Sigrity XtractIM

To help you create accurate, RLC, IBIS or SPICE IC package electrical models up to 10 times faster than alternative approaches, Cadence^® Sigrity™ XtractIM™ technology uses hybrid solvers. With these hybrid-solver-derived models you can perform system-level signal and power integrity simulations by including drivers, receivers, and other interconnects. An option to generate broadband-optimized models is included.

Sigrity XtractIM technology gives you electrical models of IC packages in IBIS or SPICE circuit netlist format. These concise parasitic models can be per pin/net RLC list, coupled matrices, or Pi/T SPICE sub-circuits.

The technology’s broadband-optimized multi-stage models mean you can verify its accuracy over a specific frequency range and fill a gap between IBIS/RLGC and full-wave S-parameters. Whether you’re a casual or frequent user, the tool is readily accessible with an easy-to-use workflow helps you set up tasks such as stackup checking, C4 bump and solder ball creation, and signal and power/ground net selection, as well as defining other extraction parameters.

Features

• Visualizes potential package performance issues
• Extracts models of entire packages or selected nets
• First-ever package assessment visualization to rapidly pinpoint potential risks and avoid the needle-in-haystack issue
• Flexible pin-grouping options to enable the user-preferred model resolution
• Comprehensive extraction of the entire design, including embedded passive components
• Compact broadband models (2% S-parameter model size) with time domain circuit simulation compatibility
• Flexible 2D/3D visualization, plotting, and spreadsheet data management
• Optimized to read physical design data from Cadence package design tools
• Readily used with Mentor or Zuken package databases