Flip-Chip Co-Design Planning Using Cadence OrbitIO
Vincent Hool from Altera discussion on Package Co-Design Planning Using Cadence OrbitIO. Discussion on Challenges that package cost has become a significant portion of product component cost. Critical to be able to predict package cost and performance at early stage with limited information.
上次修改时间: August 22, 2015
持续时间: 16 min