8-9 June 2021
|Date||EVENT NAME||TECHNOLOGY||Location||Event Type|
|09 Jun 2021||
Join us to fully understand the thermal and stress challenges introduced by 3D-ICs, which are cross-fabric problems. Learn how the Cadence Celsius™ Thermal Solver helps you solve this problem by producing thermal gradient for the whole system, enabling analysis from early design to signoff.
|Celsius, System Analysis||Online||Cadence Event|
|19 May 2021||
Join Cadence Training and Sr Principal Application Engineer Srdjan Djordjevic for this free technical webinar. We’ll be covering two Cadence breakthrough technologies: the Clarity 3D Solver and the Celsius Thermal Solver in this extended two-tool session.
|Clarity, Celsius||Online||Cadence Event|
|25 May 2021 - 26 May 2021||
Join Cadence at PCI-SIG Developers Conference 2021 to learn about the latest developments in PCI Express technology.
|Verification IP||Online||Industry Conference|
|06 Jun 2021 - 11 Jun 2021||
Join Cadence at the Optical Fiber Communication (OFC) Conference, the largest global conference and exhibition for optical communications and networking professionals, to learn about high-speed SerDes IP and solutions for photonic IC challenges.
|Custom IC Design||Online||Industry Conference|
|07 Jun 2021||
Join us for the traditional NUMECA Lunch and Learn and be part of a major revolution in turbomachinery design and analysis. We will talk about the next generation of multiphysics simulation and optimization, with live demos.
|CFD, Turbomachinery, System Analysis||Online||Industry Conference|
|07 Jun 2021 - 25 Jun 2021||
IMS2021 will be centered around the theme of "Connecting for a Smarter, Safer World." and will feature both in person and virtual events. Cadence is an official sponsor of Wireless Internet at IMS live and will present a number of MicroApps at the virtual event.
|RF Microwave Design||Online||Industry Conference|
|26 May 2021||
If you are doing high-speed design, don’t miss this half-day online forum hosted by SI Journal and featuring industry leaders Google and Microsoft. The event will cover key design topics on high-speed system designs with a keynote, “Interconnect Modeling and its Importance to HSSD Simulation” by Eric Bogatin, Professor at ECEE Univ of Colorado, Boulder, Technical Editor for SI Journal, and Teledyne LeCroy Fellow.
|Cloud Portfolio, RF Microwave Design, IC Packaging and SiP Design, PCB Design, 3D-IC, Signal and Power Integrity||Online||Industry Conference|
|24 May 2021 - 28 May 2021||
The IEEE European Test Symposium (ETS) is Europe’s premier forum dedicated to presenting and discussing scientific results, emerging ideas, applications, hot topics and new trends in the area of electronic-based circuits and system testing, reliability, security and validation. Register to attend our "Highly Accurate and Scalable Failure Diagnosis for Large Designs with Complex DfT Architectures" talk by Sameer Chillarige on May 26 in the vendor session 5: Electronic Design Automation and DfT.
|Modus DFT Software Solution , Automotive||Online||Industry Conference|
|11 May 2021 - 13 May 2021||
Join this webinar series on Cadence's Conformal technology to learn about the latest developments. Our experts will take a deep dive into the challenges and discuss how the new enhancements in the technology can solve them.
|Conformal Litmus||Online||Cadence Event|
|01 Jun 2021||
In this CadenceTECHTALK, we will discuss the massive parallel scalability in heterogenous cloud infrastructure, process monitor and recovery, and integration with existing platforms. The advantages of the integrated flows and how they can improve your run-time, accelerate design turnaround time (TAT), and optimize cost is shown.
|Digital Design and Signoff||Online||Cadence Event|