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Overcoming Design Challenges with Electrical-Thermal Co-Simulation
Speaker: CT Kao, Product Management Director, Multi-domain System Analysis (MSA) group, Cadence
Electrical-thermal co-simulation plays a critical role in system design. Not only are electrical and thermal behaviors convolving in nature, but also their widespread length and time scales in real applications demand efficient and accurate resolutions. Learn how the industry’s first complete electrical-thermal co-simulation solution for IC, package, and PCB will deliver faster performance, new system analysis capabilities, and new design insights that help detect and mitigate thermal issues early in the design process. We will demonstrate the essential features of the Cadence® Celsius™ Thermal Solver and how it responds to those design challenges through both transient and static electrical-thermal co-simulation. This new solver includes multi-physics analysis of computational fluid dynamics and thermal stress modeling. The production-proven computational technology of massive parallel computing has been equipped in this solver to provide almost linear scalability in runtime and reduction of memory usage.