • SI/PI Analysis Point Tools
  • RF / Microwave Design
  • Augmented Reality Lab Tools

FEATURED PRODUCTS

  • Allegro Package Designer Plus
  • Allegro PCB Designer
  • RESOURCES
  • What's New in Allegro
  • What's New in Sigrity
  • Advanced PCB Design & Analysis Resources Hub
  • Flows

AI / Machine Learning

AI IP Portfolio

Industries

  • 5G Systems and Subsystems
  • Aerospace and Defense
  • Automotive
  • AI / Machine Learning

Technologies

  • 3D-IC Design
  • Advanced Node
  • Arm-Based Solutions
  • Cloud Solutions
  • Low Power
  • Mixed Signal
  • Photonics
  • RF / Microwave
See how our customers create innovative products with Cadence

Support

  • Support Process
  • Online Support
  • Software Downloads
  • Computing Platform Support
  • Customer Support Contacts
  • Technical Forums

Training

  • Custom IC / Analog / RF Design
  • Languages and Methodologies
  • Digital Design and Signoff
  • IC Package
  • PCB Design
  • System Design and Verification
  • Tensilica Processor IP
Stay up to date with the latest software 24/7 - Cadence Online Support Visit Now

Corporate

  • About Us
  • Designed with Cadence
  • Investor Relations
  • Leadership Team
  • Computational Software
  • Alliances
  • Corporate Social Responsibility
  • Cadence Academic Network

