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  • Products
    • DESIGN EXCELLENCE
      • Digital Design and Signoff
        • PRODUCT CATEGORIES
          • Logic Equivalence Checking
          • SoC Implementation and Floorplanning
          • Functional ECO
          • Low-Power Validation
          • Synthesis
          • Power Analysis
          • Constraints and CDC Signoff
          • Silicon Signoff and Verification
          • Library Characterization
          • Test
        • FEATURED PRODUCTS
          • Genus Synthesis Solution
          • Conformal Smart LEC
          • Innovus Implementation System
          • Tempus Timing Signoff Solution
          • Pegasus Verification System
          • RESOURCES
          • Flows
      • Custom IC / Analog / RF Design
        • PRODUCT CATEGORIES
          • Circuit Design
          • Circuit Simulation
          • Layout Design
          • Layout Verification
          • Library Characterization
          • RF / Microwave Solutions
        • FEATURED PRODUCTS
          • Spectre X Simulator
          • Virtuoso RF Solution
          • Virtuoso Layout Suite
          • Virtuoso ADE Product Suite
          • Virtuoso Advanced Node
          • Voltus IC Power Integrity Solution
          • RESOURCES
          • Flows
      • System Design and Verification
        • PRODUCT CATEGORIES
          • Debug Analysis
          • Emulation
          • Formal and Static Verification
          • FPGA-Based Prototyping
          • Planning and Management
          • Simulation
          • Software-Driven Verification
          • Verification IP
          • System-Level Verification IP
        • FEATURED PRODUCTS
          • vManager Verification Management
          • JasperGold Formal Verification Platform
          • Xcelium Logic Simulation
          • Palladium Z1 Enterprise Emulation Platform
          • Protium X1 Enterprise Prototyping Platform
          • System VIP
          • RESOURCES
          • Flows
      • IP
        • PRODUCT CATEGORIES
          • Interface IP
          • Denali Memory IP
          • Tensilica Processor IP
          • Analog IP
          • System / Peripherals IP
          • Verification IP
      • IC Package Design and Analysis
        • PRODUCT CATEGORIES
          • Cross-Platform Co-Design and Analysis
          • IC Package Design
          • SI/PI Analysis
          • SI/PI Analysis Point Tools
          • Flows
    • SYSTEM INNOVATION
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        • PRODUCT CATEGORIES
          • Electromagnetic Solutions
          • RF / Microwave Design
          • Thermal Solutions
        • FEATURED PRODUCTS
          • Clarity 3D Solver
          • Clarity 3D Transient Solver
          • Celsius Thermal Solver
          • Sigrity Advanced SI
          • Sigrity Advanced PI
          • RESOURCES
          • System Analysis Resources Hub
      • Embedded Software
      • PCB Design and Analysis
        • PRODUCT CATEGORIES
          • Design Authoring
          • PCB Layout
          • Library and Design Data Management
          • Analog/Mixed-Signal Simulation
          • SI/PI Analysis
          • SI/PI Analysis Point Tools
          • RF / Microwave Design
          • Augmented Reality Lab Tools
        • FEATURED PRODUCTS
          • Allegro Package Designer Plus
          • Allegro PCB Designer
          • RESOURCES
          • What's New in Allegro
          • What's New in Sigrity
          • Advanced PCB Design & Analysis Resources Hub
          • Flows
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      • AI IP Portfolio
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  • 15 Jun 2020

Cadence Collaborates with TSMC and Microsoft to Reduce Semiconductor Design Timing Signoff Schedules with the Cloud

SAN JOSE, Calif., 15 Jun 2020

Highlights:

  • Collaboration provides an accelerated path for customers to complete timing signoff by adopting Cadence signoff solutions using TSMC technology on the Microsoft Azure cloud with the Cadence CloudBurst Platform
  • Customers creating complex advanced-node designs benefit from improved productivity due to the scalable, elastic compute offered by the cloud
  • Cadence Quantus Extraction Solution demonstrated near-linear scalability through 64 CPUs using multi-corner extraction
  • Cadence Tempus Timing Signoff Solution demonstrated scalability on 150 machines for the fastest TAT and methods that reduce timing signoff machine costs by 2X

