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Digital Design and Signoff
Cadence® digital design and signoff solutions provide a fast path to design closure and better predictability, helping you meet your power, performance, and area (PPA) targets.
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Cadence® custom, analog, and RF design solutions can help you save time by automating many routine tasks, from block-level and mixed-signal simulation to routing and library characterization.
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Offering a full verification flow to our customers and partners that delivers the highest verification throughput in the industry
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An open IP platform for you to customize your app-driven SoC design.
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IC Package Design and Analysis
Driving efficiency and accuracy in advanced packaging, system planning, and multi-fabric interoperability, Cadence® package implementation products deliver the automation and accuracy.
Multiphysics System Analysis
Cadence® system analysis solutions provide highly accurate electromagnetic extraction and simulation analysis to ensure your system works under wide-ranging operating conditions.
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PCB Design and Analysis
Cadence® PCB design solutions enable shorter, more predictable design cycles with greater integration of component design and system-level simulation for a constraint-driven flow.
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Accurate Low Power verification on a Complex Low Power Design using CLP by Qualcomm
마지막 수정 날짜: May 28, 2016