Home > Tools > Sigrity Technologies > Sigrity XtractIM

Email

* Required Fields

Recipients email * (separate multiple addresses with commas)

Your name *

Your email *

Message *

Contact Us

* Required Fields
First Name *

Last Name *

Email *

Company / Institution *

Company Location *

Comments: *

Sigrity XtractIM  


Build models more than 10x faster

Fast IC package RLC extraction and assessment, unparalleled accuracy with full-wave analysis, and an option to generate broadband-optimized models.

Cadence Sigrity XtractIM Datasheet »
Sigrity XtractIM technology is an integrated package extraction solution for creating models that play a vital role in circuit- and system-level power and signal integrity analysis. XtractIM helps IC package design teams build RLC IBIS or SPICE models more than 10x faster than with alternate approaches.

XtractIM offers unparalleled accuracy with full-wave analysis and an available broadband option. Broadband-optimized multi-stage models provide user-verifiable accuracy. The tool’s unique assessment capabilities enable rapid identification of potential package performance issues. It supports single-die, multi-die, and SiP designs with extraction of the full package or selected nets. Designs can incorporate flip-chip as well as wirebond attachment.

Product Image

Features
  • Develops IC package design guidelines and models for use in system-level analysis
  • Generates IBIS package RLGC models with coupling
  • Exports SPICE RLGC single-stage models (including Pi or T circuits)
  • Creates broadband multi-stage‒optimized models
  • Visualizes potential package performance issues
  • Handles single- and multi-die designs including flip-chip and wirebond interconnect (both BGA and leadframe)
  • Extracts models of entire packages or selected nets
  • Supports system-level SI/PI analysis by adding drivers, receivers, and interconnects
Benefits
  • Easy to use and suitable for occasional users and layout designers alike
  • RLC extraction 10x faster than with any alternate tool
  • Highest accuracy with included full-wave solver
  • Broadest support of IC package and SiP implementations
  • First-ever package assessment visualization to rapidly pinpoint potential risks and avoid the needle-in-haystack issue
  • Flexible pin grouping options to enable the user-preferred model resolution
  • Comprehensive extraction of the entire design, including embedded passive components
  • Accurately reflect coupling between signal, power, and ground nets for devices with varying topologies (asymmetric Pi or T circuits)
  • Complete broadband solution with user-verifiable full-wave accuracy
  • Compact broadband models (2% S-parameter model size) with time domain circuit simulation compatibility
  • Flexible 2D/3D visualization, plotting, and spreadsheet data management
  • Optimized to read physical design data from Cadence® package design tools
  • Readily used with Mentor or Zuken package databases