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  • Liberate LV Library Validation Solution

Liberate LV Library Validation Solution

Validate a complete library overnight

Liberate LV Library Validation Solution Datasheet

Addressing Process Variation and Reducing Timing Pessimism at 16nm and Below White Paper

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Key Benefits

  • Enables ultra-fast throughput to complete library validation overnight on a small number of multi-core computers
  • For library providers, assures the library quality before the library is shipped
  • For library users, allows cross-checking of the incoming library and provides a clear understanding of the impact of any changes due to revisions of extracted cell netlists or process models
  • Ensures coverage of all function descriptions, necessary timing, noise, power, leakage arcs, and states in the input library directly against the transistor-level circuit
  • TÜV SÜD “Fit for Purpose – TCL1” certified to meet ISO 26262 automotive functional safety requirements

The Cadence® Liberate™ LV library validation solution provides a comprehensive library validation system including function equivalence and data consistency checking, revision analysis, and correlation with various electrical analysis tools for timing, noise, and power.

The Liberate LV solution provides a collection of utilities for validating libraries, including functional equivalence checking, data consistency checking, revision analysis, and correlation with various electrical analysis tools for timing, noise, and power. The Liberate LV solution provides the means to validate and verify the final library to ensure consistency, completeness, and accuracy.

  • Read article on “Library "Safe Margins"—Are They Really Saving Your Design?”

Automotive TCL1 Certified for ISO 26262

The industry’s first digital implementation and signoff flow to achieve “Fit for Purpose - Tool Confidence Level 1 (TCL1)” certification enables you to meet stringent ISO 26262 automotive safety requirements. The Liberate Characterization Solution is part of the flow covering RTL-to-GDSII implementation and signoff. For information on the safety manuals, Tool Confidence Analysis (TCA) documents, and compliance reports from TÜV SÜD, download the Functional Safety Documentation Kits through Cadence Online Support.

