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  • Products
    • DESIGN EXCELLENCE
      • Digital Design and Signoff
        • PRODUCT CATEGORIES
          • Logic Equivalence Checking
          • SoC Implementation and Floorplanning
          • Functional ECO
          • Low-Power Validation
          • Synthesis
          • Power Analysis
          • Constraints and CDC Signoff
          • Silicon Signoff and Verification
          • Library Characterization
          • Test
        • FEATURED PRODUCTS
          • Integrity 3D-IC Platform
          • Cadence Cerebrus Intelligent Chip Explorer
          • Genus Synthesis Solution
          • Innovus Implementation System
          • Tempus Timing Signoff Solution
          • Voltus IC Power Integrity Solution
          • Pegasus Verification System
          • RESOURCES
          • Flows
      • Custom IC / Analog / RF Design
        • PRODUCT CATEGORIES
          • Circuit Design
          • Circuit Simulation
          • Layout Design
          • Layout Verification
          • Library Characterization
          • RF / Microwave Solutions
        • FEATURED PRODUCTS
          • Spectre X Simulator
          • Spectre FX Simulator
          • Virtuoso Layout Suite
          • Virtuoso ADE Product Suite
          • Virtuoso Advanced Node
          • Voltus-Fi Custom Power Integrity Solution
          • RESOURCES
          • Flows
      • Verification
        • PRODUCT CATEGORIES
          • Debug Analysis
          • Virtual Prototyping
          • Emulation and Prototyping
          • Static and Formal Verification
          • Planning and Management
          • Simulation
          • Software-Driven Verification
          • Verification IP
          • System-Level Verification IP
        • FEATURED PRODUCTS
          • vManager Verification Management
          • Jasper C Apps
          • Helium Virtual and Hybrid Studio
          • Xcelium Logic Simulation
          • Palladium Enterprise Emulation
          • Protium Enterprise Prototyping
          • System VIP
          • RESOURCES
          • Flows
      • IP
        • PRODUCT CATEGORIES
          • 112G/56G SerDes
          • Chiplet and D2D
          • Denali Memory Interface and Storage IP
          • Interface IP
          • PCIe and CXL
          • Tensilica Processor IP
        • RESOURCES
          • Discover PCIe
      • IC Package Design and Analysis
        • PRODUCT CATEGORIES
          • Cross-Platform Co-Design and Analysis
          • IC Package Design
          • SI/PI Analysis
          • SI/PI Analysis Point Tools
          • Flows
    • SYSTEM INNOVATION
      • Multiphysics System Analysis
        • PRODUCT CATEGORIES
          • Computational Fluid Dynamics
          • Electromagnetic Solutions
          • RF / Microwave Design
          • Signal and Power Integrity
          • Thermal Solutions
        • FEATURED PRODUCTS
          • Clarity 3D Solver
          • Clarity 3D Solver Cloud
          • Clarity 3D Transient Solver
          • Celsius Thermal Solver
          • Fidelity CFD
          • Sigrity Advanced SI
          • Celsius Advanced PTI
          • RESOURCES
          • System Analysis Center
          • System Analysis Resources Hub
          • AWR Free Trial
      • Embedded Software
      • PCB Design and Analysis
        • PRODUCT CATEGORIES
          • Design Authoring
          • PCB Layout
          • Library and Design Data Management
          • Analog/Mixed-Signal Simulation
          • SI/PI Analysis
          • SI/PI Analysis Point Tools
          • RF / Microwave Design
          • Augmented Reality Lab Tools
        • FEATURED PRODUCTS
          • Allegro Package Designer Plus
          • Allegro PCB Designer
          • Allegro X Design Platform
          • RESOURCES
          • What's New in Allegro
          • Advanced PCB Design & Analysis Resources Hub
          • Flows
      • Computational Fluid Dynamics
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  • 2018
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  • 13 Nov 2018

Cadence Delivers Advanced Packaging Reference Flow for Samsung Foundry Customers

SAN JOSE, Calif., 13 Nov 2018

Cadence Design Systems, Inc. (NASDAQ: CDNS) today announced that the complete Cadence® advanced packaging design and analysis tool flow is certified by Samsung Foundry for Fan-Out Panel-Level-Packaging (FO-PLP) and silicon-interposer 2.5D package. This proven on-/off-chip design flow is in use now by multiple customers with challenging advanced packaging requirements.

For more information on the Cadence advanced packaging reference flow, visit www.cadence.com/go/samsungpkg.

Insuring sufficient, efficient and stable power delivery, as well as signal integrity, is a significant challenge for customers implementing advanced packages.  With the advanced package reference flow, joint customers of Cadence and Samsung now have a documented step-by-step approach to validate these critical electrical requirements to enable first-pass success.

The complete Cadence advanced packaging flow is certified and correlated to the Samsung golden flow using Cadence on-/-off-chip power integrity and signal integrity tools, including Allegro® Sigrity™ PowerSI® technology, Sigrity Broadband SPICE, Sigrity PowerSI 3D-EM Extraction Option, Sigrity SystemSI™ technology, Sigrity System Explorer, Voltus™ IC Power Integrity Solution, Spectre® Accelerated Parallel Simulator and Spectre CPU Accelerator Option. This flow was verified with memory interfaces, high-speed interfaces and a core Power Delivery Network for CPU and GPU through both FO-PLP and Silicon-interposer2.5D package-based test cases.

“In close collaboration with Samsung, we have delivered a certified, integrated design and analysis flow for the Samsung Foundry advanced package design methodology,” said Steve Durrill, senior product engineering group director at Cadence. “The Samsung certification of our solution that spans our Virtuoso, Allegro and Sigrity product lines enables our joint customers to take advantage of a reference flow that will help reduce cost and improve performance and reliability of their products using advanced packaging techniques.”

"We are pleased to see that the results from the Cadence analysis tools correlate with measurement results,” stated Ryan Lee, Vice President of Foundry Marketing at Samsung Electronics. " This collaboration will help our customers with a trusted system design enablement solution for the advanced packages to implement state-of-the-art products."

About Cadence

Cadence enables electronic systems and semiconductor companies to create the innovative end products that are transforming the way people live, work and play. Cadence® software, hardware and semiconductor IP are used by customers to deliver products to market faster. The company’s System Design Enablement strategy helps customers develop differentiated products—from chips to boards to systems—in mobile, consumer, cloud datacenter, automotive, aerospace, IoT, industrial and other market segments. Cadence is listed as one of Fortune Magazine's 100 Best Companies to Work For. Learn more at www.cadence.com.

For more information, please contact:

Cadence Newsroom
408-944-7039
newsroom@cadence.com

© 2018 Cadence Design Systems, Inc. All rights reserved worldwide. Cadence, the Cadence logo and the other Cadence marks found at www.cadence.com/go/trademarks are trademarks or registered trademarks of Cadence Design Systems, Inc. All other trademarks are the property of their respective owners.

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