Cadence and ARM Announce Strategic IP Interoperability Agreement

Cadence Design Systems, Inc. (NASDAQ: CDNS) and ARM today announced the signing of a broad Intellectual Property (IP) Interoperability Agreement. This multiyear agreement provides reciprocal access to relevant IP portfolios from the Cadence® IP Group and ARM. Additionally, the agreement grants both companies rights to manufacture test chips containing Cadence IP and ARM IP and to provide development platforms to customers. The ability to test the IP interoperability in silicon is intended to enable Cadence and ARM to optimize performance and interoperability within systems on chip (SoCs) while accelerating time to market for customers in markets such as mobile, consumer, networking, storage, automotive and the Internet of Things (IoT).

The IP Interoperability Agreement covers existing and future ARM® Cortex® processors, ARM Mali™ GPUs, ARM CoreLink™ system IP, ARM Artisan® physical IP, and ARM POP™ IP; Cadence Design IP including cores for PCI Express®, MIPI, USB, HDMI, DisplayPort, Ethernet, analog, DDR/LPDDR PHY and multiple other memory and storage protocols.

"This agreement expands upon the successful EDA Technology Access and EDA Subscription Agreements ARM signed with Cadence last year to further enable our customers' designs to reach peak performance and power efficiency," said Pete Hutton, executive vice president and president of product groups, ARM. "Extending our collaboration with Cadence to IP interoperability means we are mutually embracing the increasing importance of optimizing the IP systems within SoC designs. By working together closely, we can continue to deliver the key technologies that allow our customers to push the boundaries of innovation."

"Through expanded collaboration, Cadence and ARM are able to develop and deliver solutions that enable our customers to rapidly design optimized high-performance ARM-based SoCs and speed time to market for complete systems," said Martin Lund, senior vice president, IP Group at Cadence. "This new agreement allows customers of both companies to get to market faster with pre-integrated IP solutions and continue pushing the envelope on low-power and high-performance SoC design."