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  • Related Products

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  • Cadence Prototypes First IP Interface in Silicon for Preliminary Version of DDR5 Standard Being Developed in JEDEC
  • Cadence Collaborates with TSMC to Advance 5nm and 7nm+ Mobile and HPC Design Innovation
  • Cadence Supports New TSMC WoW Advanced Packaging Technology
  • Cadence全新Tensilica Vision Q6 DSP IP提升視覺與AI效能
  • Cadence Boosts Vision and AI Performance with New Tensilica Vision Q6 DSP IP
  • Cadence推出全新Virtuoso平台,提供優化系統設計並支援5nm先進製程節點與模擬驅動佈局
  • Cadence Expands Virtuoso Platform with Enhanced System Design, Advanced Node Support down to 5nm, and Simulation-Driven Layout
  • Cadence Sigrity PowerDC技術支援Future Facilities的全新開放型中立檔案格式,為熱分析系列工具的互通性做好準備
  • Cadence Sigrity PowerDC Technology Supports Future Facilities' New Open Neutral File Format for Thermal Interoperability
  • Imec與Cadence攜手成功實現首款3奈米測試晶片設計定案
  • Imec and Cadence Tape Out Industry's First 3nm Test Chip
  • GEO Semiconductor Selects Cadence Tensilica Vision P5 DSP for Their Most Advanced Automotive Smart Viewing Camera Processor
  • Cadence’s Lip-Bu Tan to Present at Morgan Stanley TMT Conference
  • Software-Based GPS Receiver from Galileo Satellite Navigation Now Available on Cadence Tensilica Fusion F1 DSP
  • Cadence Named by Fortune and Great Place to Work as One of the 2018 Fortune 100 Best Companies to Work For
  • 日月光與Cadence攜手共同開發首套日月光高效能、 先進IC封裝技術量身打造的系統級封裝EDA解決方案
  • Cadence Reports Fourth Quarter and Fiscal Year 2017 Financial Results
  • Cadence Tensilica 高傳真音訊數位訊號處理器業界首創支援Dolby Atmos 個人電腦應用
  • Cadence Tensilica HiFi Audio DSP is the First DSP IP Core to Support Dolby Atmos for PCs
  • Cadence益華電腦宣佈推出業界首款的PCI Express 5.0驗證IP
  • Cadence Announces Availability of Industry’s First PCI Express 5.0 Verification IP
  • Cadence’s Lip-Bu Tan and John Wall to Present at Credit Suisse 2017 TMT Conference
  • Cadence 任命Anirudh Devgan擔任Cadence總裁
  • 海思麒麟Kirin 970行動應用處理器採用Cadence Tensilica Vision P6 DSP提升圖像視覺處理效能
  • Cadence Appoints Anirudh Devgan as President
  • Cadence’s Alan Lindstrom to Present at MKM Partners Entertainment, Travel and Technology Conference
  • HiSilicon Selects Cadence Tensilica Vision P6 DSP for its Latest Kirin 970 Mobile Application Processor
  • Cadence工具符合汽車ISO 26262標準 獲得TÜV SÜD業界首個全面「符合目的 - TCL1」認證
  • Cadence to Expand High-Speed Communications IP Portfolio with Acquisition of nusemi inc
  • Cadence’s John Wall to Present at 2017 RBC TMT Conference
  • ChipEstimate.com Launches New Compare IP Tool
  • Cadence益華電腦獲最佳職場研究所與財富雜誌評選為2017年全球最佳跨國職場第13名
  • Great Place to Work and Fortune Name Cadence One of the World’s Best Multinational Workplaces for 2017
  • Cadence Reports Third Quarter 2017 Financial Results
  • Cadence and Arm Deliver First SoC Verification Solution for Low-Power, High-Performance Arm-Based Servers
  • Cadence Achieves TÜV SÜD’s First Comprehensive “Fit for Purpose - TCL1” Certification in Support of Automotive ISO 26262 Standard
  • Hiroshima University Research Team Accelerates the Development of a Computer-Aided Medical Diagnosis System with Cadence Tensilica Vision P6 DSP Core and Protium S1 FPGA-Based Prototyping Platform
  • Teradyne Standardizes on Cadence Xcelium Parallel Logic Simulator
  • Cadence Design Systems Announces Third Quarter 2017 Financial Results Webcast
  • Cadence Genus Synthesis Solution Enables Fuji Xerox to Improve Multi-Functional Printer SoCs Design Development
  • Cadence益華電腦與MathWorks發表最新整合產品加速資料探勘及分析
  • Cadence益華電腦工具及流程獲得台積公司12FFC製程生產認證
