Cadence® OrbitIO™ system planner helps design teams quickly assess and plan connectivity between the die and package in context of the full system—all within a single-canvas multi-fabric environment. It’s ideal for system architects or anyone responsible for developing the die-to-package interface and coming up with the optimal combination of bump/ball configurations and net assignments. It helps semiconductor companies evaluate route feasibility of the package, as well as develop and communicate a route plan to their package design resources.
Unlike an iterative spreadsheet-based approach, OrbitIO system planner enables users to make or refine decisions, then immediately visualize and evaluate the impact on adjacent fabrics all within a single tool. It significantly reduces iterations between silicon and package design teams as they try to converge on a solution. OrbitIO system planner enables users to better qualify the design definition prior to implementation, leading to more predictable system cost, performance, and product delivery.
- Parametric definition and editing of bump and ball pad patterns
- Automatic ratio-driven signal, power, and ground pin allocation
- Pin-based floor planning of critical nets and interfaces
- Automatic net mapping and propagation across fabrics, including differential pairs
- Route bundles and flow planning for detailed connection assignment
- Rapid route feasibility analysis to evaluate escape routes of bumps and balls
- Direct integration with Cadence SIP Layout XL (SIP-XL) to exchange planning data and accelerate implementation
- Anticipate and avoid downstream issue with early design planning
- Significantly shorten the time needed to converge on the optimal die/package interface
- Utilize key PCB components to influence package ball pad assignments
- Better predict cost and performance using well-qualified design definitions
- Quickly generate design abstractions in response to marketing feasibility studies
- Clearly communicate design intent and route plan to external design resources
- Design tool compatibility with outsourced assembly and test (OSAT) providers