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Digital Design and Signoff

Cadence® digital design and signoff solutions provide a fast path to design closure and better predictability, helping you meet your power, performance, and area (PPA) targets.

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Custom IC / Analog / RF Design

Cadence® custom, analog, and RF design solutions can help you save time by automating many routine tasks, from block-level and mixed-signal simulation to routing and library characterization.

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Verification

Offering a full verification flow to our customers and partners that delivers the highest verification throughput in the industry

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FEATURED PRODUCTS

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IP

An open IP platform for you to customize your app-driven SoC design.

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IC Package Design and Analysis

Driving efficiency and accuracy in advanced packaging, system planning, and multi-fabric interoperability, Cadence® package implementation products deliver the automation and accuracy.

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Multiphysics System Analysis

Cadence® system analysis solutions provide highly accurate electromagnetic extraction and simulation analysis to ensure your system works under wide-ranging operating conditions.

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Cadence® PCB design solutions enable shorter, more predictable design cycles with greater integration of component design and system-level simulation for a constraint-driven flow.

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  • Products
    • DESIGN EXCELLENCE
      • Digital Design and Signoff
        • PRODUCT CATEGORIES
          • Logic Equivalence Checking
          • SoC Implementation and Floorplanning
          • Functional ECO
          • Low-Power Validation
          • Synthesis
          • Power Analysis
          • Constraints and CDC Signoff
          • Silicon Signoff and Verification
          • Library Characterization
          • Test
        • FEATURED PRODUCTS
          • Integrity 3D-IC Platform
          • Cadence Cerebrus Intelligent Chip Explorer
          • Genus Synthesis Solution
          • Innovus Implementation System
          • Tempus Timing Signoff Solution
          • Voltus IC Power Integrity Solution
          • Pegasus Verification System
          • RESOURCES
          • Flows
      • Custom IC / Analog / RF Design
        • PRODUCT CATEGORIES
          • Circuit Design
          • Circuit Simulation
          • Layout Design
          • Layout Verification
          • Library Characterization
          • RF / Microwave Solutions
        • FEATURED PRODUCTS
          • Spectre X Simulator
          • Spectre FX Simulator
          • Virtuoso Layout Suite
          • Virtuoso ADE Product Suite
          • Virtuoso Advanced Node
          • Voltus-Fi Custom Power Integrity Solution
          • RESOURCES
          • Flows
      • Verification
        • PRODUCT CATEGORIES
          • Debug Analysis
          • Virtual Prototyping
          • Emulation and Prototyping
          • Static and Formal Verification
          • Planning and Management
          • Simulation
          • Software-Driven Verification
          • Verification IP
          • System-Level Verification IP
        • FEATURED PRODUCTS
          • vManager Verification Management
          • Jasper C Apps
          • Helium Virtual and Hybrid Studio
          • Xcelium Logic Simulation
          • Palladium Enterprise Emulation
          • Protium Enterprise Prototyping
          • System VIP
          • RESOURCES
          • Flows
      • IP
        • PRODUCT CATEGORIES
          • 112G/56G SerDes
          • Chiplet and D2D
          • Denali Memory Interface and Storage IP
          • Interface IP
          • PCIe and CXL
          • Tensilica Processor IP
        • RESOURCES
          • Discover PCIe
      • IC Package Design and Analysis
        • PRODUCT CATEGORIES
          • Cross-Platform Co-Design and Analysis
          • IC Package Design
          • SI/PI Analysis
          • SI/PI Analysis Point Tools
          • Flows
    • SYSTEM INNOVATION
      • Multiphysics System Analysis
        • PRODUCT CATEGORIES
          • Computational Fluid Dynamics
          • Electromagnetic Solutions
          • RF / Microwave Design
          • Signal and Power Integrity
          • Thermal Solutions
        • FEATURED PRODUCTS
          • Clarity 3D Solver
          • Clarity 3D Solver Cloud
          • Clarity 3D Transient Solver
          • Celsius Thermal Solver
          • Fidelity CFD
          • Sigrity Advanced SI
          • Celsius Advanced PTI
          • RESOURCES
          • System Analysis Center
          • System Analysis Resources Hub
          • AWR Free Trial
      • Embedded Software
      • PCB Design and Analysis
        • PRODUCT CATEGORIES
          • Design Authoring
          • PCB Layout
          • Library and Design Data Management
          • Analog/Mixed-Signal Simulation
          • SI/PI Analysis
          • SI/PI Analysis Point Tools
          • RF / Microwave Design
          • Augmented Reality Lab Tools
        • FEATURED PRODUCTS
          • Allegro Package Designer Plus
          • Allegro PCB Designer
          • Allegro X Design Platform
          • RESOURCES
          • What's New in Allegro
          • Advanced PCB Design & Analysis Resources Hub
          • Flows
      • Computational Fluid Dynamics
    • PERVASIVE INTELLIGENCE
      • AI / Machine Learning
      • AI IP Portfolio
    • CADENCE CLOUD
    • VIEW ALL PRODUCTS
  • Solutions
      • Industries
        • 5G Systems and Subsystems
        • Aerospace and Defense
        • Automotive
        • Hyperscale Computing
      • Technologies
        • 3D-IC Design
        • Advanced Node
        • AI / Machine Learning
        • Arm-Based Solutions
        • Cloud Solutions
        • Computational Fluid Dynamics
        • Functional Safety
        • Low Power
        • Mixed Signal
        • Photonics
        • RF / Microwave
      • Industries
        • 5G Systems and Subsystems
        • Aerospace and Defense
        • Automotive
        • Hyperscale Computing
      • Technologies
        • 3D-IC Design
        • Advanced Node
        • AI / Machine Learning
        • Arm-Based Solutions
        • Cloud Solutions
        • Computational Fluid Dynamics
        • Functional Safety
        • Low Power
        • Mixed Signal
        • Photonics
        • RF / Microwave
      • Industries
        • 5G Systems and Subsystems
        • Aerospace and Defense
        • Automotive
        • Hyperscale Computing
      • Technologies
        • 3D-IC Design
        • Advanced Node
        • AI / Machine Learning
        • Arm-Based Solutions
        • Cloud Solutions
        • Computational Fluid Dynamics
        • Functional Safety
        • Low Power
        • Mixed Signal
        • Photonics
        • RF / Microwave
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        • Support Process
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        • Languages and Methodologies
        • Digital Design and Signoff
        • IC Package
        • PCB Design
        • System Design and Verification
        • Tensilica Processor IP
      • Support
        • Support Process
        • Online Support
        • Software Downloads
        • Computing Platform Support
        • Customer Support Contacts
        • Technical Forums
      • Training
        • Custom IC / Analog / RF Design
        • Languages and Methodologies
        • Digital Design and Signoff
        • IC Package
        • PCB Design
        • System Design and Verification
        • Tensilica Processor IP
      • Support
        • Support Process
        • Online Support
        • Software Downloads
        • Computing Platform Support
        • Customer Support Contacts
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Latinx Students in Technology Scholarship Program