  • Cadence DFM Signoff Solutions Achieve Qualification for Samsung 28nm FD-SOI/14nm/10nm Process Technologies
  • Cadence益華電腦為台積公司16FFC車用設計實現平台推出全系列IP產品
  • Cadence Recognized with Three TSMC Partner of the Year Awards
  • Cadence Introduces the Conformal Smart Logic Equivalence Checker
  • Cadence Delivers Design and Analysis Flow Enhancements for TSMC InFO and CoWoS® 3D Packaging Technologies
  • Cadence Appoints John Wall as Next Chief Financial Officer
  • New Cadence Allegro PCB DesignTrue DFM Technology Accelerates New Product Development and Introduction Process
  • Xilinx, Arm, Cadence, and TSMC Announce World’s First CCIX Silicon Demonstration Vehicle in 7nm Process Technology
  • Cadence Tools and Flows Achieve Production-Ready Certification for TSMC’s 12FFC Process
  • Cadence Collaborates with TSMC to Advance 7nm FinFET Plus Design Innovation
  • Cadence Announces Legato Memory Solution, Industry’s First Integrated Memory Design and Verification Solution
  • Cadence優化全流程數位與簽核及驗證套裝,支援Arm Cortex-A75、Cortex-A55 CPU及Arm Mali-G72 GPU
  • Cadence Full-Flow Digital and Signoff and Verification Suite Optimized to Support Arm Cortex-A75 and Cortex-A55 CPUs and Arm Mali-G72 GPU
  • Cadence宣布推出針對最新行動和家庭娛樂應用的Tensilica HiFi 3z DSP架構
  • Cadence Announces Tensilica HiFi 3z DSP Architecture for Latest Mobile and Home Entertainment Applications
  • Cadence Reports Second Quarter 2017 Financial Results
  • Nagoya University and Cadence Collaborate to Port AUTOSAR-Compliant TOPPERS Automotive Kernel to Tensilica Processors and DSPs
  • Cadence擴大線上工具支援ARM DesignStart計畫以加速系統單晶片設計交付
  • 全新Cadence Virtuoso系統設計平台實現IC、封裝與電路板間無縫設計流程
  • Cadence Expands Online Tool Access for ARM DesignStart Customers to Accelerate SoC Design Delivery
  • Cadence Design Systems Corporate Vice President Finance & Controller to Present at Baird 2017 Global Consumer, Technology & Services Conference on June 8, 2017 in New York
  • New Cadence Virtuoso System Design Platform Provides Seamless Design Flow Between IC, Package and Board
  • Cadence益華電腦新竹辦公室喬遷 厚植研發與擴大客戶支援實力
  • Cadence and MathWorks Announce New Integration to Accelerate Data Mining and Analytics
  • Cadence益華電腦推出業界首創汽車、監控、無人機及行動市場的神經網路 DSP IP
  • Cadence Introduces First Interface and Verification IP Solution for CCIX to Advance New Class of Datacenter Servers
  • Cadence Reports First Quarter 2017 Financial Results
  • Cadence益華電腦推出大規模並行實體簽核解決方案Pegasus驗證系統
  • Cadence益華電腦發表7奈米製程的擴展性Virtuoso先進節點平台
  • Cadence益華電腦獲得台積公司7nm製程技術認證
  • Cadence益華電腦為台積公司InFO封裝技術推出優化的整合式的設計與分析流程
  • Cadence Expands Capabilities of Integrated Design and Analysis Flow for TSMC InFO Packaging Technology
  • Cadence益華電腦獲選為2017年財星雜誌「百大最佳職場」
  • Cadence Named One of Fortune “100 Best Companies to Work For” in 2017
  • Cadence益華電腦推出業界首款通過生產驗證的Xcelium平行模擬平台
  • Cadence益華電腦推出用於早期軟體開發的FPGA原型驗證平台Protium S1
  • Cadence Launches Protium S1 FPGA-Based Prototyping Platform for Early Software Development
  • Cadence Launches Xcelium Parallel Simulator, the Industry’s First Production-Proven Parallel Simulator
  • Waves Nx VR Audio Technology Now Available for Cadence Tensilica HiFi Audio DSPs
  • Cadence Design Systems President and CEO Lip-Bu Tan to Present at Morgan Stanley Technology, Media & Telecom Conference on March 2, 2017 in San Francisco
  • Cadence 益華電腦推出Sigrity 2017 快速實現PCB電源完整性簽核
  • Cadence益華電腦 Virtuoso ADE榮獲《Electronic Products》雜誌年度最佳產品
  • Cadence Reports Fourth Quarter and Fiscal Year 2016 Financial Results
  • Cadence Sigrity 2017 Delivers Fast Path to PCB Power Integrity Signoff
  • Cadence益華電腦榮登2016年大中華區三十大最佳職場之列