Cadence Design Systems, Inc. (Nasdaq: CDNS) today announced the results of a three-way collaboration with TSMC and Microsoft focused on utilizing cloud infrastructure to reduce semiconductor design signoff schedules. Through this collaboration, common customers will have an accelerated path to complete timing signoff by adopting the Cadence® Tempus™ Timing Signoff Solution and the Quantus™ Extraction Solution using TSMC technologies on the Microsoft Azure Cloud with the Cadence CloudBurst™ Platform. By moving to the cloud, users from all vertical markets can achieve a significant productivity improvement without the constraints of on-premise hardware.

For details on the collaboration, a white paper is available immediately for customer download at TSMC-Online (https://online.tsmc.com/). The white paper contains cloud scaling strategies, detailed illustrations of the Cadence Tempus Timing Signoff Solution and Quantus Extraction Solution cloud execution, sample scripts and Microsoft’s Azure cloud IT best practices.

“Semiconductor designers are meeting or exceeding their power and performance requirements using advanced process technology. However, the increasingly complex advanced-node signoff requirements make it challenging to meet tight product schedules,” said Suk Lee, senior director of the Design Infrastructure Management Division at TSMC. “Working with Microsoft and Cadence, our cloud alliance has harnessed the scalability of the cloud with Cadence timing signoff solutions to ensure that our common customers can beat their performance goals and accelerate time to market for their silicon innovations.”

Mujtaba Hamid, head of product management, Silicon, Electronics and Gaming at Microsoft Azure added, “Microsoft’s Azure Cloud platform is ideally suited for high-performance-compute (HPC) applications such as silicon design and signoff. We look forward to collaborating with Cadence and TSMC customers on their silicon HPC needs and enabling these customers to deliver the highest quality products and achieve their time-to-market goals.”

Timing Signoff in the Cloud

Both the Cadence Tempus Timing Signoff Solution and Quantus Extraction Solution feature massively parallel architectures that are optimal for use in the cloud. Utilizing unique distributed signoff technologies, the Tempus Timing Signoff Solution is production-proven in the cloud on large-scale TSMC advanced-node tapeouts.

“Through our continued collaboration with TSMC and Microsoft, we’re making it easy for customers to offload their Tempus Timing Signoff Solution and Quantus Extraction Solution workloads to the cloud and reap the full benefits of our scalable solutions,” said Dr. Chin-Chi Teng, Senior Vice President and General Manager of the Digital & Signoff Group at Cadence. “Customers creating the most complex designs for today’s emerging market segments can look to the cloud to streamline their processes and provide a competitive advantage.”

The Cadence Tempus Timing Signoff Solution and Quantus Extraction Solution are part of the broader full flow digital suite, which provides customers with a fast path to design closure and better predictability. The CloudBurst Platform provides fast and easy access to Cadence tools and is part of the broader Cadence Cloud Portfolio. The digital and cloud portfolios support the Cadence Intelligent System Design™ strategy that enables customers to achieve system-on-chip (SoC) design excellence.

About Cadence

Cadence is a pivotal leader in electronic design, building upon more than 30 years of computational software expertise. The company applies its underlying Intelligent System Design strategy to deliver software, hardware and IP that turn design concepts into reality. Cadence customers are the world’s most innovative companies, delivering extraordinary electronic products from chips to boards to systems for the most dynamic market applications including consumer, hyperscale computing, 5G communications, automotive, aerospace, industrial and health. For six years in a row, Fortune Magazine has named Cadence one of the 100 Best Companies to Work For. Learn more at cadence.com.

For more information, please contact:

Cadence Newsroom
408-944-7039
newsroom@cadence.com

© 2020 Cadence Design Systems, Inc. All rights reserved worldwide. Cadence, the Cadence logo and the other Cadence marks found at www.cadence.com/go/trademarks are trademarks or registered trademarks of Cadence Design Systems, Inc. All other trademarks are the property of their respective owners.

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