Drawing over 1000 attendees, the TSMC Open Innovation Platform® (OIP) Ecosystem Forum brings together TSMC’s design ecosystem partners to share real-world solutions to customer design challenges and promote best practices.
Cadence and our customers will be presenting papers on how to efficiently achieve 3GHz performance in 7nm silicon, mainstream applications of photonics design, cloud-based library characterization, and more. In our booth, we will showcase innovative solutions for Intelligent System Design:
- Comprehensive, electro-optical silicon photonics design flow
- Certified digital and custom flows for 7nm, 7nm+, 6nm, 5nm, and 5nm+
- Cadence® CloudBurst™ Platform for fast, painless hybrid cloud implementation
- IP portfolios for automotive, mobile, and HPC design
- 3D packaging solutions for InFO, CoWoS, and WoW
As a long-time partner and close TSMC collaborator, Cadence is pleased to be a Platinum sponsor of the event.