Datasheet (119)

  • Protium S1 FPGA-Based Prototyping Platform
  • Allegro System Capture Datasheet
  • Allegro EDM Datasheet
  • Conformal Smart LEC Datasheet
  • Liberate Trio Characterization Suite Datasheet
  • Legato Reliability Solution Datasheet
  • Quantus Extraction Solution
  • Perspec System Verifier Datasheet
  • Allegro Pulse Datasheet
  • SpeedBridge Adapter for USB 3.0/2.0/1.1 Devices
  • Legato Memory Solution Datasheet
  • SpeedBridge Adapter for PCIe 4.0 Datasheet
  • Cadence SiP Layout WLP Option Datasheet
  • Virtuoso System Design Platform Datasheet
  • VirtualBridge Adapter for PCI Express 2.0/3.0 Datasheet
  • Pegasus Verification System
  • Xcelium Parallel Logic Simulation Datasheet
  • Protium S1 Single-FPGA Board Datasheet
  • vManager Metric-Driven Signoff Platform Datasheet

White Paper (57)

  • Consolidating RF Flow for High-Frequency Product Design
  • Delivering Superior Throughput for EDA Verification Workloads White Paper
  • Analog Reliability Analysis for Mission-Critical Applications White Paper
  • Cadence Cloud—The Future of Electronic Design Automation White Paper
  • Accelerating SoC Time to Market with Cloud-Based Verification White Paper
  • Improving Test Coverage and Eliminating Test Ecapes Using Analog Defect Analysis White Paper
  • Backchannel Modeling and Simulation Using Recent Enhancements to the IBIS Standard White Paper
  • DO-254 Explained White Paper
  • Accelerating DO-254 Approval with Cadence Tools White Paper
  • Meeting the Challenges of the 2018 National Defense Strategy White Paper
  • Functional Safety Methodologies for Automotive Applications White Paper
  • Three Things You Need to Know to Use the Accellera PSS White Paper
  • Efficient Verification of Mixed-Signal SerDes IP Using UVM
  • Save Time and Minimize Errors by Automating Co-Design and Co-Analysis of Chips, Boards, and Packages
  • Choosing the Right Verification Technology for CDC-Clean RTL Signoff
  • Choosing the Right Superlinting Technology for Early RTL Code Signoff White Paper
  • High-Level Low-Power System Design Optimization
  • A Program Manager’s Guide to Successful Integrated Circuit Verification
  • Massive SoC Designs Open Doors to New Era in Simulation White Paper
  • SoC Planning, Management, Reporting, Auditing, and Signoff White Paper

Conference Paper (45)

  • SPIE 2017: Methodology for Analyzing and Quantifying Design Style Changes and Complexity Using Topological Patterns Conference Paper
  • SPIE 2017: Pattern-Based Analytics to Estimate and Track Yield Risk of Designs Down to 7nm Conference Paper
  • Signal Integrity Methodology for Double-Digit Multi-Gigabit Interfaces

Success Story Video (43)

  • Faster Timing Characterization of Analog Macros
  • Characterizing 22FDX Library at GLOBALFOUNDRIES
  • Invecas Provides Electromigration-Based Maximum Capacitance Limits for Standard Cell Library Using Cadence Virtuoso Liberate Characterization Solution
  • Seagate Uses Cadence Allegro and Sigrity PCB Tools to Develop Next-Generation Solid-State Drives
  • Raspberry Pi – Challenges in Designing a $10 Computer
  • Microsemi Benefits by Using Pegasus Verification System on Advanced-Node Designs
  • Invecas Floorplan-to-Signoff Success Using Cadence Innovus and Tempus Solutions

Video (886)

