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DESIGN EXCELLENCE

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CADENCE CLOUD

Digital Design and Signoff

Cadence® digital design and signoff solutions provide a fast path to design closure and better predictability, helping you meet your power, performance, and area (PPA) targets.

  • Logic Equivalence Checking
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  • Functional ECO
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  • Achieve best PPA with the next-generation Digital Full Flow solution Learn More
  • Address digital implementation challenges with machine learning Watch Now

Custom IC / Analog / RF Design

Cadence® custom, analog, and RF design solutions can help you save time by automating many routine tasks, from block-level and mixed-signal simulation to routing and library characterization.

  • Circuit Design
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  • Solve analog simulation challenges in complex designs Watch Now
  • See how the Virtuoso Design Platform addresses advanced custom IC and system design challenges Watch Now

System Design and Verification

Cadence® system design and verification solutions, integrated under our Verification Suite, provide the simulation, acceleration, emulation, and management capabilities.

  • Debug Analysis
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  • Prototype your embedded software development Watch Now
  • Learn how early firmware development enabled first silicon success at Toshiba Memory Watch Now

IP

An open IP platform for you to customize your app-driven SoC design.

  • Interface IP
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  • System / Peripherals IP
  • Verification IP
  • Solve the challenges of long-reach signaling with Cadence 112G SerDes IP Watch Now
  • Meeting the needs of 5G communication with Tensilica® ConnX B20 DSP IP Download Now

IC Package Design and Analysis

Driving efficiency and accuracy in advanced packaging, system planning, and multi-fabric interoperability, Cadence® package implementation products deliver the automation and accuracy.

  • Cross-Platform Co-Design and Analysis
  • IC Package Design
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  • Cadence Design Solutions certified for TSMC SoIC advanced 3D chip stacking technology Learn More
  • Four reasons to avoid multi-layer flip-chip pin padstacks Learn More

System Analysis

Cadence® system analysis solutions provide highly accurate electromagnetic extraction and simulation analysis to ensure your system works under wide-ranging operating conditions.

  • See how to improve electrical-thermal co-simulation with the Celsius™ Thermal Solver Watch Now
  • Get true 3D system analysis with faster speeds, more capacity, and integration Watch Now
  • Electromagnetic Solutions
  • RF / Microwave Design
  • Thermal Solutions
  • System Analysis Resources Hub

Embedded Software

PCB Design and Analysis

Cadence® PCB design solutions enable shorter, more predictable design cycles with greater integration of component design and system-level simulation for a constraint-driven flow.

  • Design Authoring
  • PCB Layout
  • Library and Design Data Management
  • Analog/Mixed-Signal Simulation
  • SI/PI Analysis
  • SI/PI Analysis Point Tools
  • What's New in Allegro
  • What's New in Sigrity
  • RF / Microwave Design
  • Flows
  • Advanced PCB Design & Analysis Blog
  • Watch how to easily tackle complex and cutting edge designs. Learn More
  • Learn why signal integrity analysis needs to be power-aware Watch Now
  • Augmented Reality Lab Tools

AI / Machine Learning

AI IP Portfolio

INDUSTRIES

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TECHNOLOGIES

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See how our customers create innovative products with Cadence Explore Now

