Redefining Cross-Domain Co-Design Planning

Cadence Integrity System Planner redefines the cross-domain co-design planning and management process by unifying IC, interposer, package, and board data in a single design tool environment. This enables engineers to achieve the optimal balance of connectivity for performance, cost, and manufacturability prior to implementation—resulting in fewer iterations and shorter development cycles.

Conventional design methodology has been a serial top-down approach where the IC drives downstream connectivity with minimal upstream feedback, with data communicated using static spreadsheets. Each design often has independent design capture and management processes. Growing functional integration at both the die and package level, combined with the latest high-performance interfaces, requires greater planning and coordination across the entire system to achieve product performance objectives, leaving little room for inefficient and error-prone methodologies. Integrity System Planner addresses these challenges with an IC, interposer, package, and board co-design solution.

Co-design with Integrity System Planner

Key Benefits

Flexibility

Flexible environment capable of assembling the system design from a variety of import formats

Optimized Connectivity

Passive substrates such as interposers and packages can be created and populated with optimized netlist connectivity and bump placement based on the system design floorplan

Immediate Feedback

Rapid exploration and evaluation of connectivity scenarios provides immediate feedback on impact to adjacent devices and substrates

Streamline Iterations

The entire system design is captured and managed with multiple design implementation efforts from a common source

Integration Highlights

Integrity System Planner works as part of an overall Cadence cross-platform co-design solution.

  • Seamlessly exchanges data with Cadence Allegro packaging and PCB technologies
  • Imports designs directly into Allegro X Advanced Package Designer for implementation
  • Serves as cockpit for the Integrity 3D-IC platform, providing tight integration and system-level co-design with Cadence Innovus Implementation System, Cadence Virtuoso Studio, and Allegro X Advanced Package Designer