Media Center

  • Events
  • Newsroom
  • Blogs

Culture and Careers

  • Culture and Diversity
  • Careers
Learn how Intelligent System Design™ powers future technologies Browse Cadence’s latest on-demand sessions and upcoming events. Explore More
US - English
  • China - 简体中文
  • Japan - 日本語
  • Korea - 한국어
  • Taiwan - 繁體中文
  • Products
    • DESIGN EXCELLENCE
      • Digital Design and Signoff
        • PRODUCT CATEGORIES
          • Logic Equivalence Checking
          • SoC Implementation and Floorplanning
          • Functional ECO
          • Low-Power Validation
          • Synthesis
          • Power Analysis
          • Constraints and CDC Signoff
          • Silicon Signoff and Verification
          • Library Characterization
          • Test
        • FEATURED PRODUCTS
          • Genus Synthesis Solution
          • Conformal Smart LEC
          • Innovus Implementation System
          • Tempus Timing Signoff Solution
          • Pegasus Verification System
          • RESOURCES
          • Flows
      • Custom IC / Analog / RF Design
        • PRODUCT CATEGORIES
          • Circuit Design
          • Circuit Simulation
          • Layout Design
          • Layout Verification
          • Library Characterization
          • RF / Microwave Solutions
        • FEATURED PRODUCTS
          • Spectre X Simulator
          • Virtuoso RF Solution
          • Virtuoso Layout Suite
          • Virtuoso ADE Product Suite
          • Virtuoso Advanced Node
          • Voltus IC Power Integrity Solution
          • RESOURCES
          • Flows
      • System Design and Verification
        • PRODUCT CATEGORIES
          • Debug Analysis
          • Emulation
          • Formal and Static Verification
          • FPGA-Based Prototyping
          • Planning and Management
          • Simulation
          • Software-Driven Verification
          • Verification IP
          • System-Level Verification IP
        • FEATURED PRODUCTS
          • vManager Verification Management
          • JasperGold Formal Verification Platform
          • Xcelium Logic Simulation
          • Palladium Z1 Enterprise Emulation Platform
          • Protium X1 Enterprise Prototyping Platform
          • System VIP
          • RESOURCES
          • Flows
      • IP
        • PRODUCT CATEGORIES
          • Interface IP
          • Denali Memory IP
          • Tensilica Processor IP
          • Analog IP
          • System / Peripherals IP
          • Verification IP
      • IC Package Design and Analysis
        • PRODUCT CATEGORIES
          • Cross-Platform Co-Design and Analysis
          • IC Package Design
          • SI/PI Analysis
          • SI/PI Analysis Point Tools
          • Flows
    • SYSTEM INNOVATION
      • System Analysis
        • PRODUCT CATEGORIES
          • Electromagnetic Solutions
          • RF / Microwave Design
          • Thermal Solutions
        • FEATURED PRODUCTS
          • Clarity 3D Solver
          • Clarity 3D Transient Solver
          • Celsius Thermal Solver
          • Sigrity Advanced SI
          • Sigrity Advanced PI
          • RESOURCES
          • System Analysis Resources Hub
      • Embedded Software
      • PCB Design and Analysis
        • PRODUCT CATEGORIES
          • Design Authoring
          • PCB Layout
          • Library and Design Data Management
          • Analog/Mixed-Signal Simulation
          • SI/PI Analysis
          • SI/PI Analysis Point Tools
          • RF / Microwave Design
          • Augmented Reality Lab Tools
        • FEATURED PRODUCTS
          • Allegro Package Designer Plus
          • Allegro PCB Designer
          • RESOURCES
          • What's New in Allegro
          • What's New in Sigrity
          • Advanced PCB Design & Analysis Resources Hub
          • Flows
    • PERVASIVE INTELLIGENCE
      • AI / Machine Learning
      • AI IP Portfolio
    • CADENCE CLOUD
    • VIEW ALL PRODUCTS
  • Solutions
      • Industries
        • 5G Systems and Subsystems
        • Aerospace and Defense
        • Automotive
        • AI / Machine Learning
      • Technologies
        • 3D-IC Design
        • Advanced Node
        • Arm-Based Solutions
        • Cloud Solutions
        • Low Power
        • Mixed Signal
        • Photonics
        • RF / Microwave
      • Industries
        • 5G Systems and Subsystems
        • Aerospace and Defense
        • Automotive
        • AI / Machine Learning
      • Technologies
        • 3D-IC Design
        • Advanced Node
        • Arm-Based Solutions
        • Cloud Solutions
        • Low Power
        • Mixed Signal
        • Photonics
        • RF / Microwave
      • Industries
        • 5G Systems and Subsystems
        • Aerospace and Defense
        • Automotive
        • AI / Machine Learning
      • Technologies
        • 3D-IC Design
        • Advanced Node
        • Arm-Based Solutions
        • Cloud Solutions
        • Low Power
        • Mixed Signal
        • Photonics
        • RF / Microwave
  • Support
      • Support
        • Support Process
        • Online Support
        • Software Downloads
        • Computing Platform Support
        • Customer Support Contacts
        • Technical Forums
      • Training
        • Custom IC / Analog / RF Design
        • Languages and Methodologies
        • Digital Design and Signoff
        • IC Package
        • PCB Design
        • System Design and Verification
        • Tensilica Processor IP
      • Support
        • Support Process
        • Online Support
        • Software Downloads
        • Computing Platform Support
        • Customer Support Contacts
        • Technical Forums
      • Training
        • Custom IC / Analog / RF Design
        • Languages and Methodologies
        • Digital Design and Signoff
        • IC Package
        • PCB Design
        • System Design and Verification
        • Tensilica Processor IP
      • Support
        • Support Process
        • Online Support
        • Software Downloads
        • Computing Platform Support
        • Customer Support Contacts
        • Technical Forums
      • Training
        • Custom IC / Analog / RF Design
        • Languages and Methodologies
        • Digital Design and Signoff
        • IC Package
        • PCB Design
        • System Design and Verification
        • Tensilica Processor IP
  • Company
      • Corporate
        • About Us
        • Designed with Cadence
        • Investor Relations
        • Leadership Team
        • Computational Software
        • Alliances
        • Corporate Social Responsibility
        • Cadence Academic Network
      • Media Center
        • Events
        • Newsroom
        • Blogs
      • Culture and Careers
        • Culture and Diversity
        • Careers
      • Corporate
        • About Us
        • Designed with Cadence
        • Investor Relations
        • Leadership Team
        • Computational Software
        • Alliances
        • Corporate Social Responsibility
        • Cadence Academic Network
      • Media Center
        • Events
        • Newsroom
        • Blogs
      • Culture and Careers
        • Culture and Diversity
        • Careers
      • Corporate
        • About Us
        • Designed with Cadence
        • Investor Relations
        • Leadership Team
        • Computational Software
        • Alliances
        • Corporate Social Responsibility
        • Cadence Academic Network
      • Media Center
        • Events
        • Newsroom
        • Blogs
      • Culture and Careers
        • Culture and Diversity
        • Careers

5G Handset

  • 5G Systems and Subsystems
  • 5G Handset
  • 5G Radiohead
  • 5G Baseband and Edge Computing
  • 5G Fronthaul and Backhaul

5G RF module designs for handsets can exploit the very large bandwidth offered by millimeter wave (mmWave), but must also meet significant challenges in linearity, power, and heat necessary to be successful in the handset market. You face intense pressure on form factor with tight integration of RFICs, baseband, power management, discretes, and multiple-input/multiple-output (MIMO) antenna arrays with advanced packaging. And as more bands are added and repurposed for 5G over the next five years or so, there’s an evolution opportunity to improve the modules further, for performance, power, and area (PPA).

