Join Cadence in Booth 42 at the International Microelectronics Assembly and Packaging Society (IMAPS)’s 15th annual Device Packaging Conference. The show is a major forum for the exchange of knowledge and provides numerous technical, social, and networking opportunities for meeting leading experts in these fields.
In the booth, we will showcase:
- Cadence® advanced IC packaging and cross-domain co-design automation, supporting the next generation of heterogeneously integrated 2.5D/3D designs
- New unified solution for RF module design
- Foundry and OSAT reference flows supporting the latest advanced IC packaging technologies
- Advanced power integrity (PI) and power-aware signal integrity (SI) Sigrity™ tools for increasing IC speeds and data transmission rates, decreases in power-supply voltages, and more complex package designs with stacked die, higher pin counts, and greater electrical performance constraints
Join Our Presentation
Wednesday, March 6, 2:00pm - 2:30pm
The Bifurcation of Advanced IC Packaging
John Park, Cadence Product Management Director
Hear an overview of the latest trends in multi-die packaging and how these changes will impact the design tools you are currently using.