RF1 : Overcome RFIC and RF Module Implementation Challenges (Think Outside the Chip)
RF engineers confront a myriad of challenges to bring their designs to life. From the ability to verify a complex 5G or automotive standard, to running electromagnetic (EM) analysis across chip, package, and board, or to simply verifying RF module connectivity, these challenges can overwhelm traditional EDA design flows that are notoriously fragmented by using multiple vendors.
RF2 : How to Efficiently Run Electromagnetic Simulation of Full Circuit Blocks (EMX Simulator)
Electromagnetic (EM) simulation of complex circuit blocks like VCOs can be challenging when you combine active and passive components in a single design. Learn how to perform fast and accurate EM analysis, black-box the active elements, and create multi-port S-parameter models of the interconnect with the Cadence® EMX® 3D Planar Simulator and its parametrizable models for passive components.
RF3 : RF to mmWave Front-End Component Design for 5G NR
5G New Radio (NR) networks represent the next milestone in enhanced mobile communications, targeting more traffic, increased capacity, reduced latency and energy consumption. To achieve 5G NR performance targets, these communication systems must improve spatial efficiency using multiple-in/multiple-out (MIMO) and beam-forming antenna arrays while adopting more spectrum to increase bandwidth. Learn about design challenges in developing high-frequency components for 5G NR communications - from beam-steering antenna arrays to mmWave MMIC power amplifiers using GaN semiconductor technology. Review typical 5G NR system requirements, learn how they impact component performance specifications and physical implementation with case studies on overcoming design and integration challenges using RF/mmWave simulation software.
RF4 : Design Smarter with AWR Software
Cadence recently launched the AWR Design Environment® V15 version, which includes AWR® Microwave Office® (MWO), AWR Visual System Simulator™ (VSS), and AWR AXIEM® and Analyst ™ electromagnetic (EM) simulators. This new version expands the Cadence software product portfolio and improves the RF/microwave design solution, which can be used for monolithic microwave integrated circuit (MMIC)/RFIC and package/module and PCB design. This version provides key new functions and modules to help customers cope with the increasingly complex 5G, automotive, aerospace and defense applications. V15 improves engineering productivity with new analyses, faster and higher capacity simulation technologies, time-saving design automation, and 5G New Radio (NR)-compliant testbenches that support power amplifier (PA) and antenna/array design, EM modeling, and RF/ microwave integration across heterogenous technologies. Join us for the Cadence AWR Design Environment V15 session! You will learn about the expanded features and capabilities of the AWR Design Environment platform, what’s new in V15, and how to take advantage of the key features and improvements that enhance functionality and improve productivity—from the user environment, to circuit and system simulation, as well as to electromagnetic analysis.
RF5 : Tensilica Radar/Lidar/Communications DSPs
The growth and continue adoption of 5G has driven the increase in the digital signal computational needs for wireless communications. Similarly, in the automotive sector, ADAS, autonomous vehicle, connected vehicle are driving significant growth for sensor signals as well as communications processing. These digital signal processing demands requires specialized DSP to process the massive amount of real-time signal data. The DSP often needs to equip with application-specific optimization and acceleration to achieve the most optimal performance and meeting the processing requirement. Cadence® Tensilica® specializes in domain-specific optimized DSPs and has broad product portfolio to address the needs of the applications requirement. Tensilica® ConnX DSPs for communications applications are capable of addressing the processing needs ranging from low bit rate wireless communications to high data rate of 5G applications. Tensilica® ConnX radar DSPs portfolio provides energy-efficient scalability for sensors ranging from low-cost radar/lidar sensors to high-performance sensors. In this session, we present a high-level overview of one of our ConnX DSPs designed for communications, radar and lidar applications.
RF6 : Hardware/Software Co-Development for 5G/AI/ML
This presentation will outline key challenges for chip and system design for 5G, Artificial Intelligence and Machine Learning technologies that enable the hyperscale computing era. We will discuss requirements of fixed wireless, IoT, mobile and mission critical designs and introduce the Cadence computational software offerings addressing the capacity and performance needs for hardware/software co-development, including emulation, virtual and physical prototyping as well as connections to software debuggers using JTAG and virtual debug connections. Aspects of the strategic partnership between Cadence and Green Hills Software to enable safe an secure software development will also be addressed.
RF7 : Chip-Level Thermal Analysis Using Celsius Thermal Solver
As power densities on IC designs continue to increase, controlling temperature on the chip is becoming a major challenge for IC designers. High temperature impacts both the reliability and electrical performance of ICs. Floorplan changes can have a big impact on max chip temperature, designers need a way to accurately perform chip-level thermal analysis to model the thermal impact of floorplan changes. Higher temperature gradients on chip also require accurate analysis to find the right placement of temperature sensors. Today’s advanced applications whether they are in automotive, datacenter, mobile, healthcare or high-performance computing, transient thermal analysis, which is typically not addressed by other tools, is a critical factor in understanding thermal behavior and the impact of dynamic thermal management on performance.