RF Module Designs

To achieve such low-power multi-standard modules in such densely packed form factors at such high frequencies takes a new class of RF design tool. For this, we created the Cadence® Virtuoso® RF Solution for co-design of RFIC, package, and module substrates using a free mix of GaAs, GaN, and Si transceiver technologies, developed with the Cadence AWR Design Environment platform. 

For initial 5G rollout utilizing existing 4G infrastructure, i.e., 5G NSA (non-standalone), handset data will be 5G and control will be 4G. Potential harmonic interference between the two standards must be addressed through careful filter and power amplifier (PA) design. 5G PA design needs integrated envelope tracking, average power tracking, and back off to maximize handset battery life and the linearity demanded by dense 5G modulation schemes. To address this, the Spectre® X Simulator provides fast simulation speeds and golden accuracy with up to 10X performance improvement.

The Cadence Low-Power Solution ensures power minimization for handset 5G module IC design. This comprehensive solution encompasses architecture optimization, power estimation and analysis, functional verification, implementation and signoff, and IP for digital and mixed-signal designs at both the chip and system level.

Designers can conduct thermal analysis and electromagnetic analysis of the RF module with Cadence electromagnetic solutions and Cadence thermal solutions.

The new 5G capabilities also require new high-performance, low-power digital blocks such as beamforming engines, channelizers, and signal conditioners. These highly algorithmic blocks are naturally modeled in C++ or SystemC®, which Cadence Stratus™ High-Level Synthesis (HLS) synthesizes to highly efficient low-power RTL for implementation with the Cadence Low-Power Solution. Moreover, with Stratus HLS, these same algorithmic blocks can be retargeted for other 5G applications with different requirements, ranging from ultra-Iow-power IoT sensors to high-performance basestations.

Tensilica IP

For digital baseband precoding/combining, beam measurement, and tracking in the 5G transceiver design, Cadence provides the Tensilica® ConnX B20 DSP IP, utilizing the latest Tensilica NX architecture for the 10Gbs and above data rates needed for 5G.

The Tensilica IP provides the needed throughput for 5G handset uplink and downlink, covering the functions of the New Radio-Physical Uplink Control Channel (NR-PUCCH), Uplink Shared Channel (NR-PUSCH), Random Access Channel (NR-PRACH), Downlink Control Channel (NR-PDCCH), and Broadcast Channel (NR-PBCH).

Verification of Chips, Packages and Board Designs

To verify the chip, package, or board designs, Cadence offers verification tools and hardware to speed these complex and very important tasks. The Cadence Palladium® Enterprise Emulation Platform is essential for emulating the design before the chip is finalized. Chip designs can be prototyped using the Cadence Protium™ S1 FPGA-Based Prototyping Platform, which enables early software validation and firmware development. The entire Cadence Verification Suite speeds chip verification, and our Sigrity™ signal integrity (SI) and power integrity (PI) integrated solutions enable fast validation of packages and board.

Tell Me More About 5G
  • Related Products

    • Virtuoso RF Solution
    • Protium S1 Desktop Prototyping Platform
    • Electromagnetic Solvers
    • Thermal Solutions
    • Stratus High-Level Synthesis
    • SI/PI Analysis
    • Cadence Verification Suite
    • Tensilica ConnX B20 DSP
News ReleasesVIEW ALL
  • Cadence Completes Acquisition of NUMECA 02/24/2021

  • Cadence's Lip-Bu Tan to Present at Morgan Stanley Conference 02/23/2021

  • Cadence Reports Fourth Quarter and Fiscal Year 2020 Financial Results 02/22/2021

  • Cadence Announces $5M Endowment at Massachusetts Institute of Technology 02/02/2021

  • Cadence to Acquire NUMECA to Expand System Analysis Capabilities with Computational Fluid Dynamics 01/20/2021

Blogs VIEW ALL

A Great Place to Do Great Work!

Sixth year on the FORTUNE 100 list

Our Culture Join The Team
  • Products
  • Custom IC and RF
  • Digital Design and Signoff
  • IC Package
  • IP
  • PCB Design
  • System Analysis
  • Verification
  • All Products
  • Company
  • About Us
  • Leadership Team
  • Investor Relations
  • Alliances
  • Careers
  • Cadence Academic Network
  • Supplier
  • Media Center
  • Events
  • Newsroom
  • Designed with Cadence
  • Blogs
  • Forums
  • Contact Us
  • General Inquiry
  • Customer Support
  • Media Relations
  • Global Office Locator

Stay Connected

Please confirm to enroll for subscription!

Stay Connected

Thank you for subscribing. You will get an email to confirm your subscription.

© 2021 Cadence Design Systems, Inc. All Rights Reserved.

Terms of Use Privacy US Trademarks Do Not Sell My Personal Information