  • ARM AMBA Protocol Overview
  • Cadence Solves the Challenges Faced by Mobiveil Technologies Hardware Group
  • Mahesh Soni, Specman Expert on Leveraging the Testcase Generation Utility
  • Using the Specman Profiler
  • The Complexities and Future of Scan Compression
  • Removing Cloud Security Barrier
  • Infinite and Immediate Cloud Resources
  • Define System Architecture with Allegro System Capture
  • Verification Made Easy: Learn How to Avoid Mistakes with Virtuoso ADE Verifier
  • Sigrity Tech Tips: How to Import Optimized 3D Structures Into Your Design Tool After 3D EM Analysis
  • Achieving Better-Quality Results with Specman Elite
  • New Virtuoso Design Platform for Next-Generation Custom IC and System Design
  • Three Key Points About Innovus Implementation System
  • Cadence Education Services Training Course on Real Modeling with SystemVerilog
  • NVIDIA - Palladium/VSP ARM v8 Tegra Hybrid
  • Verification expert tips for improving testbench quality with Specman
  • Call for Presentations CDNLive EMEA 2019: Join the Presenters Hall of Fame!
  • Designing an Automotive Graphics Display Controller with Stratus HLS
  • Texas Instruments - Using the Perspec Solution
  • The Palladium Solution and SoC Emulation for 16nm Automotive Devices at NXP
  • Texas Instruments - Highly Scalable Multicore ARM A15 Verification with Specman/e
  • From TensorFlow to RTL in Three Months
  • Allegro PCB Symphony Team Design 17.2 Release
  • Accelerating design-in of Xilinx FPGAs while optimizing PCB layout for cost and performance
  • Contemporary Verification Consultants e-asing your verification pains with IEEE 1647 & IES
  • 2X Productivity Gain Verifying DDR Controller Using Specman/e
  • Specman Tips & Trick, e-HDL types compliance checks.
  • Standalone AI Processor: Tensilica DNA 100 Processor IP for On-Device AI
  • Significance of Sparsity in Neural Networks
  • Tensilica Neural Network Compiler: Efficiently Deploy Neural Networks
  • Sigrity Tech Tip: How to Accurately Model a Multi-Gigabit Serial Link 10 Times Faster
  • Sigrity Tech Tip: How to Accelerate Accurate 3D Full Wave Extraction Time
  • Leveraging Specman for Verification
  • Leveraging Specman for Signoff
  • Integrated Return Path and Crosstalk Analysis
  • 3D Spacing Measurements
  • Manage Signal Return Path
  • How Arm and Cadence Partner to Accelerate IoT Design
  • Tackling 16nm Challenges for Arm Cortex-A72 Processor
  • Cadence Showcases New Tensilica DNA 100 AI Processor
  • Automotive Sensor Design Enablement
  • Signoff with Confidence
  • Integrated Design for Test (DFT) Checks
  • Real-Time DFM Verification
  • 3D Component Placement and Movement
  • Improve Design Impedance from PCB Canvas
  • Optimize Component Placement
  • Improve Route Quality
  • HPE Apollo 70 Collaboration
  • Automating Library Synchronization between PTC Windchill and Cadence Allegro Library
  • 3D Bending of Flex Material
  • Return Path DRCs
  • Enhancements for High Speed Designs in Allegro PCB Editor
  • Interactive 3D Canvas
  • Looking for Efficiency While Leveraging the MathWorks and Cadence Alliance
  • The Cadence vManager Metric-Driven Signoff Platform in Use at NXP
  • A Team-Based Approach to PDN Design
  • Prof. Leonardo Londero de oliveira Tensilica Design Contest winner (Federal University of Santa Maria/Brazil) – Cadence Academic Network
  • Specman: Fastest Patches on Earth
  • Multi-Board Electrical and Thermal Co-simulation using Sigrity PowerDC
  • Tensilica Hardware Safety Kit ISO 26262
  • Whiteboard Wednesdays - Introduction to Functional Safety From an IP Supplier
  • Introduction to ADAS with a Real-Life Example
  • What Really Matters When Selecting IP
  • Verification Deliverables Required for Successful SoC Integration
  • The Advantages and Trade-offs of HBM2 and GDDR6
  • The Truth about Designing for Automotive Functional Safety
  • An Introduction to Compute In-Memory
  • Introducing the DFI 5.0 Interface Standard
  • Kickstart Your IoT Design with Cadence and ARM
  • Orit Kirshenberg - Expert Insights Video
  • Specman Tips & Tricks: Save, Restart & Dynamic Load with Specman
