SEMICON Japan 2022 - APCS 2022

ケイデンスのAdvanced Package向けの統合ソリューション（UCIe die-to-die (D2D) コネクティビティソリューション、Cadence 3D-IC設計ソリューション）をご覧ください。

DesignCon 2023

Cadence is a Platinum sponsor of DesignCon—the premier high-speed communications and system design conference. Visit us in Booth 733 to see how you can improve your electromagnetic, electronic, and thermal designs with system analysis, tackle advanced IC packaging and cross-platform challenges, accelerate RF to mmWave designs, and successfully incorporate photonic ICs and designs with 112G SerDes and DDR IP.

CadenceCONNECT: Photonics - Riding the Waves Along the Spectrum

Join Cadence for the CadenceCONNECT Photonics event and workshop on January 11 - 12 in San Jose, CA. On day one, we’re featuring presentations from industry and academic experts that will help you tackle many of your design challenges. On day two, you will have the opportunity to learn hands-on with Photonics experts.

CadenceCONNECT: Functional Verification Seminar 2022

Verisiumをはじめとする検証課題を解決する先進的ソリューションをご紹介します。

CadenceTECHTALK: テンシリカIPセミナー

サブシステムに要求されるプリプロセッシング、AI推論、ポストプロセッシング、Always-On(AON)、レーダーなど、それぞれの処理に最適なテンシリカIPとそれらにおいて包括的にサポートされている機能安全、セキュリティ機能について、具体的なパフォーマンスや採用事例なども交えながらテンシリカIPの最新状況をご紹介します。

CadenceTECHTALK: Best Practices to Achieve the Highest Performance using Xcelium Logic Simulator

Wondering how you can easily achieve up to 3X exemplary performance gains using Xcelium Logic Simulator. This webinar will provide a handy checklist of best practices covering umbrella performance switches, “access” levels, and simulation profiling to achieve the highest performance using Xcelium.

CadenceTECHTALK: チップ全体の最適化およびサインオフを10倍高速化するCertus Closure Solutionのご紹介

今年10月11日に発表した新製品Certus Closure Solutionを紹介いたします。並列分散同時処理によって、デザインの大きさに制限なく、タイミングおよびパワーの最適化を一晩で完了可能なソリューションの概要をユーザ事例と併せて説明いたします。

Training Webinar: Solve Tricky SVA Problems with Jasper Visualize and WaveEdit

Join Cadence Training and Sr. Principal Education Application Engineer Mike Avery for this free technical Training Webinar. We’ll demonstrate how Jasper Visualize and WaveEdit provide an easy-to-use vehicle, so you can get the answers to your own questions—quickly and easily

AI Everywhere Forum 2022

Cadence is a Platinum sponsor of the AI Everywhere Forum. Join us as Cadence technology experts discuss how AI is changing chip design, improving engineering productivity and automating design optimization, and enabling the next-generation technology drivers such as 5G, Hyperscale Computing, Industrial IoT, Autonomous Driving, and more.

EDAPS 2022

Cadence is a Silver Sponsor at the IEEE Electrical Design of Advanced Packaging and Systems (EDAPS) 2022 Virtual Conference. Designers and researchers share and discuss their work on all aspects of electrical packaging, including modeling, design and simulation, fabrication, and characterization.