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TRAINING

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  • PRODUCTS
    • DESIGN EXCELLENCE
      • Digital Design and Signoff
        • Logic Equivalence Checking
        • Innovus Implementation and Floorplanning
        • Functional ECO
        • Low-Power Validation
        • Synthesis
        • Power Analysis
        • Constraints and CDC Signoff
        • Silicon Signoff and Verification
        • Library Characterization
        • Test
        • Flows
      • Custom IC / Analog / RF Design
        • Circuit Design
        • Circuit Simulation
        • Layout Design
        • Layout Verification
        • Library Characterization
        • RF / Microwave Solutions
        • Flows
      • System Design and Verification
        • Debug Analysis
        • Emulation
        • Formal and Static Verification
        • FPGA-Based Prototyping
        • Planning and Management
        • Simulation
        • Software-Driven Verification
        • Verification IP
        • System-Level Verification IP
        • Flows
      • IP
        • Interface IP
        • Denali Memory IP
        • Tensilica Processor IP
        • Analog IP
        • System / Peripherals IP
        • Verification IP
      • IC Package Design and Analysis
        • Cross-Platform Co-Design and Analysis
        • IC Package Design
        • SI/PI Analysis
        • SI/PI Analysis Point Tools
        • Flows
    • SYSTEM INNOVATION
      • System Analysis
        • Electromagnetic Solutions
        • RF / Microwave Design
        • Thermal Solutions
        • System Analysis Resources Hub
      • Embedded Software
      • PCB Design and Analysis
        • Design Authoring
        • PCB Layout
        • Library and Design Data Management
        • Analog/Mixed-Signal Simulation
        • SI/PI Analysis
        • SI/PI Analysis Point Tools
        • What's New in Allegro
        • What's New in Sigrity
        • RF / Microwave Design
        • Flows
        • Advanced PCB Design & Analysis Blog
        • Augmented Reality Lab Tools
    • PERVASIVE INTELLIGENCE
      • AI / Machine Learning
      • AI IP Portfolio
    • CADENCE CLOUD
  • SOLUTIONS
      • INDUSTRIES
        • 5G Systems and Subsystems
        • Aerospace and Defense
        • Automotive
        • AI / Machine Learning
      • TECHNOLOGIES
        • 3D-IC Design
        • Advanced Node
        • Arm-Based Solutions
        • Cloud Solutions
        • Low Power
        • Mixed Signal
        • Photonics
        • RF / Microwave
      • INDUSTRIES
        • 5G Systems and Subsystems
        • Aerospace and Defense
        • Automotive
        • AI / Machine Learning
      • TECHNOLOGIES
        • 3D-IC Design
        • Advanced Node
        • Arm-Based Solutions
        • Cloud Solutions
        • Low Power
        • Mixed Signal
        • Photonics
        • RF / Microwave
      • INDUSTRIES
        • 5G Systems and Subsystems
        • Aerospace and Defense
        • Automotive
        • AI / Machine Learning
      • TECHNOLOGIES
        • 3D-IC Design
        • Advanced Node
        • Arm-Based Solutions
        • Cloud Solutions
        • Low Power
        • Mixed Signal
        • Photonics
        • RF / Microwave
      • INDUSTRIES
        • 5G Systems and Subsystems
        • Aerospace and Defense
        • Automotive
        • AI / Machine Learning
      • TECHNOLOGIES
        • 3D-IC Design
        • Advanced Node
        • Arm-Based Solutions
        • Cloud Solutions
        • Low Power
        • Mixed Signal
        • Photonics
        • RF / Microwave
  • SUPPORT
      • SUPPORT
        • Support Process
        • Online Support
        • Software Downloads
        • Computing Platform Support
        • Customer Support Contacts
        • Technical Forums
      • TRAINING
        • Custom IC / Analog / RF Design
        • Languages and Methodologies
        • Digital Design and Signoff
        • IC Package
        • PCB Design
        • System Design and Verification
        • Tensilica Processor IP
      • SUPPORT
        • Support Process
        • Online Support
        • Software Downloads
        • Computing Platform Support
        • Customer Support Contacts
        • Technical Forums
      • TRAINING
        • Custom IC / Analog / RF Design
        • Languages and Methodologies
        • Digital Design and Signoff
        • IC Package
        • PCB Design
        • System Design and Verification
        • Tensilica Processor IP
      • SUPPORT
        • Support Process
        • Online Support
        • Software Downloads
        • Computing Platform Support
        • Customer Support Contacts
        • Technical Forums
      • TRAINING
        • Custom IC / Analog / RF Design
        • Languages and Methodologies
        • Digital Design and Signoff
        • IC Package
        • PCB Design
        • System Design and Verification
        • Tensilica Processor IP
      • SUPPORT
        • Support Process
        • Online Support
        • Software Downloads
        • Computing Platform Support
        • Customer Support Contacts
        • Technical Forums
      • TRAINING
        • Custom IC / Analog / RF Design
        • Languages and Methodologies
        • Digital Design and Signoff
        • IC Package
        • PCB Design
        • System Design and Verification
        • Tensilica Processor IP
  • COMPANY
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      • CORPORATE
        • About Us
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        • Investor Relations
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      • MEDIA CENTER
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      • CULTURE AND CAREERS
        • Culture and Diversity
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      • CORPORATE
        • About Us
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        • Investor Relations
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      • MEDIA CENTER
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      • CULTURE AND CAREERS
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      • CORPORATE
        • About Us
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Lead Institutions

Key influencers of the Academic Partnerships team

  • Cadence Academic Network
  • Academic Partnerships
  • University Software Program
  • Celebrating 10 Years Together

Lead Institutions are universities where the academic staff have proven expertise in certain Cadence technology for education and research. They are key influencers in the Academic Network and each maintains a Cadence Academic Network LinkedIn group focused on their technical area of expertise.

