• Skip to main content
  • Skip to search
  • Skip to footer
Cadence Home
  • Products
  • Solutions
  • Support
  • Company

Free Trials

Cadence.AI

  • Millennium Platform

    AI-driven digital twin supercomputer

  • Cadence Cerebrus AI Studio

    Multi-block, multi-user SoC design platform

  • Optimality Intelligent System Explorer

    AI-driven Multiphysics analysis

  • Verisium Verification Platform

    AI-driven verification platform

  • Allegro X AI

    AI-driven PCB Design

  • Tensilica AI Platform

    On-device AI IP

IC Design & Verification

  • Virtuoso Studio

    Analog and custom IC design

  • Spectre Simulation

    Analog and mixed-signal SoC verification

  • Innovus+ Platform

    Synthesis and implementation for advanced nodes

  • Xcelium Logic Simulation

    IP and SoC design verification

  • Silicon Solutions

    Protocol IP and Compute IP, including Tensilica IP

  • Palladium and Protium

    Emulation and prototyping platforms

System Design & Analysis

  • Allegro X Design Platform

    System and PCB design platform

  • Allegro X Adv Package Designer Platform

    IC packaging design and analysis platform

  • Sigrity X Platform

    Signal and power integrity analysis platform

  • AWR Design Environment Platform

    RF and microwave development platform

  • Cadence Reality Digital Twin Platform

    Data center design and management platform

  • Fidelity CFD Platform

    Computational fluid dynamics platform

  • All Analog IC Design Products

  • All Verification Products

  • All Digital Design and Signoff Products

  • All 3D-IC Design Products

  • All PCB Design Products

  • All 3D Electromagnetic Analysis Products

  • All Thermal Analysis Products

  • All Molecular Simulation Products

  • All Cadence Cloud Services and Solutions

  • All Products (A-Z)

Industries

  • 5G Systems and Subsystems
  • Aerospace and Defense
  • Automotive
  • Data Center Solutions
  • Hyperscale Computing
  • Life Sciences

Services

  • Services Overview

Technologies

  • Artificial Intelligence
  • 3D-IC Design
  • Advanced Node
  • Arm-Based Solutions
  • Cloud Solutions
  • Computational Fluid Dynamics
  • Functional Safety
  • Low Power
  • Mixed-signal
  • Molecular Simulation
  • Multiphysics System Analysis
  • Photonics
  • RF / Microwave
Designed with Cadence See how our customers create innovative products with Cadence
Explore Cadence Cloud Now Explore Cadence Cloud Now

Support

  • Support Process
  • Online Support
  • Software Downloads
  • Computing Platform Support
  • Customer Support Contacts
  • Community Forums
  • OnCloud Help Center
  • Doc Assistant

Training

  • Computational Fluid Dynamics Courses
  • Custom IC / Analog / Microwave & RF Design Courses
  • Digital Design and Signoff Courses
  • IC Package Courses
  • Languages and Methodologies Courses
  • Mixed-Signal Design Modeling, Simulation, and Verification
  • Onboarding Curricula
  • PCB Design Courses
  • Reality DC
  • System Design and Verification Courses
  • Tech Domain Certification Programs
  • Tensilica Processor IP Courses
Stay up to date with the latest software
Cadence award-winning online support available 24/7
Connect with expert users in our Community Forums

Corporate

  • About Us
  • Designed with Cadence
  • Investor Relations
  • Leadership Team
  • Computational Software
  • Alliances
  • Channel Partners
  • Technology Partners
  • Corporate Social Responsibility
  • Cadence Academic Network
  • Intelligent System Design

Culture and Careers

  • Careers
  • Culture
  • One Team

Media Center

  • Cadence Events
  • Events
  • Newsroom
  • Blogs
Cadence Giving Foundation
Premier Cadence Events

This search text may be transcribed, used, stored, or accessed by our third-party service providers per our Cookie Policy and Privacy Policy.

This search text may be transcribed, used, stored, or accessed by our third-party service providers per our Cookie Policy and Privacy Policy.