  • Big FPGA Boards for ASIC Prototyping
  • Case Studies for Successful FPGA Based Prototyping
  • Hardware Solutions for FPGA-based Prototyping
  • Hardware Solutions for FPGA-Based Prototyping
  • Emulating a Dual-Port 10G/40G NIC on Palladium and RPP
  • Hitachi: Faster Bring Up with Protium Platform
  • Bluespec Taps Into Rapid Prototyping Platform for Hybrid Prototyping
  • Faster HW/SW Debug, Embedded Software Development and System Validation
  • Protium S1 used to prototype a pedestrian detection application.
  • Accelerating design-in of Altera FPGAs while optimizing PCB layout for cost and performance
  • New Cadence Products Expand the Verification Suite: Xcelium Parallel Simulator and Protium S1 Platform
  • Firmware Development and Pre-silicon Verification with FPGA-based Prototyping
  • The Best of Both Worlds – Combining Virtual and FPGA-based Prototypes
  • Xilinx - Industry Leading Solutions for FPGA-based Prototyping
  • FPGA Prototyping Enables Rapid Development of Customizable Processors
  • FPGA-Prototyping of an Automotive Ethernet based Parking Assist System
  • Reduce FPGA-Based Prototype Bring-Up From Months to Days with Cadence Protium S1 Platform
  • Faster Routing by Optimizing FPGA Pin Assignments
  • FPGA board design: Introduction to Cadence FPGA System Planner
  • Enabling Complex Electronic Systems
  • UVM Multi-language with e, SystemVerilog, SystemC, C/C++
  • Nadav Eden – Specman Expert Insights Video
  • CDNLive EMEA 2018 Highlights
  • Smart EM Simulation Automates Work for RFIC and RF Module Designs
  • Yoav Lurie—Specman Expert Insights Video
  • Extoll - Dr. Niels Burkhardt—Specman Expert Insights video
  • Cadence at DAC 2018
  • Accelerate PCB Design with 3D Design and 3D Analysis
  • New Key Features of Xcelium for Advanced Mixed-Signal Verification
  • Interview with Professor Franco Maloberti Part 2 – Academia and Industry
  • Interview with Professor Franco Maloberti Part 1 – Passion for Education
  • Cadence Academic Network University Software Program
  • An industry view on how microelectronics should be taught - Cadence Academic Insights
  • Prof. Dr.-Ing. Michael Hübner, Ruhr University Bochum, on the Cadence Academic Network
  • Cadence Academic Insights- Conversation with Prof. Franco Maloberti Part 3
  • Dr. Eckhard Hennig on the Cadence Academic Network and CDNLive EMEA
  • How do we use platforms in education? - Cadence Academic Insights
  • What role do applications play when learning microelectronics? - Cadence Academic Insights
  • Academic Network Video Challenge - Wayne State University
  • Academic Expert Insights - University of Mississippi
  • Academic Network Video Challenge - University of Mississippi
  • Academic Network Video Challenge - Shanghai Jiao Tong University
  • Cadence Cloud – The Future of Electronic Design
  • NI AXIEM 3D Planar EM Analysis in the Virtuoso Environment
  • Library Characterization in the Cloud
  • Statistical Characterization Approach Using Liberate MX with 40nm Low Voltage SRAM
  • Accurate and Faster SoC Signoff with Simulation-Based AMS Characterization
  • Faster Timing Characterization of Analog Macros
  • Characterizing 22FDX Library at GLOBALFOUNDRIES
  • Invecas Provides Electromigration-Based Maximum Capacitance Limits for Standard Cell Library Using Cadence Virtuoso Liberate Characterization Solution
  • Broadcom Uses Conformal ECO for High-Performance Designs
  • Cloud Whiteboard: Why Cloud for EDA
  • Cloud Whiteboard: The 4 Values of Cadence Cloud
  • Cloud Whiteboard: Cadence Cloud Offerings
  • Achieve greater throughput and productivity with Liberate Trio Characterization Suite
  • Overview of the Characterization Interface in Liberate Trio Characterization Suite
  • The People Behind Range Generated Field (RGF) - Specman 18.03
  • Automotive Ethernet Audio Demo: An Overview
  • Renesas R-Car Audio Channel Processing using Cadence Tensilica DSP
  • AI for Image Classification and Object Detection
  • Full HD 360° Surround View enabled by Tensilica Vision P6 DSP
  • AI for People Detection using Tensilica Vision P6 DSP
  • Mike Bartley, CEO of T&VS, on Portable Stimulus
