SAN JOSE, Calif., 20 May 2014
Building on its leadership position for co-design in the implementation stage, Cadence OrbitIO technology is used earlier in the design cycle to provide rapid interconnect planning of high-performance interfaces across multiple fabrics. As part of an overall co-design solution, Cadence OrbitIO technology provides seamless integration with Cadence SiP Layout and the Cadence Encounter® digital implementation platform. This integrated solution allows design teams to clearly communicate design intent throughout the flow, resulting in better decision-making, fewer iterations and shorter cycle-times. It can enable fabless semiconductor or systems companies to evaluate package route feasibility, and allows them to communicate a route plan to their package design resources, whether it is to an internal group or to an outsourced assembly and test (OSAT) provider.
"The Cadence OrbitIO global view of system connectivity helps Faraday reduce the time required to converge on the optimal die bump to package ball pad assignment," said Dr. Wang-Jin Chen, senior technologist of Faraday. "The combination of connectivity optimization and route feasibility functions helped us produce a route plan resulting in two fewer package layers with all DDR signals implemented on a single package layer."
To learn more about OrbitIO technology, please visit: www.cadence.com/products/sigrity/orbitio/pages/default.aspx
Cadence (NASDAQ: CDNS) enables global electronic design innovation and plays an essential role in the creation of today's integrated circuits and electronics. Customers use Cadence software, hardware, IP, and services to design and verify advanced semiconductors, consumer electronics, networking and telecommunications equipment, and computer systems. The company is headquartered in San Jose, Calif., with sales offices, design centers, and research facilities around the world to serve the global electronics industry. More information about the company, its products, and services is available here.
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