Multi-Board Electrical and Thermal Co-simulation using Sigrity PowerDC

Learn how to do multiple package electrical and thermal co-simulation using the Sigrity™ PowerDC® workflow. This tool can not only analyze IR drop analysis concurrently with thermal analysis, but also analyze multi-board configurations, taking into consideration the IR drop impact on temperature and the temperature impact on material properties at the same time. The product generates an easy-to-read report and provides links showing exactly what parts of the design are out of spec, saving you the time of switching back and forth between different tools. For more information about Sigrity PowerDC technology, please visit

上次修改時間: September 25, 2018