Applications to the 2021 scholarship are now closed. Thank you for applying!

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Cadence Latinx Students in Technology Scholarship Program

Cadence is committed to building a culture that fosters inclusion and embraces diverse backgrounds, experiences, and ideas. Our internship program and relationships with key universities are a critical part of our strategy to increase and support diversity. To further support this mission, we are offering the Cadence Latinx Students in Technology Scholarship for eligible Latinx and Hispanic students and interns.

Applications to the 2021 scholarship are now closed. Thank you for applying!

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Dr. Joachim Rodrigues on the Cadence Academic Network and CDNLive! EMEA

Prof. Mladen Berekovic, University of Jena, discusses the Cadence Academic Network

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Prof. Dr.-Ing. Michael Hübner, Ruhr University Bochum, on the Cadence Academic Network

Cadence Academic Network University Software Program

Ralf Sommer, Illmenau University of Technology, on Presenting at CDNLive!

News ReleasesVIEW ALL
  • Cadence Academic Network Expands with the First Certified Lab in Kazakhstan at Nazarbayev University 06/06/2019

  • Cadence Expands Customer-Managed Cloud Options with New Cloud Passport Partner Program 06/03/2019

  • Hiroshima University Research Team Accelerates the Development of a Computer-Aided Medical Diagnosis System with Cadence Tensilica Vision P6 DSP Core and Protium S1 FPGA-Based Prototyping Platform 10/11/2017

  • Cadence Announces Global Tensilica Design Contest for Processor Optimization 07/06/2016

  • Cadence and University of Oxford Foster the Advancement of Formal Verification Innovation 04/06/2016

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Customers

The Cadence iLS courses, laboratories, and Rapid Adoption Kits have been tremendously useful in rapidly improving my research team and student skill set in electronic design automation. I strongly recommend using the iLS tools if you want to effectively improve your EDA and digital design skill set.

Dr. Matthew Morrison, Assistant Professor, University of Mississippi

Cadence is a leader in supporting technical and professional activities that have enabled building an EDA community. ACM SIGDA is very appreciative of the their continued support to nurture young professionals and students through sustained support of activities at major EDA conferences.

Dr. Vijaykrishnan Narayanan, ACM SIGDA Chair, Distinguished Professor of Computer Science and Engineering, Pennsylvania State University

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Cadence Academic Network support is the key to enabling our capabilities in innovating integrated circuit and system design with extreme energy/power efficiency. The quality of Cadence tools is outstanding and offers responsive support to address the challenges posed by new design methodologies and techniques.

Prof. Massimo Alioto, IEEE Fellow Director of the Integrated Circuit and Embedded Systems Lab, National University of Singapore

The greatest benefit that we get from the Cadence Academic Network is access to the most modern tools for electronic design automation.

Professor Ulrich Bruening, University of Heidelberg, Germany

The Academic Network helps us to be in line with the newest technology from Cadence, helping my research to stay at the leading edge.

Professor Michael Huebner, Ruhr-University of Bochum, Germany

The comprehensive reach of the Cadence Academic Network has help us cover every aspect of design from analog circuitry to digital and system design, so it is extremely useful for us.

Professor Mladen Berekovic, Braunschweig University of Technology

Cadence has made us confident in our work, because we know that we are instructing students in the most modern and capable tools which are used worldwide.

Professor Marek Wójcikowski, Gdansk University, Poland

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