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4,038 Result(s) Found
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New Cadence UltraLink D2D PHY IP for Die-to-Die Connectivity Enables High-Performance Applications with Cost-Effective PackagingCadence announced the UltraLink D2D PHY IP, a high-performance, low-latency PHY for die-to-die connectivity targeted at the AI/ML, 5G, cloud computing and networking market segments.
13 Nov 2019
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Cadence Training MethodologyThis video provides a short general overview of the main Cadence Training options and learning methods including: online (ILS) courses, live (ILT) training, Training Byte videos, and learning maps per tech...
07 Nov 2019
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Cadence Presented with Four 2019 TSMC Partner of the Year AwardsCadence today announced that it has been presented with four TSMC Partner of the Year awards at the TSMC 2019 Open Innovation Platform® (OIP) Ecosystem Forum.
30 Oct 2019
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Master Learning MapsCadence Training Services learning maps provide a comprehensive visual overview of the learning
opportunities for Cadence customers … They provide recommended course flows as well …
676 KB
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2019-q4-training-customer-version-v1.pdfVirtuoso Layout Suite L - v6.1.7 //Virtuoso Layout Design Basics … Virtuoso Layout Suite XL - v6.1.5 //Virtuoso Connectivity-Driven Layout … Skill Programming for IC Layout Design - v6 …
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Cadence’s Nimish Modi to Present at 6th Annual Bernstein Technology Innovation Summit in New York, NYMr. Modi will participate in a fireside chat in addition to hosting individual meetings with investors at the 6th Annual Bernstein Technology Innovation Summit on November 6, 2019 at the Westin NY Times Sq...
25 Oct 2019
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Demonstrating electrical-thermal co-simulation with Celsius Thermal SolverThis demonstration of Celsius Thermal Solver shows how easy it is to perform highly-accurate electrical-thermal co-simulation. Steady-state and transient simulations are performed as well as heat transfer...
24 Oct 2019
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Announcing Celsius Thermal Solver, a New Approach to System-Level Thermal AnalysisIn this week's Whiteboard Wednesdays video, Ben Gu introduces Celsius™ Thermal Solver, a new tool employing finite element analysis (FEA) techniques for thermal analysis of electronic systems. Ben explain...
23 Oct 2019
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Rambus Verifies GDDR6 High-Speed Memory PHY IP Using Cadence VIPLearn how Cadence memory model Verification IP (VIP) helped Rambus with the verification of their memory subsystems allowing them to meet their time to revenue targets.
23 Oct 2019
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Cadence Announces First-to-Market NVMe 1.4 Verification IP for High-Performance ComputingCadence today announced the availability of the industry’s first VIP in support of the new NVM Express 1.4 (NVMe) protocol.
22 Oct 2019
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