  • Automotive Sensors: Concepts and Trends
  • Face Detection Demo using IVP/MIPI: An Overview
  • Car window anti-trap protection with the Cadence Zynq-7000 Virtual Platform
  • Cadence Automotive – from Concepts to Solutions
  • Breaking Down ADAS Sensor Fusion Platforms and Sensor Concepts
  • Designing High-Reliability Analog and Mixed-Signal ICs for Mission-Critical Applications
  • Hardent: Solution for Next-Generation Automotive Video Systems Enabled with Cadence IP
  • A Peek Inside Future Automotive Networks
  • Ethernet and Automotive Electronics
  • How to Meet the Quality, High Reliability, and Safety Requirements for Analog and Mixed-Signal ICs in Mission-Critical Applications
  • Easily Adopt Electro-thermal Simulation for Your High-Reliability Analog Designs
  • Automotive System Trends and the Integration of Analog Electronic Dependability
  • Analog Defect Simulation and Analysis for Complex Systems
  • Improvements in Modeling Device Aging Analysis: Extending Product Lifetime
  • How Electronics are Driving the Coolest Features in Today's Cars
  • Customizable Design Workflows & Toolbars
  • Return Path Checks
  • AMIQ Eclipse IDE for Perspec Portable Stimulus
  • CDNLive Silicon Valley 2018 Retrospective
  • Real-Time DFM Verification
  • Managed Circuit Reuse Placement and Replication
  • Allegro Schematic-Driven Placement
  • Customer IP Pilot Program Case Submission
  • Introduction to the NVDIMM Standard
  • The 3 Methods of Memory Controller Port Arbitration
  • Error Correction Code Implementations in Memory Controller Designs
  • Unpacking the DFI Low-Power Interface
  • Using DDR PHY Power Features to Reduce Power Dissipation
  • Can You Really Reduce DDR Power Dissipation by Reducing the Frequency?
  • Cadence Customer IP Protection Pilot
  • Dual Channel DIMMs for Server Applications
  • LPDDR4X DRAM: Performance and Power Efficiency Improvements Over LPDDR4
  • ST Optimizes Verification Across the Globe with the vManager Platform
  • MultiPhy Verifies Diverse Blocks Quickly with Specman + MATLAB Flow
  • Sigrity 技术小贴士:PCB设计师如何发现和解决电源完整性问题
  • Get Great Results with JasperGold CDC
  • The Benefits of Running the Xcelium Parallel Logic Simulator on Cavium’s Arm Based ThunderX2
  • Verification Challenges for SoCs Integrating CCIX Interface IP
  • Verification Challenges for SoCs Integrating PCI Express Subsystem IP
  • What to expect from TLM 2.0 Models for Memory Subsystems - Part 2
  • Latest News for Cadence Specman Elite - January 2018
  • Using the Cadence VirtualBridge Emulator with the Palladium Platform
  • Taking FPGA-Based Prototyping to the Next Level
  • What to Expect from TLM 2.0 Models for Memory Subsystems - Part 1
  • Seagate Uses Cadence Allegro and Sigrity PCB Tools to Develop Next-Generation Solid-State Drives
  • Find by Query
  • Command Window
  • DAC 2017 Report on Accellera Portable Stimulus Specification
  • Accellera Portable Stimulus Standard Introduction and Demo; Part 1 of 3 – Introduction
  • Accellera Portable Stimulus Standard Introduction and Demo; Part 3 of 3 - Conclusions
  • Accellera Portable Stimulus Standard Introduction and Demo; Part 2 of 3 – The Demo
  • The Simplest Neural Network Explanation Ever - Part 2
  • The Simplest Neural Network Explanation Ever - Part 1
  • Simplifying Fault Injection Simulations for Functional Safety Verification
  • A Practical Approach to Failure Modes, Effects, and Diagnostic Analysis (FMEDA)
  • Understanding ISO 26262 Implications for Automotive Design Teams
  • Sigrity Tech Tips: How to Simulate the Impact of ESD and Determine How Many TVS Diodes are Necessary
  • Xcelium Parallel Simulator on Cavium Arm-based ThunderX2
  • Cadence Interns Challenge You to Enter Our Video Contest
  • Automotive Memory Technologies and Trends: Technology Implications
  • CDNLive India – A Closer Look at State-of-the-Art Verification Techniques and Methodologies
  • What's Driving Automotive Memory Trends and Technologies Today?
  • Automotive Memory Trends and Technologies
  • Implementation Challenges of Embedded Automatic Speech Recognition Systems
  • Complexity Optimization of Convolutional Neural Networks: Results
