Filter Results:
Power-Aware Analysis Solution Whitepaper
By reviewing the classic (or traditional) signal integrity (SI) methodology, analyzing high-speed design flows, and examining what is employed in Cadence® Sigrity™ power and signal simulations using the SP...
442 KB
Addressing the “Power-Aware” Challenges of Memory Interface Designs Technical Paper
One of the toughest challenges in designing memory interfaces is accurately measuring timing while also considering fluctuations in power and ground rails due to simultaneously switching signals. Signal in...
2 MB
CAE Flow in the Development for the Digital Equipments Conference Presentation
This conference paper presentation from Toshiba discussed using OptimizePI to reduce time spent on optimizing decoupling capacitors and SPEED2000 to address EMI/EMC concerns.
1 MB
Using Signal Integrity Analysis to Achieve EMC
In the area of high-speed design, power and signal integrity pose increasing challenges to PCB designers. It is necessary to analyze the power and signal integrity issues at the upfront design level before...
367 KB
Effects of Power Ground Via Distribution on the Power Ground Performance of C4 BGA Packages Conference Paper
The effects of the distribution of power and ground vias in C4/BGA type of packages are studied. Two types of via distributions are evaluated. One type is that vias are concentrated in the core area. The o...
431 KB
Shorting Via Arrays for the Elimination of Package Resonance to Reduce Power Supply Noise in Multi-layered Area-Array IC Packages Conference Paper
This paper presents full-wave electromagnetic field simulations on the effects of shorting via arrays for the reduction of power and ground noise in IC packages. Properties of internal resonance in multi-l...
211 KB
The Facts about the Input Impedance of Power and Ground Planes Conference Paper
Power and ground planes in a printed circuit board may connect to the power supply at several locations. Moreover, a number of decoupling capacitors may be connected to the power and ground planes. As one ...
206 KB
Modeling of the Electrical Performance of the Power and Ground Supply for a PC Microprocessor on a Card Conference Paper
The electrical characteristics of the power and ground supply of a PC microprocessor packaged in a Ball Grid Array (BGA) package mounted on a card are studied by dynamic electromagnetic field analysis. The...
225 KB
Cadence Sigrity 2018 Release Accelerates PCB Design Cycles by Integrating 3D Design and 3D Analysis
Cadence announced its Cadence® Sigrity™ 2018 release, which includes new 3D capabilities that enable PCB design teams to accelerate design cycles while optimizing cost and performance.
19 Jul 2018
Cadence and Spreadtrum Collaborate on Virtual Reference Design Kit to Reduce Customers' Design Cycle by Up to 12 Weeks
Cadence and Spreadtrum have developed a virtual reference design kit specific to Spreadtrum's SC9830A quad-core system-on-chip (SoC) platform requirements
02 Dec 2015
Display: