Flip-Chip Co-Design Planning Using Cadence OrbitIO

Vincent Hool from Altera discussion on Package Co-Design Planning Using Cadence OrbitIO. Discussion on Challenges that package cost has become a significant portion of product component cost.  Critical to be able to predict package cost and performance at early stage with limited information.

上次修改時間: August 22, 2015

持續時間: 16 min