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Digital Design and Signoff
Cadence® digital design and signoff solutions provide a fast path to design closure and better predictability, helping you meet your power, performance, and area (PPA) targets.
Custom IC / Analog / RF Design
Cadence® custom, analog, and RF design solutions can help you save time by automating many routine tasks, from block-level and mixed-signal simulation to routing and library characterization.
System Design and Verification
Cadence® system design and verification solutions, integrated under our Verification Suite, provide the simulation, acceleration, emulation, and management capabilities.
An open IP platform for you to customize your app-driven SoC design.
IC Package Design and Analysis
Driving efficiency and accuracy in advanced packaging, system planning, and multi-fabric interoperability, Cadence® package implementation products deliver the automation and accuracy.
Cadence® system analysis solutions provide highly accurate electromagnetic extraction and simulation analysis to ensure your system works under wide-ranging operating conditions.
PCB Design and Analysis
Cadence® PCB design solutions enable shorter, more predictable design cycles with greater integration of component design and system-level simulation for a constraint-driven flow.
AI / Machine Learning
AI IP Portfolio
CULTURE AND CAREERS
Vahid Ordoubadian, Director - Mobile Platform Group at Broadcom, describes the use of Cadence Palladium XP to validate a new architecture for a complex mobile SoC developed for mobile platform devices.
마지막 수정 날짜: June 15, 2016
지속 시간: 2 min