Visit Cadence at the Semi-Therm Annual Symposium and Exhibit in booth 306 to learn about reliable power delivery using Cadence® Sigrity™ PowerDC™ technology with electrical and thermal co-simulation.
Attend Huawei and Cadence’s joint paper at the Semi-Therm Symposium Technical Session
(requires technical program pass):
Tuesday March 20, 2018, 9:40am – 10:00am
Session: 2.5D and 3D Electronics
Application of Thermal Network Approach to Electrical-Thermal Co-Simulation and Chip-Package-Board Extraction
Fengyun Zhao, Yuanbin Cai, and Zipeng Luo of Huawei Technologies Co. Ltd, and An-Yu Kuo, Xin Ai, C.T. Kao, and Zhemin Zhuang of Cadence