Meet Your Power, Performance, Area, and Schedule Targets
Designs are getting bigger and more complex, making power and area usage critical components. It’s a tall engineering order to meet, made tougher with schedules that continue to shrink. How can you achieve your quality objectives without missing project milestones?
From synthesis through implementation through signoff, Cadence’s full-flow digital design platform provides a fast path to design closure and better predictability. Where traditional tools fall short, our platform has been developed to help you meet power, performance, and area (PPA) targets and deliver your products on time.
What’s more, when you tap into the integrated tool suite, you’ll be able to achieve much more powerful results.
- Up to 20% better PPA
- Up to 10X faster turnaround time and capacity gain
- Full-flow timing and power correlation for better design convergence
- Early signoff optimization for reduced iterations
- Massively parallel architecture
- Unified formal verification, synthesis, and test
- Unified placement, optimization, clock tree synthesis, and global router
- Unified timing/power/extraction
- Unified physical verification, metal-fill, and design for manufacturing (DFM) capabiliies
Additionally, simplified command naming, a common UI, and aligned implementation methods across our digital and signoff tools facilitate collaboration and knowledge sharing for better productivity across your entire design team.
Learn more about our digital design flow on these pages. And for more details about how our tools can enhance your design process, talk to your Cadence® sales representative.
We're always up against tight deadlines to deliver innovative and reliable designs to our automotive customers. While looking at the digital offerings from Cadence, we've seen an opportunity to improve our quality of results while significantly reducing cycle time.
Dragomir Nikolic, worldwide CAD director at Cypress.
Minimizing the cost of test is crucial in high-volume, price-sensitive markets like embedded processing. The Modus Test Solution is showing a 1.7X reduction in digital test time on one of our largest and most complex embedded processor chips
Roger Peters, MCU Silicon Development, Texas Instruments
The size and complexity characteristics of our latest design required a timing solution that could handle more than 50M cells quickly and efficiently. We determined that the Tempus Timing Signoff Solution was the right timing platform to address our signoff analysis and closure needs
Toru Hiyama, General Manager for Platform Advanced Engineering Operation, Information and Telecommunication System Company, Hitachi, Ltd.