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  • Products
    • DESIGN EXCELLENCE
      • Digital Design and Signoff
        • PRODUCT CATEGORIES
          • Logic Equivalence Checking
          • SoC Implementation and Floorplanning
          • Functional ECO
          • Low-Power Validation
          • Synthesis
          • Power Analysis
          • Constraints and CDC Signoff
          • Silicon Signoff and Verification
          • Library Characterization
          • Test
        • FEATURED PRODUCTS
          • Genus Synthesis Solution
          • Conformal Smart LEC
          • Innovus Implementation System
          • Tempus Timing Signoff Solution
          • Pegasus Verification System
          • RESOURCES
          • Flows
      • Custom IC / Analog / RF Design
        • PRODUCT CATEGORIES
          • Circuit Design
          • Circuit Simulation
          • Layout Design
          • Layout Verification
          • Library Characterization
          • RF / Microwave Solutions
        • FEATURED PRODUCTS
          • Spectre X Simulator
          • Virtuoso RF Solution
          • Virtuoso Layout Suite
          • Virtuoso ADE Product Suite
          • Virtuoso Advanced Node
          • Voltus IC Power Integrity Solution
          • RESOURCES
          • Flows
      • System Design and Verification
        • PRODUCT CATEGORIES
          • Debug Analysis
          • Emulation
          • Formal and Static Verification
          • FPGA-Based Prototyping
          • Planning and Management
          • Simulation
          • Software-Driven Verification
          • Verification IP
          • System-Level Verification IP
        • FEATURED PRODUCTS
          • vManager Verification Management
          • JasperGold Formal Verification Platform
          • Xcelium Logic Simulation
          • Palladium Z1 Enterprise Emulation Platform
          • Protium X1 Enterprise Prototyping Platform
          • System VIP
          • RESOURCES
          • Flows
      • IP
        • PRODUCT CATEGORIES
          • Interface IP
          • Denali Memory IP
          • Tensilica Processor IP
          • Analog IP
          • System / Peripherals IP
          • Verification IP
      • IC Package Design and Analysis
        • PRODUCT CATEGORIES
          • Cross-Platform Co-Design and Analysis
          • IC Package Design
          • SI/PI Analysis
          • SI/PI Analysis Point Tools
          • Flows
    • SYSTEM INNOVATION
      • System Analysis
        • PRODUCT CATEGORIES
          • Electromagnetic Solutions
          • RF / Microwave Design
          • Thermal Solutions
        • FEATURED PRODUCTS
          • Clarity 3D Solver
          • Clarity 3D Transient Solver
          • Celsius Thermal Solver
          • Sigrity Advanced SI
          • Sigrity Advanced PI
          • RESOURCES
          • System Analysis Resources Hub
      • Embedded Software
      • PCB Design and Analysis
        • PRODUCT CATEGORIES
          • Design Authoring
          • PCB Layout
          • Library and Design Data Management
          • Analog/Mixed-Signal Simulation
          • SI/PI Analysis
          • SI/PI Analysis Point Tools
          • RF / Microwave Design
          • Augmented Reality Lab Tools
        • FEATURED PRODUCTS
          • Allegro Package Designer Plus
          • Allegro PCB Designer
          • RESOURCES
          • What's New in Allegro
          • What's New in Sigrity
          • Advanced PCB Design & Analysis Resources Hub
          • Flows
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      • AI IP Portfolio
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  • 14 Jan 20

Cadence Expands Collaboration with Broadcom for 5nm and 7nm Designs

SAN JOSE, Calif., 14 Jan 2020

Highlights:

  • Successful 7nm designs with Cadence digital technology lead to broader collaboration
  • Cadence digital implementation solutions and technology leadership drive expanded usage on 5/7nm designs

Cadence Design Systems, Inc. (Nasdaq: CDNS) today announced that it expanded its collaboration with Broadcom Inc. for the creation of semiconductor solutions targeting next-generation networking, broadband, enterprise storage, wireless and industrial applications. Building upon successful 7nm designs, Cadence and Broadcom are expanding the collaboration to include the creation of 5nm designs using Cadence® digital implementation solutions. With these Cadence solutions in place, Broadcom can further augment engineering productivity and improve silicon performance and power.

“As a global infrastructure technology leader, we’re committed to delivering innovative products that enable our customers to excel in their respective markets,” said Yuan Xing Lee, vice president and head, Central Engineering at Broadcom Inc. “With Cadence as a key silicon design partner, we’re able to achieve our power and performance goals and provide our customers with the highest quality solutions that they’ve come to expect from us.”

“We’ve collaborated with Broadcom for many years, and our expanded partnership on advanced-node design development is a result of the series of successes we’ve had together over time and our overall digital technology leadership,” said Dr. Anirudh Devgan, president of Cadence. “Given the continued proliferation of networking, broadband, enterprise storage, wireless and industrial applications, we’re dedicated to ensuring that Broadcom achieves design excellence using our latest toolsets to fuel design innovation.”

The Cadence digital implementation solutions are part of the broader digital suite, which provides optimal power, performance and area (PPA) and reduced turnaround time. The tools support Cadence’s Intelligent System Design™ strategy, which enables systems and semiconductor companies to achieve system-on-chip (SoC) design excellence more efficiently. For more information on the digital suite, visit www.cadence.com/go/dspr.

About Cadence

Cadence enables electronic systems and semiconductor companies to create the innovative end products that are transforming the way people live, work and play. Cadence® software, hardware and semiconductor IP are used by customers to deliver products to market faster. The company’s Intelligent System Design strategy helps customers develop differentiated products—from chips to boards to intelligent systems—in mobile, consumer, cloud, data center, automotive, aerospace, IoT, industrial and other market segments. Cadence is listed as one of Fortune Magazine's 100 Best Companies to Work For. Learn more at www.cadence.com.

For more information, please contact:

Cadence Newsroom
408-944-7039
newsroom@cadence.com

© 2020 Cadence Design Systems, Inc. All rights reserved worldwide. Cadence, the Cadence logo and the other Cadence marks found at www.cadence.com/go/trademarks are trademarks or registered trademarks of Cadence Design Systems, Inc. All other trademarks are the property of their respective owners.

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