Home > Tools > Sigrity Technologies > Sigrity PowerSI

Email

* Required Fields

Recipients email * (separate multiple addresses with commas)

Your name *

Your email *

Message *

Contact Us

* Required Fields
First Name *

Last Name *

Email *

Company / Institution *

Company Location *

Comments: *

Sigrity PowerSI 


Analyze electrical in detail for entire IC packages and PCBs

Fast and accurate signal/power integrity and design-stage EMI analysis, S-parameter model extraction, and frequency domain simulation.

Cadence Sigrity PowerSI Datasheet »
Product ImageSigrity PowerSI® technology provides fast and accurate full-wave electrical analysis of IC packages and PCBs to overcome increasingly challenging and interrelated power, signal, and electromagnetic interference (EMI) issues. Using PowerSI, you can readily perform a broad range of studies to identify trace and via coupling issues, power/ground fluctuations caused by simultaneously switching outputs, and design regions that are under or over voltage targets.

PowerSI also supports extraction of frequency-dependent network parameter models and enables visualization of complex spatial relationships. It can be readily incorporated into popular PCB, IC package, and system-in-package (SiP) design flows.

Features
  • Establishes power delivery system (PDS) guidelines for IC packages and boards
  • Evaluates electromagnetic coupling between geometries to enable better component, via, and decap placement
  • Extracts frequency-dependent S, Z, and Y parameters for package and board modeling for subsequent time domain SSN simulation
  • Anticipates energy leaks with near-field ration display
  • Assesses decoupling capacitor strategies and verifies placement effects
  • Performs what-if studies on potential design scenarios and stack-up options
  • Enables broadband modeling including accurate DC performance characterization (patent pending)
  • Integrates seamlessly with 3D solutions for IC packages and boards
Benefits
  • Proven through use on thousands of production designs
  • Highly accurate, even for designs with unusual plane structures
  • Fast throughput with multi-processor support and options for distributed computing
  • Ability to support large designs that include both package and board structures
  • Flexible visualization options including 3D fly-through
  • Extensive user control of port selection and abstraction management
  • Strong HSPICE flow support
  • Optimized for flows with Cadence® SiP Layout, Allegro® Package Designer, and Allegro PCB Designer
  • Readily used in Mentor, Zuken, and Altium flows, accepting a mix of CAD databases where needed for multi-structure design support