Cadence® custom, analog, and RF design solutions can help you save time by automating many routine tasks, from block-level and mixed-signal simulation to routing and library characterization.
Driving efficiency and accuracy in advanced packaging, system planning, and multi-fabric interoperability, Cadence® package implementation products deliver the automation and accuracy.
Cadence® PCB design solutions enable shorter, more predictable design cycles with greater integration of component design and system-level simulation for a constraint-driven flow.
The Cadence Academic Network helps build strong relationships between academia and industry, and promotes the proliferation of leading-edge technologies and methodologies at universities renowned for their engineering and design excellence.
A huge knowledge exchange platform for academia to network with industry. We are looking for academic speakers to talk about their research to the industry attendees at the Academic Track at CDNLive EMEA and Silicon Valley.
Join the 250+ qualified Americas member universities who have already incorporated Cadence EDA software into their classrooms and academic research projects.
In EMEA, Cadence works with EUROPRACTICE to ensure cost-effective availability of our extensive electronic design automation (EDA) tools for non-commercial activities.
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Instructor-led training [ILT] are live classes that are offered in our state-of-the-art classrooms at our worldwide training centers, at your site, or as a Virtual classroom.
Instructor-led training [ILT] are live classes that are offered in our state-of-the-art classrooms at our worldwide training centers, at your site, or as a Virtual classroom.
Instructor-led training [ILT] are live classes that are offered in our state-of-the-art classrooms at our worldwide training centers, at your site, or as a Virtual classroom.
Instructor-led training [ILT] are live classes that are offered in our state-of-the-art classrooms at our worldwide training centers, at your site, or as a Virtual classroom.
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Operational efficiency and user flexibility with highly scalable systems
Advanced compiler, predictable runtime, and debug capabilities
Supports a full front-to-back physical implementation flow
With true integration with IC development in a physical co-design environment, Cadence® Allegro® Package Designer has complete package implementation capabilities to help you make strategic tradeoffs earlier and with greater confidence.
Cadence Allegro Package Designer
Allegro Package Designer enables constraint-driven substrate interconnect design, extraction, modeling, and signal integrity analysis. The final design output provides automatic system-level handoffs for PCB design in the form of a PCB footprint and schematic symbol.
Features
Supports a full front-to-back physical implementation flow for IC package design
Determines the best package and substrate options early in the IC design cycle
Provides comprehensive design rule and electrical constraint-driven layout
Incorporates design for manufacturing (DFM) methodologies
Improves design flow with intrinsic support for all industry standards
Models entire design in 3D with the optional Cadence 3D Design Viewer
Cadence is committed to keeping design teams highly productive. A range of support offerings and processes helps Cadence users focus on reducing time-to-market and achieving silicon success. Overview
Get the most out of your investment in Cadence technologies through a wide range of training offerings. We offer instructor-led classes at our training centers or at your site. We also offer self-paced online courses. Overview