System Design Verification

 

Advanced Verification Methodology

  • University of Bristol
  • University of Heidelberg

SystemC and HLS

  • Technical University Dresden
Custom IC / Analog / RF Design

Circuit Design and Simulation

  • University of Freiburg
  • Illmenau University
  • FHNW University of Applied Sciences and Arts Northwestern Switzerland

RFIC Design

  • KTH Royal Institute of Technology

Analog Layout Design and Verification

  • Reutlingen University
Digital Design and Signoff

Design for Test

  • Delft University of Technology
  • FHNW University of Applied Sciences and Arts Northwestern Switzerland

Digital Implementation

  • University of Luebeck
  • Lund University

Synthesis and Low-Power Verification

  • University of Luebeck
  • Lund University

PCB Design and Analysis

PCB/Package Analysis

  • Politehnica University of Bucharest
Tensilica Processor IP

Tensilica Processors

  • Hannover University
  • Brandenburg University of Technology
Videos

Integrating Video, Radar, and Lidar for Autonomous Driving

1M Processors to Model the Human Brain

Hardware Systems for Digital Hearing Aid

Chips to Study Natural Intelligence and to Build Artificial Intelligence

Academic Expert Insights - University of Mississippi

Academic Expert Insights - Wayne State University

News ReleasesVIEW ALL
  • Cadence Academic Network Expands with the First Certified Lab in Kazakhstan at Nazarbayev University 06/06/2019

  • Cadence Expands Customer-Managed Cloud Options with New Cloud Passport Partner Program 06/03/2019

  • Hiroshima University Research Team Accelerates the Development of a Computer-Aided Medical Diagnosis System with Cadence Tensilica Vision P6 DSP Core and Protium S1 FPGA-Based Prototyping Platform 10/11/2017

Blogs VIEW ALL
Customers

The Cadence iLS courses, laboratories, and Rapid Adoption Kits have been tremendously useful in rapidly improving my research team and student skill set in electronic design automation. I strongly recommend using the iLS tools if you want to effectively improve your EDA and digital design skill set.

Dr. Matthew Morrison, Assistant Professor, University of Mississippi

Cadence is a leader in supporting technical and professional activities that have enabled building an EDA community. ACM SIGDA is very appreciative of the their continued support to nurture young professionals and students through sustained support of activities at major EDA conferences.

Dr. Vijaykrishnan Narayanan, ACM SIGDA Chair, Distinguished Professor of Computer Science and Engineering, Pennsylvania State University

We are grateful for the engagement with Cadence over the past 10 years. It has led us to innovative breakthroughs and has helped us educate pioneering scholars for the future workforce in EDA.

Dr. Xin Li Professor, Electrical and Computer Engineering, Duke University

Cadence Academic Network support is the key to enabling our capabilities in innovating integrated circuit and system design with extreme energy/power efficiency. The quality of Cadence tools is outstanding and offers responsive support to address the challenges posed by new design methodologies and techniques.

Prof. Massimo Alioto, IEEE Fellow Director of the Integrated Circuit and Embedded Systems Lab, National University of Singapore

The greatest benefit that we get from the Cadence Academic Network is access to the most modern tools for electronic design automation.

Professor Ulrich Bruening, University of Heidelberg, Germany

The Academic Network helps us to be in line with the newest technology from Cadence, helping my research to stay at the leading edge.

Professor Michael Huebner, Ruhr-University of Bochum, Germany

The comprehensive reach of the Cadence Academic Network has help us cover every aspect of design from analog circuitry to digital and system design, so it is extremely useful for us.

Professor Mladen Berekovic, Braunschweig University of Technology

Cadence has made us confident in our work, because we know that we are instructing students in the most modern and capable tools which are used worldwide.

Professor Marek Wójcikowski, Gdansk University, Poland

We are proud to be part of Cadence Academic Network because it provides us the opportunity to interact with other leading institutions covering a broad range of research topics.

Professor Holger Blume, Leibniz University of Hannover, Germany

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