​CadenceTECHTALK: Thermal and Stress Analysis of 3D-ICs with Celsius Thermal Solver (Taiwan) ​ ​

Join us to fully understand the thermal and stress challenges introduced by 3D-ICs, which are cross-fabric problems. Learn how the Cadence Celsius™ Thermal Solver helps you solve this problem by producing thermal gradient for the whole system, enabling analysis from early design to signoff​.

Training Webinar: Introduction to Breakthrough Technologies: Clarity and Celsius Solvers

Join Cadence Training and Sr Principal Application Engineer Srdjan Djordjevic for this free technical webinar. We’ll be covering two Cadence breakthrough technologies: the Clarity 3D Solver and the Celsius Thermal Solver in this extended two-tool session.

PCI-SIG Virtual Developers Conference 2021

Join Cadence at PCI-SIG Developers Conference 2021 to learn about the latest developments in PCI Express technology.

OFC 2021

Join Cadence at the Optical Fiber Communication (OFC) Conference, the largest global conference and exhibition for optical communications and networking professionals, to learn about high-speed SerDes IP and solutions for photonic IC challenges. ​

Numeca Lunch & Learn Session at ASME Turbo Expo 2021

Join us for the traditional NUMECA Lunch and Learn and be part of a major revolution in turbomachinery design and analysis. We will talk about the next generation of multiphysics simulation and optimization, with live demos.

IMS2021

IMS2021 will be centered around the theme of "Connecting for a Smarter, Safer World." and will feature both in person and virtual events. Cadence is an official sponsor of Wireless Internet at IMS live and will present a number of MicroApps at the virtual event.

High Speed Digital 3D EM Forum

If you are doing high-speed design, don’t miss this half-day online forum hosted by SI Journal and featuring industry leaders Google and Microsoft. The event will cover key design topics on high-speed system designs with a keynote, “Interconnect Modeling and its Importance to HSSD Simulation” by Eric Bogatin, Professor at ECEE Univ of Colorado, Boulder, Technical Editor for SI Journal, and Teledyne LeCroy Fellow.

ETS 2021

The IEEE European Test Symposium (ETS) is Europe’s premier forum dedicated to presenting and discussing scientific results, emerging ideas, applications, hot topics and new trends in the area of electronic-based circuits and system testing, reliability, security and validation. Register to attend our "Highly Accurate and Scalable Failure Diagnosis for Large Designs with Complex DfT Architectures" talk by Sameer Chillarige​ on May 26 in the vendor session 5: Electronic Design Automation and DfT.

Cad​enceTECHTALK: Conformal Technologies to Improve Productivity and Silicon Success (Taiwan)

Join this webinar series on Cadence's Conformal technology to learn about the latest developments. Our experts will take a deep dive into the challenges and discuss how the new enhancements in the technology can solve them.

Cad​enceTECHTALK: Accelerate Full-chip Signoff With Massively Parallel Scalability

In this CadenceTECHTALK, we will discuss the massive parallel scalability in heterogenous cloud infrastructure, process monitor and recovery, and integration with existing platforms. The advantages of the integrated flows and how they can improve your run-time, accelerate design turnaround time (TAT), and optimize cost is shown.