CadenceCONNECT: Custom IC, RF, and PCB Technology Day

Join us for the CadenceCONNECT™: Custom IC, RF, and PCB Technology Day, where Cadence® experts will share best practices in analog design for custom IC, RF, package, board, and multiphysics analysis at all system levels. Presentations and live demonstrations promise unique insight and learning. You will hear about advanced solutions for large-scale analog and mixed-signal simulation and extraction, post-layout design and layout automation in the Cadence Virtuoso® design platform, and the latest in package and board design, based on Cadence core engines and integration between tools and flows for mature and advanced processes.

IMS 2022

Visit Cadence at booth 5050 at the International Microwave Symposium (IMS) to learn about the latest solutions for RF to mmWave component and system design, including innovations in circuit simulation, electromagnetic (EM), thermal analysis, and implementation flows across RFICs/MMICs, packages/modules, and PCBs. Cadence experts demonstrate new features in the AWR Design Environment® platform, Clarity™ 3D Solver, Celsius™ Thermal Solver, EMX® Planar 3D Solver, and the Virtuoso® RF Solution.