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  • China - 简体中文
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  • Korea - 한국어
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  • Products
    • DESIGN EXCELLENCE
      • Digital Design and Signoff
        • PRODUCT CATEGORIES
          • Logic Equivalence Checking
          • SoC Implementation and Floorplanning
          • Functional ECO
          • Low-Power Validation
          • Synthesis
          • Power Analysis
          • Constraints and CDC Signoff
          • Silicon Signoff and Verification
          • Library Characterization
          • Test
        • FEATURED PRODUCTS
          • Integrity 3D-IC Platform
          • Cadence Cerebrus Intelligent Chip Explorer
          • Genus Synthesis Solution
          • Innovus Implementation System
          • Tempus Timing Signoff Solution
          • Voltus IC Power Integrity Solution
          • Pegasus Verification System
          • RESOURCES
          • Flows
      • Custom IC / Analog / RF Design
        • PRODUCT CATEGORIES
          • Circuit Design
          • Circuit Simulation
          • Layout Design
          • Layout Verification
          • Library Characterization
          • RF / Microwave Solutions
        • FEATURED PRODUCTS
          • Spectre X Simulator
          • Spectre FX Simulator
          • Virtuoso Layout Suite
          • Virtuoso ADE Product Suite
          • Virtuoso Advanced Node
          • Voltus-Fi Custom Power Integrity Solution
          • RESOURCES
          • Flows
      • Verification
        • PRODUCT CATEGORIES
          • Debug Analysis
          • Virtual Prototyping
          • Emulation and Prototyping
          • Static and Formal Verification
          • Planning and Management
          • Simulation
          • Software-Driven Verification
          • Verification IP
          • System-Level Verification IP
        • FEATURED PRODUCTS
          • vManager Verification Management
          • Jasper C Apps
          • Helium Virtual and Hybrid Studio
          • Xcelium Logic Simulation
          • Palladium Enterprise Emulation
          • Protium Enterprise Prototyping
          • System VIP
          • RESOURCES
          • Flows
      • IP
        • PRODUCT CATEGORIES
          • 112G/56G SerDes
          • Chiplet and D2D
          • Denali Memory Interface and Storage IP
          • Interface IP
          • PCIe and CXL
          • Tensilica Processor IP
        • RESOURCES
          • Discover PCIe
      • IC Package Design and Analysis
        • PRODUCT CATEGORIES
          • Cross-Platform Co-Design and Analysis
          • IC Package Design
          • SI/PI Analysis
          • SI/PI Analysis Point Tools
          • Flows
    • SYSTEM INNOVATION
      • Multiphysics System Analysis
        • PRODUCT CATEGORIES
          • Computational Fluid Dynamics
          • Electromagnetic Solutions
          • RF / Microwave Design
          • Signal and Power Integrity
          • Thermal Solutions
        • FEATURED PRODUCTS
          • Clarity 3D Solver
          • Clarity 3D Solver Cloud
          • Clarity 3D Transient Solver
          • Celsius Thermal Solver
          • Fidelity CFD
          • Sigrity Advanced SI
          • Celsius Advanced PTI
          • RESOURCES
          • System Analysis Center
          • System Analysis Resources Hub
          • AWR Free Trial
      • Embedded Software
      • PCB Design and Analysis
        • PRODUCT CATEGORIES
          • Design Authoring
          • PCB Layout
          • Library and Design Data Management
          • Analog/Mixed-Signal Simulation
          • SI/PI Analysis
          • SI/PI Analysis Point Tools
          • RF / Microwave Design
          • Augmented Reality Lab Tools
        • FEATURED PRODUCTS
          • Allegro Package Designer Plus
          • Allegro PCB Designer
          • Allegro X Design Platform
          • RESOURCES
          • What's New in Allegro
          • Advanced PCB Design & Analysis Resources Hub
          • Flows
      • Computational Fluid Dynamics
    • PERVASIVE INTELLIGENCE
      • AI / Machine Learning
      • AI IP Portfolio
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        • Arm-Based Solutions
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      • Industries
        • 5G Systems and Subsystems
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      • Industries
        • 5G Systems and Subsystems
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        • Hyperscale Computing
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        • 3D-IC Design
        • Advanced Node
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        • Arm-Based Solutions
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5G Fronthaul and Backhaul

  • 5G Systems and Subsystems
  • 5G Handset
  • 5G Radiohead
  • 5G Baseband and Edge Computing
  • 5G Fronthaul and Backhaul

Radiohead and baseband will no longer be found at the top and bottom of mobile operators’ masts for 5G, but relocated even deeper into the fabric of cities and buildings and into edge computing datacenters, respectively. This significant increase in their physical separation, combined with the ultra-low latency targets for 5G, means the connection of the two (fronthaul) needs a fresh approach.

To meet 5G fronthaul timing, frequency, and synchronization requirements, high-speed optical interconnect and optical transceivers for remote radioheads and baseband offer a solution, and silicon photonics provides a high-performance design fabric for optical transceiver design. The Cadence partnership with Lumerical provides the familiar Cadence® Virtuoso® environment for silicon photonic design, and silicon photonic and electronic co-design needed for optical transceivers.

Time-Sensitive Networking Ethernet is the appropriate protocol for potentially complicated 5G fronthaul connectivity to multiple radioheads, for which Cadence provides up to 100G Ethernet IP supporting IEEE 1588 Precision Time Protocol and TSN profile IEEE 802.1AS.

Tell Me More About 5G
  • Related Products

    • Photonics
    • Ethernet IP
News ReleasesVIEW ALL
  • New Cadence Xcelium Apps Accelerate Simulation-Based Verification for Automotive, Mobile and Hyperscale Designs 06/29/2022

  • Cadence Expands Collaboration with Arm to Accelerate Mobile Device Silicon Success 06/28/2022

  • Cadence and Intel Foundry Services Collaborate to Accelerate Innovation with Scalable and Proven Cadence Cloud Solutions 06/28/2022

  • Cadence Achieves PCIe 5.0 Specification Compliance for PHY and Controller IP in TSMC Advanced Technologies 06/21/2022

  • Cadence Announces $100 Million Accelerated Share Repurchase Agreement 06/21/2022

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