  • Complexity Optimization of Convolutional Neural Networks: Overview
  • Benchmarking Deep Learning Platforms
  • Benchmarking Deep Learning Platforms: The Results
  • Fast & Efficient Memory Verification and Characterization for Advanced On Chip Variation
  • Improve Manufacturability and Reliability, and Reduce Costs with Design Data Analytics
  • Accelerate Embedded Neural Network Deployment and Performance with the Tensilica® Vision C5 DSP
  • Benefits of the Cadence Academic Network Include Training and Rapid Adoption Kits
  • Professors Describe Their Experiences with the Cadence Academic Network
  • Cadence Academic Network Members Meet at CDNLive
  • Looking Back on 10 Years of the Cadence Academic Network
  • CDNLive India 2017 In Review
  • Introducing Conformal Smart LEC
  • Cadence Legato Memory Solution Verification Overview
  • Introducing New Cadence Legato Memory Solution for Embedded Memory Design
  • Legato Memory Solution Characterization Overview
  • DRC Browser
  • Integrated Manufacturing Constraints
  • 3D Component Placement & Movement
  • Automatic Speech Recognition (ASR) and the Breakthrough in the Deployment of Mass Market Devices
  • Smart Speakers and Audio DSP Processing
  • Sigrity Tech Tips: How PCB Design Teams Can Perform IR Drop Analysis Early and Often
  • Introduction to Cadence USB Type-C VIP
  • What is Post-Package Repair for LPDDR4 Memories?
  • Understanding the In-line ECC Architecture Required by LPDDR4 Automotive Memories
  • A Standard Approach to Lane Margining as Defined by PCIe 4.0
  • Virtuoso ADE Explorer, Assembler, and Verifier- hear what people are saying about training
  • Allegro Design Entry HDL - Automatic Table of Contents Generator
  • Cadence at DAC 2017
  • Summary of Keynote by Davide Santo from NXP on Artificial Intelligence in Autonomous Driving
  • Cadence Enables NXP’s Next Generation Radar Sensor
  • Are You Maximizing Your Product Design? See How a Custom ASIC Can Help
  • A High Level Synthesis (HLS) Design Flow for Scaling to Multiple IP, SoC, and Process Targets
  • CDNLive EMEA 2017 Highlights
  • LG Electronics – New Methodology for Full-Chip RFIC Transceiver Co-Verification
  • Dream CHIP Technologies – Automotive ADAS Chip Architecture
  • STMicroelectronics – New flow for Analog Top Level Design
  • Microsemi Benefits by Using Pegasus Verification System on Advanced-Node Designs
  • Introducing New Integration with MathWorks
  • New JasperGold platform for Advanced RTL Signoff
  • Tensilica Vision C5: A Solution to Current Challenges and Evolving Trends in CNN
  • Convolutional Neural Network Challenges: Bandwidth Requirement
  • Tensilica Fusion G6 DSP Takes on Automotive ADAS Radar Applications
  • Convolutional Neural Network Challenges
  • CNN Challenges: Compute Requirement
  • Prof. Mladen Berekovic ( TU Braunschweig) – Cadence Academic Network
  • Prof. Holger Blume (Leibniz University of Hannover) – Cadence Academic Network
  • Prof. Ulrich Brüning (University of Heidelberg) – Cadence Academic Network
  • Pegasus Verification System – Let Your DRC Fly!
  • Von Neumann's 5 Bottlenecks and CCIX - Part 2
  • Introduction to Cadence Tensilica Vision C5 DSP
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Videos

Getting What You’re Entitled to at 10nm by Reducing Timing Pessimism

Ultra-Low Voltage SRAM: Addressing the Characterization Challenge

Accurate and Faster SoC Signoff with Simulation-Based AMS Characterization

Characterizing 22FDX Library at GLOBALFOUNDRIES

Invecas Provides Electromigration-Based Maximum Capacitance Limits for Standard Cell Library Using Cadence Virtuoso Liberate Characterization Solution

Statistical Characterization Approach Using Liberate MX with 40nm Low Voltage SRAM

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  • Cadence Collaborates with TSMC to Advance 5nm and 7nm+ Mobile and HPC Design Innovation 05/01/2018

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  • Cadence Tools and Flows Achieve Production-Ready Certification for TSMC’s 12FFC Process 09/11/2017

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