CadenceTECHTALK: Intelligent Cross-Platform Workflows for RF PCB Integration

This webinar will demonstrate the ways in which the AWR Design Environment V16 platform supports an RF-to-PCB workflow using a new unified library import wizard to convert Allegro PCB Editor symbols, footprints, and PCB technology file into an AWR process design kit (PDK) that can be used to create an Allegro technology-compatible RF design using standard design entry and simulation methods. Upon completion of the design, the RF engineer can export the schematic and layout of the sub-circuit with all the underlying hierarchy into a design library for direct integration into Allegro schematic capture and layout tools.

CadenceTECHTALK: Advanced Antenna Design and Integration Through Circuit/EM Co-Simulation

This webinar will showcase Cadence RF solutions support for design, analysis, and integration of antennas within manufacturing layout flows for PCB, module, and RFIC technologies. Examples will include surface-mount chip/antenna impedance matching with network synthesis, conformal integrated antenna analysis, antenna array in package/module design, and on-chip antenna design.

CadenceTECHTALK: Advances in EM Analysis and Design Flows for Integrated RF Systems

This webinar examines how distributed, multiprocessing electromagnetic (EM) analysis for large-scale RF design provides a system signoff workflow made possible through the integration of the Clarity 3D Solver within the AWR Design Environment V16 platform. Several practical examples will demonstrate PCB-based design verification, RF in-design for MMIC in-package characterization, and a phased array antenna design and optimization workflow.

CadenceTECHTALK: Thermal Analysis for MMIC and RF PCB Power Applications

This webinar will highlight how the Celsius Thermal Solver uses design data such as layout geometries, material properties, and dissipated power simulation results from Cadence’s Microwave Office® software to provide designers with thermal heat map visualization and operating temperature information. By using the Celsius Thermal Solver with Microwave Office software, RF designers have access to critical data impacting performance and reliability concerns and can investigate heat sinking strategies to best manage thermal dissipation.

CadenceCONNECT: Mission Critical 2021

We will introduce you to optimized design methodologies for mission-critical electronics system applications like Aerospace and Defense, safety, security, 5G, and others. The event brings together Cadence technology users, developers, and industry experts for networking, sharing best practices on critical design and verification issues and discovering new techniques for designing advanced silicon, SoCs, and systems.