  • Products

    • Products

      Cadence.AI

      • Millennium Platform

        AI-driven digital twin supercomputer

      • Cadence Cerebrus AI Studio

        Multi-block, multi-user SoC design platform

      • Optimality Intelligent System Explorer

        AI-driven Multiphysics analysis

      • Verisium Verification Platform

        AI-driven verification platform

      • Allegro X AI

        AI-driven PCB Design

      • Tensilica AI Platform

        On-device AI IP

    • Products

      IC Design & Verification

      • Virtuoso Studio

        Analog and custom IC design

      • Spectre Simulation

        Analog and mixed-signal SoC verification

      • Innovus+ Platform

        Synthesis and implementation for advanced nodes

      • Xcelium Logic Simulation

        IP and SoC design verification

      • Silicon Solutions

        Protocol IP and Compute IP, including Tensilica IP

      • Palladium and Protium

        Emulation and prototyping platforms

    • Products

      System Design & Analysis

      • Allegro X Design Platform

        System and PCB design platform

      • Allegro X Adv Package Designer Platform

        IC packaging design and analysis platform

      • Sigrity X Platform

        Signal and power integrity analysis platform

      • AWR Design Environment Platform

        RF and microwave development platform

      • Cadence Reality Digital Twin Platform

        Data center design and management platform

      • Fidelity CFD Platform

        Computational fluid dynamics platform

    • All Analog IC Design Products
    • All Verification Products
    • All Digital Design and Signoff Products
    • All 3D-IC Design Products
    • All PCB Design Products
    • All 3D Electromagnetic Analysis Products
    • All Thermal Analysis Products
    • All Molecular Simulation Products
    • All Cadence Cloud Services and Solutions
    • All Products (A-Z)
  • Solutions

    Industries

    • 5G Systems and Subsystems

    • Aerospace and Defense

    • Automotive

    • Data Center Solutions

    • Hyperscale Computing

    • Life Sciences

    Services

    • Services Overview

    Technologies

    • Artificial Intelligence

    • 3D-IC Design

    • Advanced Node

    • Arm-Based Solutions

    • Cloud Solutions

    • Computational Fluid Dynamics

    • Functional Safety

    • Low Power

    • Mixed-signal

    • Molecular Simulation

    • Multiphysics System Analysis

    • Photonics

    • RF / Microwave

    Designed with Cadence See how our customers create innovative products with Cadence
    Explore Cadence Cloud Now Explore Cadence Cloud Now
  • Support

    Support

    • Support Process

    • Online Support

    • Software Downloads

    • Computing Platform Support

    • Customer Support Contacts

    • Community Forums

    • OnCloud Help Center

    • Doc Assistant

    Training

    • Computational Fluid Dynamics

    • Custom IC / Analog / RF Design

    • Digital Design and Signoff

    • IC Package

    • Languages and Methodologies

    • Mixed-Signal Design Modeling, Simulation, and Verification

    • Onboarding Curricula

    • PCB Design

    • Reality DC

    • System Design and Verification

    • Tech Domain Certification Programs

    • Tensilica Processor IP

    Stay up to date with the latest software
    Cadence award-winning online support available 24/7
    Connect with expert users in our Community Forums
  • Company

    Corporate

    • About Us

    • Designed with Cadence

    • Investor Relations

    • Leadership Team

    • Computational Software

    • Alliances

    • Channel Partners

    • Technology Partners

    • Corporate Social Responsibility

    • Cadence Academic Network

    • Intelligent System Design

    Culture and Careers

    • Careers

    • Culture

    • One Team

    Media Center

    • Cadence Events

    • Events

    • Newsroom

    • Blogs

    Cadence Giving Foundation
    Premier Cadence Events

Free Trials

  • Home
  •   :  
  • About Us
  •   :  
  • Newsroom
  •   :  
  • News Releases
  •   :  
  • 2019
  •   :  
  • 2 Jul 2019

Cadence Digital Full Flow Achieves Certification for Samsung Foundry 5LPE Process Technology

SAN JOSE, Calif., 02 Jul 2019

Highlights:

  • Samsung Foundry confirmed that the Cadence tools meet its stringent technology requirements, providing customers with optimal PPA
  • Cadence flow was certified using the Arm Cortex-A53 and Cortex-A57 cores for the 5LPE process

Cadence Design Systems, Inc. (NASDAQ: CDNS) today announced that the Cadence® digital full flow has achieved certification for the Samsung Foundry 5nm Low-Power Early (5LPE) process with Extreme Ultraviolet (EUV) lithography technology. The Cadence tools have been confirmed to meet Samsung Foundry’s technology requirements, which let customers who produce high-end products for the mobile, networking, server and automotive markets attain optimal power, performance and area (PPA).

