SPIE Advanced Lithography is the leading global lithography conference, bringing together recognized industry leaders to solve challenges in lithography, patterning technologies, and materials for the semiconductor industry. Join Cadence at this premier event to hear the latest advancements in optical lithography, metrology, and EUV, and discover the DFM and computational lithography solutions Cadence has to offer.
Visit Cadence at Booth #213 to discuss how to:
- Meet your foundry requirements with in-design and signoff DFM
- Improve design manufacturability and time to yield with state-of-the-art pattern analysis, design profiling, and CMP modeling
- Reduce your RET-OPC cost and development time with production-proven Process and Proximity Correction
Email SPIE@cadence.com to schedule an onsite private meeting to discuss Cadence’s DFM and computational lithography solutions.
Cadence and Partner Presentations:
A Novel Design-for-Yield Solution Based on Interconnect-Level Layout Improvements at 7nm Technology Node [10962-3]
Wednesday, February 28, 8:00am – 10:00am / Conference 10962, Session 1
Authors: Jaehwan Kim, Sangah Lee, Byungchul Shin, Junsu Jeon, Jin Kim, Byung-Moo Kim, Jae-Hyun Kang, Seung Weon Paek, SAMSUNG Electronics Co., Ltd. (Korea, Republic of); Piyush Pathak, Frank E. Gennari, Philippe Hurat, Ya-Chieh Lai, Cadence (USA)
Pattern-Aware Diagnostics: Using High-Performance Pattern Analysis to Identify Defect Root Cause [10962-8]
Wednesday, February 28, 10:30am – 12:10pm / Conference 10962, Session 2
Authors: Jason P. Cain, Abdullah Yassine, Moutaz Fakhry, Advanced Micro Devices, Inc. (USA); Piyush Pathak, Jeffrey E. Nelson, Frank E. Gennari, Ya-Chieh Lai, Cadence (USA)
Hotspot Detection Using Squish-Net [10962-27]
Thursday, February 29, 1:30pm – 3:30pm / Conference 10962, Session 7
Authors: Haoyu Yang, Piyush Pathak, Frank E. Gennari, Ya-Chieh Lai, Cadence (USA); Bei Yu, The Chinese Univ. of Hong Kong (Hong Kong, China)
For more information visit the SPIE website.