Perform all of your electrical verification tasks in an integrated, easy-to-use environment, spanning front-end to back-end design handoff to signoff-driven implementation to final signoff convergence. With high precision, our technologies analyze timing with variation and noise, power consumption, IR drop, electromigration, and thermal characteristics.
Uses hierarchical- and multi-processing to perform fast, efficient identification and correction of design rule errors.
Optimizes design performance through model-based intelligent metal fill and hotspot detection and correction.
Extracts device and interconnect electrical behavior from contours. Detects and repairs timing and leakage hotspots due to systematic variations.
Detects and corrects lithography hotspots. Uses a model-based technology to predict silicon contours quickly and accurately. Improves parametric yield and chip performance.
Enhances the design-to-manufacturing flow, reducing mask-making cycle times and cost while accelerating time to market.
Provides the most effective layout analysis and optimization solution to maximize manufacturability from cell to full-reticle layout.
Delivers up to 10X improved performance across hundreds of CPUs for full-chip DRC signoff using foundry-certified rule decks to achieve 100 percent accurate results.
Meet the stringent accuracy, short turnaround time, and flexible ease-of-use requirements for all process technologies.
Enables in-design and back-end physical verification, constraint validation, and reliability checking.
The industry’s fastest, most accurate 3D full-chip parasitic extractor, delivering in-design and signoff extraction. Performs design rule checking and layout vs. schematic verification to deliver high-yielding custom IP for SoC designs.
An easy-to-use, high-performance, and standalone chip-finishing system that supports multiple formats of design, layout, and manufacturing data.
A complete standalone tool that delivers silicon-accurate timing signoff and signal integrity analysis that ensures operational chips after tapeout.
Delivers 10X faster power integrity analysis and signoff compared to competitive solutions, while maintaining SPICE-level accuracy and support for high-capacity designs (up to one billion instances).
Shrinks timing signoff closure and analysis for faster tapeout while producing designs with less pessimism, area, and power consumption. Enables SoC developers to speed timing closure and move chip designs to fabrication quickly.