Delivering Accurate SI/PI Analysis with a Comprehensive Solution for Meeting Compressed Schedules of High-Speed Electronic Products

The increased complexity of electronic product design and the growing demand for denser, smaller products can be challenging and delay time to market. To address these requirements, design engineers need advanced, power-aware signal and power integrity (SI/PI) technologies that are integral to your design platform and can be used seamlessly throughout the design process.

Cadence Sigrity technology works with all major PCB and IC package design platforms, including Cadence’s Allegro PCB, Allegro Package, and Integrity 3D-IC design platforms. It provides high-speed system designers with comprehensive, end-to-end SI/PI analysis, in-design interconnect modeling, and power delivery network (PDN) analysis for PCB and IC package designs. Working within a unified, integrated, and collaborative design environment, design engineers are more productive and able to meet compressed schedules and bring products to market on time and within budget.

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Deliver 10X Design Productivity with Cadence PCB and IC Package Analysis Tools to Meet Your Time-to-Market Goals

Minimize Design Respins

Work with the most efficient and accurate design and analysis flows to identify SI/PI issues early and ensure that your products meet cost, performance, and reliability goals and achieve time-to-market requirements

Signoff Accuracy

Deliver products on time and within budget with a 10X performance increase while maintaining the trusted accuracy for which Sigrity tools are known. Sigrity tools work with the Cadence flagship Clarity 3D Solver for signoff accuracy on advanced PCB and IC package designs.

Integration Increases Efficiency

Integrating Cadence PCB and IC design tools with analysis tools enables designers to stay within the Cadence tool ecosystem, boosting efficiency and avoiding manual re-entry mistakes. Sigrity tools work seamlessly with Cadence's Allegro PCB Designer, Allegro Packaging Designer Plus, and Integrity 3D-IC Platform.

Technologies to Meet Your Design Requirements

Signal Integrity

Power and Thermal Integrity

Interconnect Extraction

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