Visit us at CES 2017 to learn how 17 of the top 20 semiconductor companies are using Cadence® Tensilica® processors to create more competitive products. This single-processor architecture and development environment covers all embedded processing needs, whether control or DSP, for all market areas.
Don’t miss out on this opportunity to:
- Chat with key Cadence executives
- Get a sneak peek at Tensilica roadmaps, and provide your insight to influence the next generation
- View Tensilica-powered demonstrations as well as successful products from top companies
- Personally experience the Tensilica-powered augmented/mixed reality Microsoft HoloLens
Our demonstrations include real products across popular market areas, such as:
Book a meeting with Cadence engineers and executives at CES 2017 to see our live demos of Tensilica-powered mobile, automotive, IoT, and consumer products.
We look forward to meeting with you at CES 2017!