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  • Products
    • DESIGN EXCELLENCE
      • Digital Design and Signoff
        • PRODUCT CATEGORIES
          • Logic Equivalence Checking
          • SoC Implementation and Floorplanning
          • Functional ECO
          • Low-Power Validation
          • Synthesis
          • Power Analysis
          • Constraints and CDC Signoff
          • Silicon Signoff and Verification
          • Library Characterization
          • Test
        • FEATURED PRODUCTS
          • Integrity 3D-IC Platform
          • Cadence Cerebrus Intelligent Chip Explorer
          • Genus Synthesis Solution
          • Innovus Implementation System
          • Tempus Timing Signoff Solution
          • Voltus IC Power Integrity Solution
          • Pegasus Verification System
          • RESOURCES
          • Flows
      • Custom IC / Analog / RF Design
        • PRODUCT CATEGORIES
          • Circuit Design
          • Circuit Simulation
          • Layout Design
          • Layout Verification
          • Library Characterization
          • RF / Microwave Solutions
        • FEATURED PRODUCTS
          • Spectre X Simulator
          • Spectre FX Simulator
          • Virtuoso Layout Suite
          • Virtuoso ADE Product Suite
          • Virtuoso Advanced Node
          • Voltus-Fi Custom Power Integrity Solution
          • RESOURCES
          • Flows
      • Verification
        • PRODUCT CATEGORIES
          • Debug Analysis
          • Virtual Prototyping
          • Emulation and Prototyping
          • Static and Formal Verification
          • Planning and Management
          • Simulation
          • Software-Driven Verification
          • Verification IP
          • System-Level Verification IP
        • FEATURED PRODUCTS
          • vManager Verification Management
          • Jasper C Apps
          • Helium Virtual and Hybrid Studio
          • Xcelium Logic Simulation
          • Palladium Enterprise Emulation
          • Protium Enterprise Prototyping
          • System VIP
          • RESOURCES
          • Flows
      • IP
        • PRODUCT CATEGORIES
          • 112G/56G SerDes
          • Chiplet and D2D
          • Denali Memory Interface and Storage IP
          • Interface IP
          • PCIe and CXL
          • Tensilica Processor IP
        • RESOURCES
          • Discover PCIe
      • IC Package Design and Analysis
        • PRODUCT CATEGORIES
          • Cross-Platform Co-Design and Analysis
          • IC Package Design
          • SI/PI Analysis
          • SI/PI Analysis Point Tools
          • Flows
    • SYSTEM INNOVATION
      • Multiphysics System Analysis
        • PRODUCT CATEGORIES
          • Computational Fluid Dynamics
          • Electromagnetic Solutions
          • RF / Microwave Design
          • Signal and Power Integrity
          • Thermal Solutions
        • FEATURED PRODUCTS
          • Clarity 3D Solver
          • Clarity 3D Solver Cloud
          • Clarity 3D Transient Solver
          • Celsius Thermal Solver
          • Fidelity CFD
          • Sigrity Advanced SI
          • Celsius Advanced PTI
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          • System Analysis Center
          • System Analysis Resources Hub
          • AWR Free Trial
      • Embedded Software
      • PCB Design and Analysis
        • PRODUCT CATEGORIES
          • Design Authoring
          • PCB Layout
          • Library and Design Data Management
          • Analog/Mixed-Signal Simulation
          • SI/PI Analysis
          • SI/PI Analysis Point Tools
          • RF / Microwave Design
          • Augmented Reality Lab Tools
        • FEATURED PRODUCTS
          • Allegro Package Designer Plus
          • Allegro PCB Designer
          • Allegro X Design Platform
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  • 2018
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  • 02 Oct 2018

Cadence Delivers Support for TSMC InFO_MS Advanced Packaging Technologies

Cadence signoff and packaging solutions optimized for TSMC InFO_MS packaging technology

SAN JOSE, Calif., 02 Oct 2018

Cadence Design Systems, Inc. (NASDAQ: CDNS) today announced that its digital tools and advanced IC packaging solutions support the new TSMC InFO_MS (InFO with Memory on Substrate) packaging technology. Support for this TSMC packaging technology enables mutual customers to create new, complex chips using 3D stacking techniques to bring innovative new products to market much faster than ever before.

For more information on the Cadence® solutions that support the TSMC InFO_MS advanced packaging technology, visit www.cadence.com/go/infoms.

Cadence has made improvements to its existing InFO flow to support the new InFO_MS packaging technology, providing a flexible suite of advanced packaging solutions to customers designing chips of various sizes and levels of complexity with memory integrated on InFO. The Cadence signoff and packaging solutions incorporate several capabilities to advance the adoption of TSMC’s InFO_MS packaging technology.

The Cadence tools in the flow include the Quantus™ Extraction Solution, Voltus™-Sigrity™ Package Analysis solution, Tempus™ Timing Signoff Solution, Physical Verification System (PVS), OrbitIO™ interconnect designer, Cadence System-in-Package (SiP) Layout enhancements and Sigrity PowerSI® technology, Sigrity PowerSI 3D-EM Extraction Option, Sigrity PowerDC™ technology, Sigrity XtractIM™ technology and Sigrity SystemSI™ technology.

“Cadence has continued to partner with TSMC to deliver new capabilities in support of its advanced packaging technologies that allow customers to deliver innovative designs more efficiently,” said Tom Beckley, senior vice president and general manager, Custom IC & PCB Group at Cadence. “The new InFO_MS solution can empower our mutual customers to utilize the latest packaging techniques when creating complex designs, and we are committed to enabling them to achieve their design objectives using our tools, flows and methodologies.”

“The collaboration with Cadence on the InFO_MS design flow enriches our established InFO, WoW and CoWoS chip integration solutions, giving customers more flexibility to incorporate multiple die integration using 3D stacking techniques,” said Suk Lee, TSMC senior director, Design Infrastructure Marketing Division. “Our ongoing collaboration with Cadence is enabling customers to use our packaging technologies effectively so they can reduce design schedules and achieve aggressive design goals.”

About Cadence

Cadence enables electronic systems and semiconductor companies to create the innovative end products that are transforming the way people live, work and play. Cadence® software, hardware and semiconductor IP are used by customers to deliver products to market faster. The company’s System Design Enablement strategy helps customers develop differentiated products—from chips to boards to systems—in mobile, consumer, cloud datacenter, automotive, aerospace, IoT, industrial and other market segments. Cadence is listed as one of Fortune Magazine's 100 Best Companies to Work For. Learn more at www.cadence.com.

For more information, please contact:

Cadence Newsroom
408-944-7039
newsroom@cadence.com

© 2018 Cadence Design Systems, Inc. All rights reserved worldwide. Cadence, the Cadence logo and the other Cadence marks found at www.cadence.com/go/trademarks are trademarks or registered trademarks of Cadence Design Systems, Inc. All other trademarks are the property of their respective owners.

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For more information, please contact:

Cadence Newsroom

408.944.7039

newsroom@cadence.com

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