“As part of our longstanding collaboration with Cadence, we’ve confirmed that its digital full-flow meets and exceeds the requirements for designing with the 5LPE process technology,” said Jung Yun Choi, vice president of the Design Technology Team at Samsung Electronics. “By deploying the latest Cadence market-leading digital flow and Samsung advanced-node technology, customers can confidently create innovative designs for emerging high-end markets such as the mobile, networking, server, automotive, industrial, and artificial intelligence markets.”

The Cadence digital flow was certified by Samsung using the Arm Cortex®-A53 and Cortex-A57 cores for the 5LPE process. To ensure the Cadence flow is easy to understand and use, it incorporates a Cadence flow manager with a common user interface across the complete toolset. The Cadence tools optimized for the Samsung 5LPE process include the Genus™ Synthesis Solution, Innovus™ Implementation System, Joules™ RTL Power Solution, Conformal® Equivalence Checking, Conformal Low Power, Modus™ DFT Software Solution, Quantus™ Extraction Solution, Tempus™ Timing Signoff Solution, Voltus™ IC Power Integrity Solution, Physical Verification System, Litho Physical Analyzer and Cadence CMP Predictor. For more information on the Cadence digital and signoff full flow, please visit www.cadence.com/go/dands5lpe.   

“Through our ongoing collaboration with Samsung Foundry, we’re making it faster and easier for customers to create advanced-node designs in an age of increasing complexity,” said KT Moore, vice president, product management in the Digital & Signoff Group at Cadence. “The powerful combination of the Cadence digital implementation and signoff full-flow, Samsung 5LPE process, and Arm cores gives customers access to the latest technologies to optimize PPA and create tomorrow’s innovations.”

The integrated Cadence digital full-flow provides a fast path to design closure and better predictability and supports the company’s overall Intelligent System Design™ strategy, enabling advanced-node system-on-chip (SoC) design excellence.

About Cadence

Cadence enables electronic systems and semiconductor companies to create the innovative end products that are transforming the way people live, work and play. Cadence® software, hardware and semiconductor IP are used by customers to deliver products to market faster. The company’s Intelligent System Design strategy helps customers develop differentiated products—from chips to boards to systems—in mobile, consumer, cloud data center, automotive, aerospace, IoT, industrial and other market segments. Cadence is listed as one of Fortune Magazine's 100 Best Companies to Work For. Learn more at www.cadence.com.

For more information, please contact:

Cadence Newsroom
408-944-7039
newsroom@cadence.com

© 2019 Cadence Design Systems, Inc. All rights reserved worldwide. Cadence, the Cadence logo and the other Cadence marks found at www.cadence.com/go/trademarks are trademarks or registered trademarks of Cadence Design Systems, Inc. Arm and Cortex are registered trademarks or trademarks of Arm Limited (or its subsidiaries) in the US and/or elsewhere. All other trademarks are the property of their respective owners.

Media Contacts

For more information, please contact:

Cadence Newsroom

408.944.7039

newsroom@cadence.com

Fortune: 100 Best Companies to Work for 2025

A Great Place to Do Great Work!

Tenth year on the FORTUNE 100 list

Wall Street Journal Best Managed Companies

The Wall Street Journal

Best Managed Companies

Our Culture Join The Team

Products Products

  • Custom IC and RF
  • Digital Design and Signoff
  • IC Package
  • Silicon Solutions
  • PCB Design
  • System Analysis
  • Verification
  • All Products

Company Company

  • About Us
  • Leadership Team
  • Investor Relations
  • Alliances
  • Channel Partners
  • Technology Partners
  • Careers
  • Cadence Academic Network
  • Supplier

Media Center Media Center

  • Events
  • Newsroom
  • Designed with Cadence
  • Blogs
  • Forums
  • Glossary
  • Resources

Contact Us Contact Us

  • Customer Support
  • Media Relations
  • Global Office Locator
  • Information Security

Sign up to receive the latest Cadence news

Thank you for subscribing. You will get an email to confirm your subscription.

English (US)
  • English
    United States
  • 简体中文
    China
  • 日本語
    Japan
  • 한국어
    Korea
  • 繁體中文
    Taiwan

© 2025 Cadence Design Systems, Inc. All Rights Reserved.

  • US Trademarks
  • Terms of Use
  • Privacy
  • Cookie Policy
  • Accessibility
  • Do Not Sell or Share My Personal Information

© 2025 Cadence Design Systems, Inc. All Rights Reserved.