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OrbitIO System Planner 


Concurrent die/package planning and route optimization

Efficient planning and assessment of connectivity and route feasibility within a single canvas environment.

Cadence OrbitIO System Planner Datasheet »
Product Image Cadence® OrbitIO™ system planner helps design teams quickly assess and plan connectivity between the die and package in context of the full system—all within a single-canvas multi-fabric environment. It’s ideal for system architects or anyone responsible for developing the die-to-package interface and coming up with the optimal combination of bump/ball configurations and net assignments. It helps semiconductor companies evaluate route feasibility of the package, as well as develop and communicate a route plan to their package design resources.

Unlike an iterative spreadsheet-based approach, OrbitIO system planner enables users to make or refine decisions, then immediately visualize and evaluate the impact on adjacent fabrics all within a single tool. It significantly reduces iterations between silicon and package design teams as they try to converge on a solution. OrbitIO system planner enables users to better qualify the design definition prior to implementation, leading to more predictable system cost, performance, and product delivery.

Features
  • Parametric definition and editing of bump and ball pad patterns
  • Automatic ratio-driven signal, power, and ground pin allocation
  • Pin-based floor planning of critical nets and interfaces
  • Automatic net mapping and propagation across fabrics, including differential pairs
  • Route bundles and flow planning for detailed connection assignment
  • Rapid route feasibility analysis to evaluate escape routes of bumps and balls
  • Direct integration with Cadence SIP Layout XL (SIP-XL) to exchange planning data and accelerate implementation
Benefits
  • Anticipate and avoid downstream issue with early design planning
  • Significantly shorten the time needed to converge on the optimal die/package interface
  • Utilize key PCB components to influence package ball pad assignments
  • Better predict cost and performance using well-qualified design definitions
  • Quickly generate design abstractions in response to marketing feasibility studies
  • Clearly communicate design intent and route plan to external design resources
  • Design tool compatibility with outsourced assembly and test (OSAT) providers