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- Innovus Implementation System との統合
- Virtuoso プラットフォームとの統合
The Cadence® Tempus™ Timing Signoff Solution is the fastest static timing analysis (STA) tool in the industry today with unique distributed processing and cloud capabilities enabling hundreds of CPUs to quickly complete even the largest designs.
With full foundry certification and a comprehensive set of advanced capabilities, the cloud-ready Tempus solution is delivering SPICE-accurate results to hundreds of customers across a broad range of design types: from the largest 7nm designs, to high-volume mobile designs, and mixed-signal chips on mature processes.
The Tempus solution is a modern tool designed to tackle the most advanced timing requirements including full signal integrity (SI) analysis, statistical variation (SOCV), multi-mode and multi-corner analysis, static- and dynamic-power, and glitch.
More than just an analysis tool, the Tempus solution is also deeply integrated with Cadence’s Innovus™ Implementation System and Voltus™ IC Power Solution.
Distributed Processing and Multi-Threading
By tightly coupling design implementation with timing signoff, the Tempus solution speeds timing convergence throughout the design flow and greatly reduces the time to design closure.
Every Tempus timing job is naturally multi-threaded for faster execution on 16 CPUs and more. But the Tempus solution also has the unique capability to distribute an STA job across multiple, separate machines to deliver significantly faster runtimes and less memory per machine. Distributed STA is essential to analyze today’s extremely large designs in acceptable time and for execution in the cloud.
Concurrent Multi-Mode Multi-Corner
The Tempus solution can automatically distribute each mode/corner combination (or “view”) across multiple machines where each machine times the full design for a single view.
Even more powerful is the Tempus solution’s unique concurrent multi-mode multi-corner (CMMMC) capability, which processes multiple views concurrently in a single STA job. CMMMC exploits the commonalities between views to deliver a 5X faster runtime without any loss in accuracy.
Every Tempus license includes a complete SI analysis engine that calculates all relevant timing windows.
The Tempus solution will report the dynamic and static power used by a circuit. This calculation can be done with user-supplied activity files or vectorless activity profiles.
The Tempus solution offers statistical OCV to reduce unwarranted pessimism caused by on-chip variation. The Tempus solution supports both the Cadence SOCV library format and the Liberty Variation Format (LVF) for statistical library characterization. The Tempus solution can also accurately model and calculate the ultra-low voltage effects at 7nm and below that cause the statistical variation to be non-symmetrically skewed about the mean (third moment).
Hierarchical Models and SmartScope
The Tempus solution has dramatically improved runtime and capacity so almost all design sizes can now be analyzed flat. For hierarchical design, the Tempus solution offers a range of hierarchical modeling options including traditional static models like ETM and ILM. To facilitate signoff-accurate ECO changes, the Tempus solution has introduced SmartScope™ models for blocks and top-level. Scope models dynamically abstract only those portions of the design that a user wants to analyze and do it in a full chip-level context, including SI and all physical effects.
Tempus ECO with Innovus Implementation
The Tempus solution is integrated with the Innovus Implementation System where it drives signoff-accurate and physically aware timing ECO that significantly shortens time to market, reduces power consumption, and eliminates wasteful timing margin.
The Tempus ECO fixes setup, hold, glitch, and design rule violations. It can also optimize the design for dynamic power, static power, or total power.
For more than just logical changes, the Tempus ECO is physically aware and can see physical congestion and understand all placement rules so that cells are always legally placed. It is also routing aware so that buffers are inserted directly on an existing route for optimal timing convergence
Timing-Aware IR Drop with Voltus Power
The close integration between the Tempus, Innovus, and Voltus solutions allows voltage drop analysis and IR drop issues to be automatically fixed by downsizing aggressors that cause IR drop on critical paths, while preserving timing. It also enables clock jitter analysis with IR drop.
Integration with Virtuoso Platform
The Tempus solution is available within Cadence’s Virtuoso® custom design platform through seamless data integration with its Open Access database as part of the Virtuoso Digital Signoff package for small embedded digital logic in mixed-signal designs. It includes cross-probing of timing paths between a timing report and the Virtuoso layout editor, automatic abstraction of digital components, parasitic extraction, and SDC integration.
Common User Interface
A new common user interface is shared with the Innovus, Voltus, and Tempus solutions to streamline flow development and simplify user trainings across a complete Cadence digital full flow.
The Tempus Timing Signoff Solution has been our timing tool for all of our SoCs that enable smart TV, set-top boxes and media connectivity. Its runtime performance, coupled with integration within the Cadence Innovus™ Implementation System, has allowed us to significantly reduce the time we spend in timing signoff.
Jacques Martinella, Vice President, Engineering, Sigma Designs
The size and complexity characteristics of our latest design required a timing solution that could handle more than 50M cells quickly and efficiently. We determined that the Tempus Timing Signoff Solution was the right timing platform to address our signoff analysis and closure needs.
Toru Hiyama, General Manager for Platform Advanced Engineering Operation, Information and Telecommunication System Company, Hitachi, Ltd.
The Tempus Timing Signoff Solution has enabled us to complete several successful tapeouts of our datacenter interconnect solutions. We were able to effectively use the tool for distributed multi-mode, multi-corner (MMMC) timing analysis and closure to get our products out the door and into the fab.
Lawrence Tse, Vice President of Engineering, Inphi
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