Smart products are becoming highly integrated with multiple components, often all on the same substrate or advanced package. These products utilize RF, heterogeneous integration approaches, cloud connectivity, and advanced-node SoCs. System analysis is needed to tie all of these into a single, integrated platform across chip, package, and board. Especially in automotive markets, there are complex requirements for reliability, thermal performance, low power, and functional safety that must be addressed, as well.
Join us for a Custom IC Technology on Tour event near you. Made possible through new features and capabilities in our latest Virtuoso® and Spectre® product releases, these technical seminars describe advanced methodologies that offer greater productivity, better design robustness, and more ability to innovate.
Through techtorials and demonstrations, you will learn about:
- Designing high-reliability analog and mixed-signal ICs for mission-critical applications
- System analysis across chip, package, and board
- New technologies in physical verification and extraction
- Advanced layout methodologies
This seminar is free and open to analog, RF, and mixed-signal IC designers, CAD engineers, and design managers.
Space is limited. Register Now!