1 : Accurate and fast modeling for multi-designs co-simulation challenge and solution with Clarity 3D solver
5G, IoT, automotive and datacenter is rapidly expanding need for simulation. The form factor is shrunk, and design complexity is increased while the signal transmission speed is increased continuously. To meet time to market with good accurate sign-off flow, more and more design requires true 3D electromagnetic modeling. Cadence Clarity 3D is an innovative full wave solver providing accurate and fast modeling for chip, package, connector and system board. A massive parallel computation technology can leverage existing machine resource and less memory to complete a complicated model extraction. Allegro and Clarity integration provides a very efficient and accurate model for rigid-flex board designs.
2 : AI interposer power modeling & HBM power noise prediction studies
With AI and machine learning rapidly growing in recent days, HBM technology with much higher memory bandwidth is required for parallel computation applications. For AI chip designers, they are facing much more challenges in high power consumption, high density, limited space, high signal quality and power noise performance etc. This paper firstly discusses one large-scale AI interposer design and its modeling techniques. Then the extracted models are used in the system-level HBM simulation, several new methodologies are implemented to predict the critical power noise. Finally, the simulated signal and power performance correlates well with the HBM lab measurement and vendor’s reference data.
3 : Power and signal Integrity Co-simulation For 2.5D-&3D-IC system
Nowadays high end applications, such as AI, servers, storages, networks etc, which require high speed bandwidth and extreme performance. Process evolution becoming more and more difficult, 2.5D&3DIC solution extend Moore Law and fits well for exabytes data processing,for example TSMC CoWos 2.5D IC solution.There are many challenges need to overcome, 3D structure is much more complexity, difficult to modeling,analyze, verify and sign-off. Among in those challenges ,Power and Signal Integrity analysis for 2.5D&3D IC system might be most difficult. Different from the traditional 2D system PI&SI analysis, this paper will show: New signal and Power Integrity analysis method for 2.5D CoWos &3DIC design were introduced. This SI/PI solution base on TSMC 2.5D CoWos design, including HBM interposer+PKG+PCB signal and power model building and multiple channel eye diagram and timing analysis,which using Cadence solution with Clarity3D,PowerSI and SystemSI tools. Fast and Accurate modeling and simulating methodology help to verify 2.5D CoWos&3DIC design quality and time to tape-out.
4 : In-Situ Antenna Design and De-sense Analysis Flow For Mobile Devices Using Clarity 3D Solver
Conformal antennas used in modern mobile platforms require in-situ tuning and optimization. The antenna performance and frequency response are significantly impacted by the various elements of the platform including the case, display, and other metallic structure to the antenna. Since the versatile of modern mobile devices, the components and structures are ultimately close to the antenna. The full-wave 3D solvers must be utilized to accurately model in-situ antenna response prior to design signoff. Beyond the requirement for in-situ antenna analysis, density of modern mobile designs force engineers to also simulate antenna de-sense response. RF and high-speed digital signals radiating off boards, packages, cables, and connecters inside the mobile device couple to the antenna and can significantly degrade the performance of radio receivers. In this talk, the illustration for Clarity 3D field solver can be utilized to perform efficient and accurate analysis of mobile antennas in-situ, and incorporate radiating boards, package, and connectors to model complex de-sense analysis.
5 : Efficient and accurate RF/3DIC model extraction solution with EMX
Accompany with 5G development, RF module design will meet more challenge in linearity, power and heat necessary to be successfully in the handset market. How to get efficient and accurate EM model will help designer to shorten the design cycle and bring to market better products with less risk. This presentation will introduce a new RF solution -EMX to overcome the upcoming 5G’s difficulty.
AI interposer power modeling & HBM power noise prediction studies
Yongsong He, Enflame
Jinsong Hu, Cadence
Accurate and fast modeling for multi-designs co-simulation challenge and solution with Clarity 3D solver
Charlie Shih, Cadence
Efficient and accurate RF3DIC model extraction solution with EMX
David Huang, Cadence
In-Situ Antenna Design and De-sense Analysis Flow For Mobile Devices Using Clarity 3D Solver
Bill Hung, Cadence
Power and signal Integrity Co-simulation For 2.5D&3D IC system
Jiangtao Zhang, ZTE/SANECHIPS
Jian Pang, ZTE/SANECHIPS
Bin Yu, ZTE/SANECHIPS
Tuobei Sun, ZTE/SANECHIPS
Zhemin Zhuang, Cadence