Allegro Package Designer

With true integration with IC development in a physical co-design environment, Cadence^® Allegro^® Package Designer has complete package implementation capabilities to help you make strategic tradeoffs earlier and with greater confidence.

Allegro Package Designer enables constraint-driven substrate interconnect design, extraction, modeling, and signal integrity analysis. The final design output provides automatic system-level handoffs for PCB design in the form of a PCB footprint and schematic symbol.

Features

• Supports a full front-to-back physical implementation flow for IC package design
• Determines the best package and substrate options early in the IC design cycle
• Provides comprehensive design rule and electrical constraint-driven layout
• Incorporates design for manufacturing (DFM) methodologies 
• Improves design flow with intrinsic support for all industry standards 
• Models entire design in 3D with the optional Cadence 3D Design Viewer