Join silver sponsor Cadence at the IEEE Wireless and Microwave Technology Conference (WAMICON). The conference addresses up-to-date multidisciplinary research needs and interdisciplinary aspects of wireless and RF technology. You’ll learn about the latest Cadence® products and capabilities for high-frequency, electromagnetic (EM) analysis, heterogeneous integration, and layout versus schematic (LVS) applications to address increasing design complexity.
Presentations by Cadence Experts
Challenges of Designing Heterogeneous (Multi-PDK) Packages
Date/Time: Tuesday, April 9, 3:30pm
Presenter: John Park, Cadence
Given the complexity of today’s chips, packages, and boards, ICs based on both silicon and non-silicon materials are now required to design optimal high-performance systems. As a result, engineers are integrating multiple heterogeneous technologies in a single product, which not only affects the performance and functionality of ICs, but also introduces a new set of challenges for semiconductor companies. Learn about a novel, front-to-back cross-platform solution that streamlines and automates the design of a package or module featuring off-chip devices and multiple ICs based on differing process design kits (PDKs).
Tutorial: Leveraging a System-Level Design Methodology to Achieve RFIC Performance Goals
Date/Time: Monday, April 8, 2:10pm
Presenters: John Dunn, National Instruments; Yuval Shay, Cadence
Learn about the system-level challenges of designing high-performance RFICs. We will outline the importance of IC design in context of the package/module/board and the importance of simulating layout-parasitic effects across the complete system. We will summarize the nuances between various EM solvers and the best practices for their application.
Panel Session: Emerging Simulation Technology (Sawgrass & Sea Oates). Can Today's EDA Tools Solve Tomorrow's Designer Challenges?
Date/Time: Tuesday, April 9, 22:20pm
Presenters: Matt Commens, ANSYS; John Dunn, AWR; John Park, Cadence; Shu Li, CST; Wojciech Mudyna, Ericsson; Todd Cutler, Keysight Technologies; Brian Rautio, Sonnet
Interactive Forum: Enabling Chip, Package and PCB System Co-Design and Analysis in a Heterogeneous Integration Environment—An EDA Approach
Date/Time: Tuesday, April 9, 3:00 - 5:00pm
Presenters: Ritabrata Bhattacharya, Ashish Gupta, Vikas Aggarwal, Taranjit Kukal, Jagdish Lohani, and Harmohan Singh, Cadence